Component Management

EMIS announces the availability of the TMF4233 Three Phase EMI Filter with Neutral designed to be used in systems where noise may arise not just from phase wires but also from neutral line, improving overall noise suppression.

Littelfuse's TTape platforms expand Rutronik's thermistor portfolio. The devices were developed for thermal monitoring of multi-cell lithium-ion batteries and for large-area temperature monitoring in critical applications and require only one MCU input.

During the manufacture of different vehicle components, assembly errors or the use of faulty components can occur. When these components are subsequently used, this can result in unwanted noise or vibrations, which are not only perceived as annoying but can also lead to increased wear. Both are unacceptable.

xMEMS Labs, inventor of the world’s first monolithic silicon MEMS air pump, has announced the expansion of its µCooling fan-on-a-chip platform to solid-state drives (SSDs), enabling the first-ever in-drive active cooling for enterprise E3.S form factor SSDs used in AI data centers and NVMe M.2 SSDs used in laptop PCs.

The Chomerics Division of Parker Hannifin Corporation has released an updated version of its catalogue for thermal interface materials (TIMs).

L-com, an Infinite Electronics brand and a supplier of wired and wireless connectivity products, has added a new line of 42U server rack cabinets, offered in black or white.

The Peltier module, also known as a thermoelectric cooler (TEC), is a solid-state device that uses the Peltier effect to transfer heat.

In a significant advance for semiconductor technology, researchers at the University of Virginia (UVA) have confirmed a fundamental principle governing heat flow in ultra-thin metal films.

Inelco Hunter has announced the immediate availability of two high-speed, ultra-low-profile printer mechanisms.

Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers an expanded line of subrack components. This includes new subrack depths and heights in both the version mount and horizontal-mounted orientations for boards plugging into a 19” rackmountable enclosure.