CEM beats COVID-19 with remote ISO9001 audit
Contract electronics manufacturer, Offshore Electronics, has taken part in what is believed to be one of the first-ever ISO9001 Recertification Audits to be carried out remotely, due to the Covid-19 pandemic.
Copper bonding ribbon aids power module manufacture
Heraeus Electronics has expanded its PowerCuSoft product family with a new copper bonding ribbon.
ASSET InterTech achieves ISO 9001 standard
Culminating a year-long review of its quality management standards and an intense three-day audit of its processes, ASSET InterTech has been awarded an ISO-9001 certificate by the International Standards Organization.
Advantest fields strong line-up at virtual Semicon West
Semiconductor test equipment supplier Advantest will participate in the first-ever virtual SEMICON West on July 20-23 as a Gold sponsor, exhibiting its latest end-to-end IC test solutions and presenting technical papers.
Online portal accesses cloud-based services and software
A new online portal has been created to enable customers to place orders and get instant delivery of Advantest’s cloud-based services and software products, making these items available on demand, anytime and anywhere.
Emerging photovoltaics: materials opportunity in new market
The new IDTechEx report: 'Materials Opportunities in Emerging Photovoltaics 2020-2040', is based on interviews by multi-lingual, PhD level IDTechEx analysts across the world and 20 years tracking the research and applications. They predict $38bn in 2040 without colliding with the silicon-in-glass 'power station' business. There will be many opportunities for premium pricing of its new specialist materials.
The future of thermoplastics
Thermoplastics are changing the composite market, with their promise of re-usability and sustainability. In fact, reports from Markets and Markets show that the thermoplastic composites market is projected to reach $36bn by 2024. Here Kim Sjödahl, Senior Vice President, R&D and Technology of global composites manufacturer Exel Composites, shares insight on the rise and the future of thermoplastics.
Tester integrates burn-in and core testing for 5G ICs
Advantest has ramped up its H5600 family of memory testers by introducing the new H5620ES engineering test system, designed for both high-speed burn-in and core testing of today’s DDR4, next-generation DDR5, and low-power, double-data-rate (LPDDR) devices in laboratory environments.
Trending topics and troubleshooting tips from Hakko
Hakko has published its latest edition of Hakko Tech Tips, where the company has compiled a list of its trending Q&As to help shed some light on the most frequently asked questions fielded by Hakko’s Technical Support Team. The company also explore some of the what’s, how’s and why’s of soldering with Hakko products and take a closer look at some effective troubleshooting tips.
JTAG platform simplifies chiplets test method
A newly enhanced version of ASSET InterTech’s ScanWorks JTAG-based platform of hardware debug, validation and test tools allows engineers to more easily test the device interconnects between silicon ‘chiplets’ in multi-die packages.