IoT
Würth introduces SD card connectors
Würth Elektronik has introduced four new SMT-mountable card connectors and expands its range with solutions for the smallest packages.
JUMPtec launches modules based on Intel Core 3
JUMPtec, a subsidiary of Kontron, has launched its latest solutions based on the new Intel Core 3 and Intel Processor N-Series.
STMicroelectronics announces mass production for Bluetooth/Wi-Fi modules
STMicroelectronics has announced mass production start for its ST67W611M1 combined Wi-Fi 6 and Bluetooth Low Energy 5.4 module, describing the early success of Siana, a lead customer for its fast-to-market connectivity.
Silicon Labs and Wirepas Surpass 10 million chipsets
Silicon Labs and Wirepas, a specialist in decentralised IoT connectivity, announced they have shipped 10 million wireless SoCs running Wirepas’ RF mesh connectivity software, primarily in the Indian market with the Silicon Labs sub-GHz FG23 SoC.
Battery-free smart labels for next-gen sustainable IoT
Linxens, a specialist in component-based solutions for authentication and traceability, and Dracula Technologies have announced a strategic collaboration to develop next-generation autonomous IoT solutions for traceability and smart labelling applications. This collaboration paves the way for smarter and more sustainable connected devices.
Top 5 IoT products in May
Electronic Specifier walks through the top 5 IoT products released this May 2025.
Series 18 – Episode 4 – shaping IoT's next chapter with antenna innovation
Paige West speaks with Dermot O'Shea, Co-Founder and CEO, Taoglas about the Internet of Things (IoT) and antenna innovation.
Integrated matching filters for long-range wireless microcontrollers
STMicroelectronics has released a set of antenna-matching companion chips for STM32WL33 wireless microcontrollers (MCUs) to simplify the development of IoT, smart-metering, and remote-monitoring applications.
ASRock and Canonical partner on Edge AIoT
ASRock Industrial and Canonical have partnered to bring Ubuntu Pro for Devices to the entire range of robust Edge AIoT platforms.
Silicon Labs unveils first Series 3 portfolio SoCs
Silicon Labs has announced the first products of its Series 3 portfolio with the introduction of two new wireless SoC families built at the advanced 22 nanometre (nm) process node: the SiXG301 and SiXG302. These highly integrated solutions represent a significant leap forward in compute power, integration, security, and energy efficiency, addressing the growing demands of both line-powered and battery-powered IoT devices.