Component Management
Three-phase EMI filter with neutral from EMIS
EMIS announces the availability of the TMF4233 Three Phase EMI Filter with Neutral designed to be used in systems where noise may arise not just from phase wires but also from neutral line, improving overall noise suppression.
The TTape platform from Littelfuse – now available from Rutronik
Littelfuse's TTape platforms expand Rutronik's thermistor portfolio. The devices were developed for thermal monitoring of multi-cell lithium-ion batteries and for large-area temperature monitoring in critical applications and require only one MCU input.
Detecting noise in mechatronic electric motor vehicle components
During the manufacture of different vehicle components, assembly errors or the use of faulty components can occur. When these components are subsequently used, this can result in unwanted noise or vibrations, which are not only perceived as annoying but can also lead to increased wear. Both are unacceptable.
xMEMS extends µCooling fan-on-a-chip to SSDs
xMEMS Labs, inventor of the world’s first monolithic silicon MEMS air pump, has announced the expansion of its µCooling fan-on-a-chip platform to solid-state drives (SSDs), enabling the first-ever in-drive active cooling for enterprise E3.S form factor SSDs used in AI data centers and NVMe M.2 SSDs used in laptop PCs.
Parker Chomerics updates thermal interface materials catalogue
The Chomerics Division of Parker Hannifin Corporation has released an updated version of its catalogue for thermal interface materials (TIMs).
L-com’s new 42U server racks fit anywhere
L-com, an Infinite Electronics brand and a supplier of wired and wireless connectivity products, has added a new line of 42U server rack cabinets, offered in black or white.
What is the Peltier Module?
The Peltier module, also known as a thermoelectric cooler (TEC), is a solid-state device that uses the Peltier effect to transfer heat.
A leap toward more powerful and efficient computer chips
In a significant advance for semiconductor technology, researchers at the University of Virginia (UVA) have confirmed a fundamental principle governing heat flow in ultra-thin metal films.
Inelco Hunter announces 2” high-speed printer mechanisms
Inelco Hunter has announced the immediate availability of two high-speed, ultra-low-profile printer mechanisms.
Pixus Expands subrack components for rackmount enclosures
Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers an expanded line of subrack components. This includes new subrack depths and heights in both the version mount and horizontal-mounted orientations for boards plugging into a 19” rackmountable enclosure.