Design

A research team at MIT has developed a method to fabricate and peel ultrathin ‘skins’ of electronic materials, a breakthrough that could lead to a new class of flexible and lightweight electronics.

Codasip has made available an exploration platform based on the Codasip X730 application core, which integrates CHERI (Capability Hardware Enhanced RISC Instructions).

In the highly competitive world of cycling, every gram and second counts. That’s why Faction Bike Studio and Frameworks teamed up with adhesives specialist LOCTITE to take bicycle frame construction and assembly to the next level.

Millions of broken smartwatches, phones, and tablets are gathering dust in drawers across the UK as consumers reject repair in favour of replacement, according to a new national survey.

Siemens Digital Industries Software continued collaboration with Intel Foundry has enabled multiple product certifications, updated foundry reference flows, and additional technology enablement.

xMEMS Labs has announced the expansion of its revolutionary µCooling fan-on-a-chip platform into AI data centres, bringing the industry’s first in-module active thermal management solution to high-performance optical transceivers.

TrustInSoft has announced the latest release of its flagship product, TrustInSoft Analyzer (TISA), featuring major enhancements to the TISA Project Manager GUI and the introduction of a new REST API for software development tool integration.

A British robotics expert has attracted millions of views on YouTube after unveiling a battery-powered bicycle that replaces traditional wheels with large self-balancing spheres.

Electronics manufacturing is at a pivotal moment. Devices are becoming smaller, more advanced, and increasingly complex – while the regulations governing their production are growing stricter and more nuanced. Environmental responsibility, workplace safety, and regulatory compliance are no longer optional – they are essential components of any resilient, forward-looking manufacturing strategy.

Researchers at Queensland University of Technology (QUT) have identified a new material with potential applications as a flexible semiconductor for wearable devices, using a technique known as vacancy engineering to enhance its performance. The study, published in Nature Communications, focused on improving the thermoelectric properties of an AgCu(Te, Se, S) alloy—comprising silver, copper, tellurium, selenium, and sulphur—by precisel...