Mixed Signal/Analog

Paige West speaks with Chris Morrison, Product Marketing Director, Agile Analog about the analogue IP world, analogue design and some of the challenges and opportunities.

Pasternack has just introduced a series of low-PIM, in-building DAS antennas that meet the most demanding low-PIM requirements for 5G and LTE/4G bands.

SiTime Corporation has announced a 32 kHz MEMS Super-TCXO that sets a new performance benchmark for timekeeping components in electronics. The SiT7910 is part of the SiTime Endura ruggedised family for aerospace and defence applications. Devices that use GPS signals, such as ruggedised handheld radios, ground vehicles and sensors, can acquire and lock to GPS more quickly and securely with the 25x higher precision of this Super-TCXO.

Linx Technologies has introduced three outdoor IP67-rated dipole antennas. These antennas are designed for notable performance in a wide range of applications, including 5G, LTE, Wi-Fi 6, Wi-Fi 6E, Wi-Fi 7, cellular IoT, CBRS, LPWA, and ISM applications.

Pasternack has just introduced a selection of in-stock, waveguide mixers, detectors, and couplers. They are made for a variety of applications, including 5G, 6G, test and measurement, research and development, electronic warfare and more.

Fairview Microwave has just released a new series of in-stock waveguide horn antennas for addressing a wide range of wireless applications.

NTT DOCOMO has announced that it has succeeded in what it believes to be the world's first trial of redirecting millimetre-band 28 GHz radio waves coming from inside a building to the foot of the building outdoors by bending the radio waves with a film-shaped transmissive metasurface attached to a window surface. The trial was conducted from October to November 2022 at their R&D Centre in Yokosuka, Japan, aiming at the realisation of advanced...

Pasternack has introduced a series of in-stock, waveguide horn antennas that can be used in a variety of wireless applications.

During the upcoming LOPEC trade show on the 1st and 2nd of March in Munich Henkel will display its range of functional material innovations for printed electronics together with its broad ecosystem of partners.

Diodes Incorporated (Diodes) is targeting growing opportunities in USB Type-C technology, and lower power operation needs, with  two new bit-level retimers.