Aegis Software, Europlacer extend reseller agreement
Aegis Software has extended its 20-plus year reseller agreement covering its FactoryLogix platform with Europlacer to China.
The potential of polymer 3D printing
3D printing technologies have evolved significantly, with much of the research centred around the materials science field. This includes high-performance polymers with mechanical characteristics - so what does this mean for bearing design? Here Chris Johnson, Managing Director of SMB Bearings, explores the plastic bearing additive manufacturing (AM) landscape.
Graphene creates textiles of the future
Grafren AB, a Swedish chemical manufacturer and Associated Member of the Graphene Flagship, has been granted its first patent for a new method of separating graphene flakes. Here, Erik Khranovskyy, CEO of Grafren, explains how this pioneering technology could be used to turn simple textiles into smart, electronic products and interfaces.
Test pilot bridges semiconductor design and production
Advantest is pilot testing a next-generation solution for performing both high-speed scan testing and software-driven functional device testing on its V93000 platform by leveraging the existing high-speed serial I/O interfaces on advanced integrated circuits (ICs).
XJTAG adds Arm SWD support and user-defined libraries
Serial Wire Debug (SWD) support, user-defined libraries, a new clock generator, and other benefits enhance XJTAG’s latest software release, XJTAG 3.11.
Innovative smart packaging solutions launched
Sandvik Coromant has launched an optimised smart packaging solution to level up its operational sustainability. Developed by R&D engineer and system developer Maria Rajabzadeh Namaghi as part of Sandvik Coromant’s Automation Platform team. The solution uses artificial intelligence (AI) to determine the smallest possible packaging required to contain a product, reducing costs and CO2 emissions in the process.
Virtual VOICE 2021 highlights IC test solutions
Semiconductor test equipment supplier Advantest will host the Virtual VOICE 2021 Developer Conference on June 21-23 to highlight the newest solutions and best practices for testing semiconductor devices.
Flying prober accomodates big dimension boards
Starting with the basics and the mechanical designs associated with probe cards and their construction, the very first constraint a user may notice is the size of the cards themselves. Traditional flying probe test area sizes can be a limiting factor, so much so, the probe cards don’t even fit in the test area. To meet this requirement, Seica has developed a flying prober, named the Pilot V8 XL Next>, to accommodate boards with sizes up ...
ESCATEC acquisition broadens European footprint
Electronics manufacturing services (EMS) provider ESCATEC to acquire 100% of UK-based JJS Manufacturing in a private deal to meet emerging trends in global markets and product requirements have prompted.
What makes a good adhesives partner?
To help companies pinpoint what to look for in an adhesives partner, Intertronics has written up the results of a roundtable discussing the question ‘what makes a good adhesives partner?’ For UK manufacturers looking to design new or improve current adhesives processes, the outcomes of the roundtable discussion are available to read on the Intertronics website.