Memory

Macronix International has announced its ArmorFlash MX75 series. NOR Flash received PSA Certified Level 1 status at the device level, where the NOR Flash is integrated within a larger system. Achieving the PSA Certified distinction at the device level ensures designers have high degrees of security when selecting ArmorFlash MX75 memories for demanding applications such as Internet of Things (IoT) and other systems requiring robust data secur...

Recab UK is set to support embedded computing projects in the rail, automotive, aerospace, and marine transport markets with a new ultra-rugged computer on module (COM) from congatec. The recently released conga-TC570r is a COM Express Type 6 module based on an 11th Generation Intel Core processor, with an extended temperature range and soldered memory to ensure consistent performance in transport environments prone to high shock and vi...

Supermicro Computer has announced new versions of its top-loading storage solutions with 60-bay and 90-bay systems along with new Simply Double storage systems fully optimised for the latest 3rd Gen Intel Xeon Scalable processors and PCI-E 4.0NVMe drives. These high-capacity storage and expansion systems are well suited for cloud-scale storage implementations as well as HPC storage workloads.

Mouser Electronics has signed a global distribution agreement with AP Memory, a supplier of ultra-low-power and low-pin-count PSRAM.

SMART Modular Technologies, announces the introduction of new DDR5 modules that feature enhanced endurance and stability for industrial applications. These new DRAM modules combine the advanced technology of DDR5 with SMART Modular’s unique, rigorous test processes.

Greenliant has announced that it is now sampling SATA M.2 2242 ArmourDrive PX Series solid state drives (SSDs) that support 5K program-erase (P/E) cycles and advanced EX series SSDs with superior data retention and high endurance that support 60K, 120K and industry-leading 300K P/E cycles.

Innodisk has announced its industrial-grade 112-Layer 3D TLC SSDs along with capacity up to 8TB. The 112-layer SSDs introduces a complete product line including the SATA 3TG6-P and 3TE7 series, as well as the PCIe Gen3x4 and Gen4x4 series.

Weebit Nano has announced that it has completed the design and verification stages of its embedded ReRAM module, and taped-out (released to manufacturing) a test-chip that integrates this module. This highly integrated test-chip will be used as the final platform for testing and qualification, ahead of customer production.

Alliance Memory has expanded its offering of high-speed CMOS mobile low-power SDRAMs with a new LPDDR4X device featuring on-chip ECC.

Xilinx has introduced the Versal HBM adaptive compute acceleration platform (ACAP), the newest series in the Versal portfolio. The Versal HBM series enables the convergence of fast memory, secure connectivity, and adaptable compute in a single platform. Versal HBM ACAPs integrate the most advanced HBM2e DRAM, providing 820GB/s of throughput and 32GB of capacity for eight times more memory bandwidth and 63% lower power than DDR...