Next-gen NVMeTM SSD form factor for cloud data centres
KIOXIA Europe has developed and started shipment of engineering samples of next-generation Enterprise & Datacentre SSD Form Factor (EDSFF) E3.S, and which is being standardised by the SNIA SFF TA Technical Work Group. E3.S is a new form factor standard for NVMe SSDs in cloud and enterprise data centres, especially targeting PCIe 5.0 and beyond.
Power efficiency added to low power embedded controller
Renesas has expanded its RE Family lineup of embedded controllers with a new ultra-low power consumption member based on Renesas’ Silicon-On-Thin-Buried-Oxide (SOTB) process technology and built around the Arm Cortex-M0+ core. The newest member of the RE01 Group lineup is a 256KB flash memory variant in addition to the 1.5MB flash memory embedded controller, already in mass production.
Imec overcomes fundamental operation challenge for MRAMs
At the 2020 Symposia on VLSI Technology and Circuits, imec presented a deterministic write scheme for voltage-controlled magnetic anisotropy (VCMA) magnetic random access memories (MRAMs), obviating the need for pre-reading the device before writing.
Infineon introduces secured NOR Flash memory
With the acquisition of Cypress Semiconductor Corporation, Infineon Technologies has enhanced its expertise in memory solutions. Infineon has announced the addition of Semper Secure to its Semper NOR Flash memory platform.
Winbond QspiNAND Flash for 9205 LTE modem
Winbond Electronics has announced a new version of QspiNAND Flash designed for use with the Qualcomm(r) 9205 LTE Modem. The 1.8V, 512Mbits (64Mega Bytes) QspiNAND Flash from Winbond Electronics offers the right density for designers of New Cellular NB-IoT Modules.
Winbond launch of HyperRAM WLCSP for wearables
Winbond Electronics Corporation has announced the introduction of new HyperRAM products with WLCSP, which reaches an unprecedented thin form factor in embedded applications. HyperBus technology was first published by Cypress in 2014. Compared to the transmission and control interface of other memory, one of the characteristics of the HyperBus interface is the low pin count, which makes the circuit board layout simpler and the wiring area relative...
Innodisk brings NVMe performance to the industrial
Industrial applications have lagged behind in NVMe adoption for too long. The demand for high-performance flash storage devices in industrial applications has never been greater, yet NVMe devices have failed in achieving satisfactory performance and durability in such applications. With Innodisk’s industrial NVMe product lineup, true NVMe performance is finally available in products optimised for tough industrial use.
Lattice and Etron deliver low power reference design for Edge AI
Lattice Semiconductor and Etron, the memory IC and SoC innovator, have announced a memory controller reference design for Etron’s low pin-count RPC DRAM to enable low power Edge AI and video processing in applications requiring a compact form factor, including industrial cameras, drones, AR/VR systems, and Advanced Driver Assistance Systems (ADAS).
16 Gigabit DDR3 memory from I’M Intelligent Memory
I'M Intelligent Memory has doubled its maximum offerings of DDR3 memory-capacity again to 16 Gigabits per component. While most DRAM manufacturers produced DDR3 memory with a maximum of 4Gb per chip, Intelligent Memory followed its motto ‘beyond limits’ having offered DDR3 devices with 8Gb capacity for more than six years.
SSDs with NVMe performance and QLC NAND
Micron Technology has announced new client solid-state drives (SSDs) that bring NVMe performance to client computing applications, freeing laptops, workstations and other portables from legacy architectures that can rob devices of battery power, performance and productivity.