IoT

As more industries rely on connected devices to keep their operations running, the pressure is on to get connectivity right from the start. In a new white paper, Wireless Logic highlights network resilience as a critical but often overlooked factor in successful deployments and explains how enterprises can take a more strategic approach to connectivity design, security, and operational planning. 

An Internet of Everything has long been promised, but progress has been hindered by semiconductor availability, cost, and concerns around sustainability. Could a new approach help to achieve a smarter, more connected future?

Moxa has announced the launch of its next-generation 64-bit Arm-based computers UC-3400A and UC-4400A Series featuring industry-leading dual-wireless, 5G/LTE and Wi-Fi 6, connectivity.

The FORTEC Group has announced the launch of the SBCPRO-X51, a 3.5” single board computer engineered at our FORTEC branch in Germany to deliver powerful, efficient computing in demanding industrial and IoT environments.

Electronic Specifier walks through the top 5 IoT products released this March 2025.

SIMCom has announced that all its range of Cat 1 bis IoT modules are now being prepared with the firmware necessary to support SGP.32 functionality, facilitating simple remote provisioning of IoT modules. Developed by the GSMA, the SGP.32 standard enables connectivity with IoT devices without the need for physical SIM cards or other user interfaces. 

The EU aims to reduce energy consumption by 11.7% compared to projections of its expected energy use for 2030. By using energy more efficiently, Europeans can lower their energy bills, help protect the environment, mitigate climate change, and improve quality of life while reducing the EU's reliance on external oil and gas suppliers and supporting sustainable economic growth.

Advantech hosted an investor conference on 5th March, which was presided over by Chairman KC Liu alongside three co-presidents – Mr. Eric Chen, Ms. Linda Tsai, and Mr. Miller Chang.

At embedded world, MediaTek introduced the high-performance Genio 720 and Genio 520 Edge-AI IoT platforms. These new additions to the Genio series support the latest generative AI models, human machine interface (HMI), multimedia, and connectivity features for smart home, retail, industrial, and commercial IoT devices.

Direct Insight has created a QNX 8 BSP (board support package) for Ka-Ro’s QS93 solder-down module with NXP’s i.MX93 processor.