Design

As we wave goodbye to 2024 and welcome in 2025, it is amazing to see all the remarkable technological advancements that have emerged over the past year. Among these many advancements, some of the most fascinating ones were those inspired by the nature – particularly the animal world.

In a breakthrough set to revolutionise the semiconductor industry, the School of Engineering of the Hong Kong University of Science and Technology (HKUST) has developed the world’s first-of-its-kind deep-ultraviolet (UVC) microLED display array for lithography machines.

Infineon Technologies and Flex are showcasing the new Flex Modular Zone Controller design platform for software-defined vehicles at CES 2025.

An electronic stacking technique could exponentially increase the number of transistors on chips, enabling more efficient AI hardware.

SHENMAO has announced the launch of its advanced solder paste, PF606-P275.

This season contains abundant prognostications of all sorts attempting to forecast trends for the year ahead. Rather than peering into a crystal ball filled with guesses, Jim Beneke, Vice President, Tria (An Avnet company) has taken a closer look at the company’s own analytics, compared them with projections from outside analysts, and can provide some solid trends for electronics designers to consider in the calendar year ahead.

In a significant advance for semiconductor technology, researchers at the University of Virginia (UVA) have confirmed a fundamental principle governing heat flow in ultra-thin metal films.

A team of interdisciplinary researchers from the Department of Materials Science and Engineering at the College of Design and Engineering, National University of Singapore (NUS), has unveiled a breakthrough innovation: flexible fibres with self-healing, light-emitting, and magnetic properties.

Although many electronics businesses are aware of the upcoming Ecodesign for Sustainability Products Regulation (ESPR), many have yet to begin preparations because of uncertainty about where to start.

Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency.