Memory

Innodisk has announced its industrial-grade 112-Layer 3D TLC SSDs along with capacity up to 8TB. The 112-layer SSDs introduces a complete product line including the SATA 3TG6-P and 3TE7 series, as well as the PCIe Gen3x4 and Gen4x4 series.

Weebit Nano has announced that it has completed the design and verification stages of its embedded ReRAM module, and taped-out (released to manufacturing) a test-chip that integrates this module. This highly integrated test-chip will be used as the final platform for testing and qualification, ahead of customer production.

Alliance Memory has expanded its offering of high-speed CMOS mobile low-power SDRAMs with a new LPDDR4X device featuring on-chip ECC.

Xilinx has introduced the Versal HBM adaptive compute acceleration platform (ACAP), the newest series in the Versal portfolio. The Versal HBM series enables the convergence of fast memory, secure connectivity, and adaptable compute in a single platform. Versal HBM ACAPs integrate the most advanced HBM2e DRAM, providing 820GB/s of throughput and 32GB of capacity for eight times more memory bandwidth and 63% lower power than DDR...

Swissbit has reported that a collaborative venture with Phoenix Contact has resulted in the company adopting Swissbit’s secure industrial SD card memory as the solution for its license protection. The Data Protection Edition of the Swissbit PS-46 DP SD-memory card functions as a secure license container while accelerating the roll-out and commissioning process for Phoenix Contact customers.

5G’s market penetration is growing rapidly and requires processing speed upgrades that new technologies such as DDR5 can offer. DDR5 is truly a step forward into a new generation of industrial memory, and can better meet the needs of high-bandwidth industrial applications such as data centers, AIoT and machine learning.

Innodisk has announced the release of its industrial-grade DDR5 DRAM modules. The new standard touts a host of crucial performance improvements and power savings over its predecessor, and anticipation has been high since the official announcement of its release.

SMART Modular Technologies has announced its T5PFLC FIPS 140-2 SSDs which provide certified authentication, sophisticated encryption, and are available in capacities from 120GB - 2TB. 

Winbond Electronics has announced it is expanding its total solution of SPI NOR Flash with the introduction of the new single die monolithic 1.8V 512Mb SPI NOR Flash that can support up to 166MHz standard/dual/quad SPI clocks.

SMART Modular Technologies has announced the new T5EN PCIe/NVMe M.2 2280 and U.2 flash memory drives for aerospace, defence and industrial applications that require durable, rugged, and secure memory storage.