Semiconductor memory: a smart choice for smartphones
With epic strides undertaken in the domain of consumer electronics, semiconductor memory market is touted to acclaim global recognition for the product’s extensive data management property. The demand for advanced memory, of late, has covered an all new domain beyond the realm of conventional personal computers.
Capitalising on edge computing with supercharged DRAM
With the advent of 5G and the exponential growth of connected devices and edge computing, more data is being generated and processed at the edge. By the edge we mean it is the practice of processing data near the edge of the network where the data is being generated, instead of in a centralised data processing warehouse.
Complete interface solution for HBM2E memory launched
Rambus has announced a comprehensive interface solution for HBM2E memory consisting of co-verified PHY and memory controller. Operating at a top speed of 3.2 Gbps over a 1024-bit wide interface, the interface can deliver 410 GB/s of bandwidth with a single HBM2E DRAM stack.
Analysis of China’s 3D Layer NAND Flash
TechInsights has announced they are conducting considerable analysis on the Yangtze Memory Technologies' 3D 64L Xtacking TLC NAND Flash device.
Protect against malware in SPI flash memory systems
Microchip Technology has announced a new cryptography-enabled microcontroller (MCU), the CEC1712 MCU with Soteria-G2 custom firmware – designed to stop malicious malware such as rootkit and bootkit for systems that boot from external Serial Peripheral Interface (SPI) flash memory.
32-bit microcontroller product line-up expanded
Toshiba Electronics Europe has announced major strategic expansions to its already extensive line-up of microcontrollers. The TXZ+ family is a new range of 32-bit microcontrollers based on Arm Cortex processor cores.
Universal flash storage for 5G smartphone performance
Micron Technology has announced it began sampling the industry’s first universal flash storage (UFS) multichip package (uMCP) with low-power DDR5 (LPDDR5) DRAM. The uMCP provides high-density and low-power storage designed to fit on slim and compact midrange smartphone designs.
Collaboration to accelerate end-to-end Ethernet storage
Marvell has announced that it is working with leading SSD vendor KIOXIA and original design manufacturers (ODMs) Foxconn-Ingrasys and Accton to bring its Ethernet Bunch of Flash (EBOF) technology solutions for Ethernet storage to market. As data growth continues to soar, data centres are faced with demand for greater storage bandwidth and capacity as well as lower latency.
Out-of-the-box solution for supply chain security
Winbond Electronics Corporation and Karamba Security have announced secure flash memory chips with integrated runtime integrity for automotive ECUs and IoT connected consumer, industrial devices and supply chain security.
How pseudo-SLC mode can make 3D NAND flash more reliable
The data that computers across numerous sectors are collecting and processing needs to be stored, a demand that continues to push storage costs higher. Cost is a pain point in the consumer electronics sector, and manufacturers of smartphones and laptops want to see storage costs decrease. However, that decrease can’t come at the expense of the safety and reliability that both commercial and industrial enterprise servers require.