At electronica 2026, Electronic Specifier will once again be celebrating the very best of the industry with its Electronics Excellence Awards.
Leading companies and teams have been approached to submit their most innovative and show-stopping products. All entries have been independently scored after being discussed in-depth by our panel.
The judging panel, selected by Editors at Electronic Specifier, featured specially curated industry thought-leaders and electronics specialists.
Each entry has been placed in one of the following categories:
- Power Product
- Test & Measurement Product
- Software Product
- Semiconductor Product
All entrants will be invited to a short presentation at electronica where the winner from each category will be announced. This will take place on the 10th November at 12.30pm on the Hall C6 Future Tech Stage.
Power Product
Battery Passport Secure Cell-to-Cloud Demonstrator
Developed by Dukosi in collaboration with STMicroelectronics, this proof-of-concept combines the Dukosi Cell Monitoring System (DKCMS) with C-SynQ near-field communications protocol and ST’s MCU and STSAFE A120 Secure Element and demonstrates the potential of authenticated lifetime cell-to-Cloud data and tamper-proof Battery Passport in building supply chain trust, improving repairability, and extending battery lifecycle through safer reuse and recycling.
2200V PowiGaN technology
Power Integrations has demonstrated the world’s first 2200V GaN technology for next-era high-voltage power systems. The company’s PowiGaN gallium-nitride (GaN) technology far exceeds the voltage capabilities of all other commercially available GaN technologies, enabling higher power density, greater efficiency, and safer and simpler system architectures.
Recom Power
Details to be announced shortly.
onsemi
Details to be announced shortly.
Semiconductors
Reworkable Die-to-Wafer Hybrid Bonding
Adeia’s reworkable die-to-wafer (D2W) hybrid bonding processes make it possible to remove and replace defective die after hybrid bonding, addressing one of the technology’s most critical pain points.
G32F463 Series High-Performance Microcontrollers
The G32F463 is a high-performance 32-bit microcontroller for embedded control and intelligent devices. It combines an Arm Cortex-M4F core running at up to 192MHz with a single-precision FPU, 256KB Flash, 128KB system SRAM, and 4KB backup SRAM. Integrated USB OTG HS, up to two QSPI interfaces, three 12-bit ADCs, a 12- bit DAC, and advanced timers support high-speed peripheral connections, signal acquisition, and responsive control.
nRF54LC10A ultra-low-power wireless SoC
The nRF54LC10A is an entry-level, ultra-low-power wireless SoC in the nRF54L Series. It combines a right-sized MCU with a multiprotocol radio supporting Bluetooth LE with Channel Sounding, Thread, Zigbee, Matter, simple sensors, and 2.4GHz proprietary protocols at up to 4Mbps, available in packages including 1.9 × 2.3mm CSP, the smallest package option in the series.
i.MX 93W Applications Processor
The NXP i.MX 93W applications processor brings Edge AI compute and secure wireless connectivity together in a single, highly integrated package. Combining a dual-core Arm Cortex-A55 processor, dedicated AI neural processing unit (NPU), EdgeLock Secure Enclave, and integrated tri-radio wireless connectivity, the i.MX 93W enables intelligent, connected devices to run AI locally while communicating securely.
Plural ADC Family
Silanna’s Plural is a family of factory-configurable high-performance ADCs. Unlike traditional ADCs, performance characteristics are set in firmware, not silicon. This enables larger fab runs, and quantities to be held in stock without the risks of traditional manufacturing models.
Silanna
Details to be announced shortly.
Titan resonators
SiTime’s Titan resonators deliver precision timing in an ultra-compact form factor, enabling smaller, lower-power, and more robust electronic systems. Titan combines ultra-small size, low power consumption, and flexible integration options, helping semiconductor manufacturers and OEMs create more capable connected devices while reclaiming valuable design space.
Software
NI Nigel AI
NI Nigel AI is purpose-built AI for test and measurement. The 2026 release marks its evolution from AI advisor to AI author, enabling engineers to generate LabVIEW code and TestStand sequences from natural-language requests directly within NI software. By combining test-and-measurement expertise with engineering workflow context, Nigel helps teams move faster from requirements to validated implementations while maintaining engineering oversight and control.
Northern.tech
Details to be announced shortly.
Test & Measurement
DCIR and EIS Evaluation Kit (EVK)
Dukosi brings lab-grade accuracy direct current internal resistance (DCIR) and electrochemical impedance spectroscopy (EIS) measurements to every battery cell through the Dukosi DCIR and EIS EVK (Evaluation Kit). Its innovative Smart Cell architecture generates the measurement stimulus, captures the response, and processes results all directly on-cell, eliminating the influence of pack wiring and interconnects.
The Rigol RSA800
The RIGOL RSA800 Series helps engineers find intermittent radio-frequency problems and characterise signals, filters, and cables, both at the bench and where equipment is installed. It combines up to 40MHz real-time spectrum analysis, a preamplifier, and a tracking generator as standard in a 1.9kg instrument. Models cover 5kHz to 4.5, 8.5 or 14GHz.
Rohde & Schwarz GmbH & Co.
Details to be announced shortly.
With thanks to our judges!
- Dunstan Power, Co-Founder, ByteSnap Design
- Jackie Rutter, Vice President of Corporate Marketing, Menlo Micro
- Mark Patrick, Director of Technical Content for EMEA, Mouser Electronics
- Roger Thornton, Director of Applications Engineering, Raspberry Pi
- Stéphane Ratelet, Director of Sales and Support/Digital Solutions – EMEA, DigiKey
- Trevor Smith, a veteran of the test & measurement industry
