Save CO2 with new solution for shipping adhesives
Since 2018, DELO has saved 3,200 tons of carbon dioxide with a new solution for shipping adhesives. This was achieved with shipping containers that work according to the thermos flask principle. Adhesives enable lightweight design and resource-saving miniaturisation. For technical reasons, many high-tech adhesives have to be transported refrigerated or frozen.
Eutect introduces service cart for wave soldering modules
To simplify maintenance and servicing of wave soldering modules, Eutect has announced that it offers a versatile service cart designed for use directly on the machine. Each service cart is tailored to specific customer modules.
New joint-enhanced solder paste series released
SHENMAO America has introduced its Joint-Enhanced Solder Paste (JEP) PF606-EP Series. JEP offers the advantages of both traditional solder paste and anisotropic conductive paste. The residue from the PF606-EP Series provides excellent bonding strength and joint protection, thus enhancing joint reliability. JEP is compatible with various surface finishes.
Cleanroom conditions for semiconductor market soldering
With VisionX Semico, Rehm Thermal Systems developed a system that was adapted to the special requirements of the semiconductor market segment. It is based on the proven Vision series, which has been successfully established in the reflow soldering market for years. Especially important for the development of the VisionX Semico was the compliance with all specifications for the use of the system under clean room conditions.
Enhancement of quality using functional nanocoatings
In the various production steps, highly effective nanocoatings, such as anti-corrosion or insulation coatings, help to achieve desired attributes and to prevent undesired side effects. PlasmaPlus technology is used to apply nano coatings on different surfaces with different functionalities.
Deoxidation under vacuum with active process gases
The Nexus contact soldering system from Rehm Thermal Systems guarantees best results in reflow soldering processes using contact heat under vacuum. This enables the Nexus to meet the highest requirements in the field of advanced packaging and power electronics. The contact soldering system with a vacuum is also bespoke for void-free soldering of different components (e.g. IGBT) on DBC substrates.
Liquid pressure-sensitive adhesives for electronics
DELO has developed two liquid pressure-sensitive adhesives that have similar properties to (double-sided) adhesive tapes, but are applied in liquid form. DELO PHOTOBOND PS4130 and DELO KATIOBOND PS6372 can be dispensed easily and join components accurately with pressure.
Texas Instruments adds new order features to TI.com
Texas Instruments (TI) has announced a raft of new ordering features on TI.com to make it more convenient for companies in the European Union (EU), United Kingdom, Norway and Switzerland to purchase and obtain authentic TI analogue and embedded processing products at the lowest online price.
Digi-Key launches self-service quote tool
A refreshed Quote Manager tool for customers has been unveiled by Digi-Key Electronics.
Dispensing tips for wearables manufacturing
Consumer wearables, including smart watches and augmented reality glasses, have captured the imagination of many. Here Peter Swanson, Managing Director of adhesives specialist Intertronics, has discussed best practice for dispensing processes in wearables manufacturing.