Memory

Apacer has announced mass production of a full range of industrial-grade DDR4-3200 wide-temperature memory modules. They use Samsung’s original wide-temperature grade chips to support cutting-edge platforms including AMD’s Ryzen Embedded V2000 processor and Intel’s Tiger Lake and Elkhart Lake.

In stock now at distributor Mouser Electronics, Inc. are the 2210 QLC Solid-State Drives (SSDs) from Micron.

Data centre technology, whether for public clouds, private clouds or enterprise data centres, has just taken a tremendous step forward with significant impact for AI, ML and database storage thanks to new technology in Excelero’s NVMesh software. By Kirill Shoikhet, Excelero CTO

Winbond Electronics has announced that FPGA manufacturer Gowin Semiconductor has embedded a Winbond 64Mb HyperRAM fast memory device in its new GoAI 2.0 machine learning platform. GoAI 2.0 is a complete, new hardware and software solution for machine learning applications.

Innodisk’s 96-layer 3D NAND flash product lineup is now being shipped by distributor New Yorker Electronics. It meets demanding industrial applications.

Winbond Electronics has announced that a high-performance, low-power Winbond 1Gb LPDDR3 DRAM product has achieved another success in high bandwidth memory with Tsing Micro latest artificial intelligence (AI) system-on-chip (SoC).

Alliance Memory has added to its offering of high-speed CMOS mobile low-power SDRAMs with new LPDDR4 devices featuring on-chip ECC.

SMART Modular has announced the SP2800 family of PCIe NVMe SSD products designed to meet the needs of networking, storage, server, and other high-performance enterprise server applications. The introduction of the SP2800 PCIe NVMe SSD product family under SMART’s DuraFlash product portfolio follows the MDC7000 Enterprise and Data Center SSD Form Factor (EDSFF) product launched last month.

At the 2020 International Electron Devices Meeting, imec presented a novel dynamic random-access memory (DRAM) cell architecture that implements two indium-gallium-zinc-oxide thin-film transistors (IGZO-TFTs) and no storage capacitor.

Microchip Technology has announced a radiation-tolerant, 64 Megabit (Mbit) parallel-interface SuperFlash memory device with Total Ionising Dose (TID) tolerance for maximum reliability and robustness in the harsh radiation environment of space missions.