Boards/Backplanes

NXP's MCSPTE1AK344 is a development kit engineered for BLDC motor control, targeting heating, ventilation, and air conditioning (HVAC) or electric pumps and three-phase PMSM control, targeting active suspension, electric powertrains, eTurbo, or belt start generators.

Nexperia has announced the release of its first 80V and 100V application specific MOSFETs (ASFETs) for hotswap with enhanced safe operating area (SOA) in a compact 8x8mm LFPAK88 package.

On 1st February, Wolfspeed and ZF announced a strategic partnership to target future silicon carbide (SiC) semiconductor systems and devices for mobility, industrial and energy applications.

Innoscience Technology has launched the first in a new family of SolidGaN integrated GaN devices.

Farnell now has global, in-stock availability of two new BeagleBoard.org development boards: BeagleConnect Freedom and BeaglePlay.

Keysight enhanced the x1149 Boundary Scan Analyser with support for the new IEEE 1149.1-2013 and IEEE 1149.6-2015 standards, allowing advanced boundary scan testing beyond typical structural tests and significantly increasing test coverage on printed circuit boards (PCB).

IBASE Technology has announced a 1U Enterprise Network Appliance designed for Intel Xeon E-2300 Processors.

Portwell, a specialist in Industrial IoT (IIoT) computing solutions and a Titanium Partner of the Intel Partner Alliance, is pleased to announce the launch of a new series of products designed with the 13th Gen Intel Core processors, including multiple models of PICMG 1.3 Full-Size Single Board Computers (SBC), industrial ATX motherboards, industrial Mini-ITX motherboards, Embedded Systems, COM Express Type 6 and COM-HPC Client Type modules.

Congatec, a vendor of embedded and edge computing technology, is pleased to announce that it is expanding its strategic solutions portfolio in the Arm processor sector to include Texas Instruments (TI) processors.

Kontron has presented an mITX motherboard based on Intel Core i3 processors as well as Intel N-series processors with latest UHD Gen12 graphics at embedded world 2023, thus expanding its product family of compact, power-saving motherboards ‘Designed and Made in Germany.’