Design

HARMAN International, a wholly-owned subsidiary of Samsung Electronics Co., Ltd. focused on connected technologies for automotive, consumer and enterprise markets, is pleased to announce the continuation of its partnership with Renault with the launch of the all new Austral.

Indium Corporation has expanded its portfolio of proven pastes with a new no-clean, halogen-free solder paste designed for advanced LED applications, including COB, COG, SMT, and other LED varieties.

Nordson Electronics Solutions has introduced the new SELECT Synchro selective soldering system for high-volume printed circuit board assembly applications.

Hexagon’s Manufacturing Intelligence division has introduced Elements, simulation software that helps engineering teams understand the behaviour of systems that are becoming increasingly complex in modern products.

Nordson Electronics Solutions, a global specialist in electronics manufacturing technologies, introduces the SELECT Synchro selective soldering system for high-volume printed circuit board assembly applications.

Commercial production of integrated circuits using 28nm technology node began several years ago. As the process technology has matured, market demand for 28nm products has also increased. Although offering numerous advantages, security applications have not been among the main applications of this technology, thus far. Infineon Technologies is introducing SLC26P, the first security IC targeting high volume payment applications based on the future...

Imperas Software, the specialist in RISC-V simulation solutions, has announced that Andes Technology Corp., a supplier of performance-efficient and extensible 32/64-bit RISC-V processor cores and Founding Premier member of RISC-V International, has certified the Imperas reference models for the complete range of Andes processor IP cores including Andes ACE support and the new RISC-V N25F-SE targeted at Functional Safely applications.

Solderstar, technology specialist in the design and development of temperature profiling equipment for the electronics industry, will present their expanded range of products at IPC APEX Expo 2023, San Diego, California, from January 24–26, 2023.

Unless you ride in a spacecraft, automotive power seats are probably the most complex chair in which you will ever sit. Clark Kinnaird, Engineer at Texas Instruments further discusses.

As PCBAs become more complex to manufacture with miniaturised components and different parts being mounted to the board, the soldering process becomes more difficult with the risk of structural damage, voids and defects. To support its customers in the challenge Altus Group, partnered with ASSCON vapour phase soldering systems who have innovative solutions for the production process.