Component Management
Rutronik expands portfolio with latest X1, X2, and Y2 film capacitors
Rutronik expands its portfolio with the latest X1, X2, and Y2 film capacitors from Vishay Intertechnology.
Arduino’s Opta micro programmable logic controllers now available at Mouser
Mouser Electronics is now stocking the Opta micro programmable logic controller (PLC) from Arduino.
SAKOR Technologies releases next-gen DYNOLAB test automation controller
SAKOR Technologies has announced the release of the DynoLAB GenV next-gen test automation controller, which allows even a non-programmer to implement complex test systems and testing standards.
Latest DICE specification from TCG offers interoperability and user-friendly implementation
Vendors can deliver enhanced security for devices and components thanks to the latest DICE specification from the Trusted Computing Group (TCG) which is currently out for public review.
Transtector release outdoor AC panel surge protectors
Transtector has released a new line of outdoor AC panel surge protectors with high-capacity metal oxide varistor (MOV) technology.
SEGGER and Nuvoton extend emWin GUI software partnership
Nuvoton Technology Corporation has announced the extension of their multi-year software partnership.
RECOM R-78 switching regulators
State-of-the-art, miniaturised DC/DC pulse converters (switching regulators) ensure perfect efficiency and a wide range of operating parameters.
Gen3 selected as preferred supplier of CIL
Gen3 has announced they were again selected by Custom Interconnect as a preferred supplier. CIL have acquired a new CM33L+ Ionic Contamination Testing system to complement their purchase of a second MBTech NC25 PCB Cleaning System.
Intraratio announce fully digitised traceability system for manufacturing
Intraratio has announced RunCard, a fully digitised traceability system for advanced manufacturing operations.
GÖPEL release new 3D solder paste inspection system
GÖPEL electronic presents with the new system Vario Line, 3D SPI an innovative system solution for the 3D inspection of solder and sintering pastes.