Production
1.5:1 – robots are catching up with human employees at Amazon
Amazon have recently announced that its one millionth robot has been put into operation in its Tokyo warehouse. Amazon employs just over 1.55 million employees worldwide. This means there are now around 1.5 humans for every one robot.
From concept to chip: the custom ASIC design process
From industrial sensors to advanced automotive systems, the demand for application-specific integrated circuits (ASICs) is accelerating. These custom chips support advanced sensing and connectivity, optimising system performance and enabling miniaturisation and system-level differentiation. But what exactly does the design process of an ASIC entail?
Timestrip introduces new, user-friendly temperature monitoring
Timestrip announced the introduction of new electronic time and temperature indicators, expanding its highly flexible and easy-to-use neo family.
TRI introduces multi-camera AIO solution
Test Research, Inc. (TRI), a test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.
Are your electronics ready for summer shipping challenges?
Rust can happen at any time of year, but summer’s trademark rise in temperatures and humidity increase the risk of corrosion during June, July, and August in the northern hemisphere. With current society’s heavy reliance on electronics, there is no way to avoid these summer shipping challenges – only to face them head-on with the right packaging strategies.
Digital factory of the future transforms manufacturing
Manufacturing is going through a period of transformation driven by changes in consumer demand for more personalised products and re-shoring post-pandemic supply chain crunch, to name just a couple of these challenges.
Altus Group supplies 3D AOI inspection system
Altus Group has supplied Alan Anderson Manufacturing, a growing electronic manufacturing services provider, with a state-of-the-art 3D Automated Optical Inspection (AOI) system.
X-FAB releases new isolation class, reducing chip size
X-FAB Silicon Foundries SE has released a new isolation class within its 180nm XH018 semiconductor process.
Omdia: China’s strategic growth redefines the polariser market landscape
Omdia’s latest ‘Display Optical Film Market Tracker’ reveals that Chinese manufacturers accounted for 65% of global polariser production capacity in 2024, a figure expected to approach 80% by 2027.
Nordson develops panel-level packaging solution
Nordson Electronics Solutions has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing.