Cadence, Presto forge link on IC package design
Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems have announced a collaboration to broaden semiconductor package design solutions and expertise for high-performance system-in-package (SiP) development for the automotive and Industrial IoT markets.
emPower OS enables production during chip shortages
SEGGER has introduced its all-in-one embedded operating system emPower OS. It uses proven components from the software toolbox that already lays the groundwork for many customer products and for SEGGER’s successful J-Link debugger. emPower OS provides an out-of-the-box experience for complex embedded software applications on close to one thousand hardware platforms while supporting many more.
Rugged HPEC for harsh transportation environments
Eurotech has launched a high performance edge computing system (HPEC) for the transport industry to enable the deployment of advanced AI-based analytics capabilities at the edge. The DynaCOR 40-36 is fanless and uses liquid cooling capabilities, making it suitable for the harshest of transportation environments.
Enabling resilient timing for critical infrastructure
Microchip Technology has announced it has integrated its BlueSky GNSS Firewall with its TimePictra 11 synchronisation monitoring and management platform to protect 5G networks and other critical infrastructure from Global Positioning System (GPS) signal jamming and spoofing while providing single-console visibility across the entire timing architecture.
Microchip simplifies deployment of WiFi 6 access points
Organisations can only deploy today’s WiFi 6 access points (APs) and 5G small cell access nodes where AC power is available or if their switch can deliver both power and data to them as required. Microchip Technology has created a more flexible and cost-effective alternative with the first multiport Power over Ethernet (PoE) power sourcing equipment (PSE) injector, also known as a midspan, that enables any multigigabit switch to support the...
CompactPCI Serial processor blade launched
ADLINK Technology has launched the cPCI-A3525 series CompactPCI Serial processor blade in single-slot (4HP) form factor. The 3U module features the latest 9th generation Intel Xeon/Core i7 processor, formerly known as Coffee Lake Refresh.
Choreo iPaaS for cloud-native engineering
Enterprises worldwide are accelerating their digital transformation initiatives, with many starting years earlier than originally planned. But, too often, these initiatives are hampered by the lack of deep technical expertise required to get projects off the ground and deliver digital products and solutions. WSO2 has addressed this challenge with the introduction of Choreo, the new integration platform as a service (iPaaS) for clou...
Google selects AMD to launch first Tau VM Instance
AMD and Google Cloud have announced T2D, the first instance in the new family of Tau Virtual Machines (VMs) powered by 3rd Gen AMD EPYC processors. According to Google Cloud, the T2D instance offers 56% higher absolute performance and more than 40% higher price performance for scale-out workloads.
SnapEDA adds crackle to DesignSpark
A collaboration between SnapEDA, a search engine for electronics design, and online design engineer community DesignSpark will help engineers design faster, regardless of which PCB design tool they use.
Enclustra Andromeda XZU90 SOM with up to 686 user I/Os
Enclustra’s Andromeda XZU90 is the first module from the brand new Andromeda product family. It is modular and optimised for high-end applications. It supports up to 6 Samtec ADM6-60 high-speed connectors with up to 686 user I/Os.