Events News
ASMPT to present bonding solutions at OFC 2025
ASMPT will present its pioneering AMICRA NANO, AMICRA NOVA PRO and MEGA bonding solutions at its booth during the OFC 2025 trade show, from 1-3 April in California.
MacDermid showcasing breakthrough materials at productronica
At productronica China 2025 (from 26-28 March) MacDermid Alpha Electronics Solutions will showcase breakthrough materials designed to meet demands for enhanced performance and reliability.
Date set for High-Speed Digital Test Forum
Rohde & Schwarz will host the High-Speed Digital Test Forum 2025 on April 8 at its Technology Center at the company’s headquarters in Munich.
Oscilloscope FFT functions examined in webinar
FFT and Spectrum Analysis with an Oscilloscope is the title of a webinar to be hosted by Teledyne LeCroy on April 1.
OFC 2025: Scintil Photonics debuts LEAF LightTM laser
Scintil Photonics announces it will demonstrate LEAF LightTM, the first single-chip, multi-wavelength laser source that delivers the speed, reach, power-efficiency, and lower latency required for scale-up networks.
Mersen solutions for energy transition
Exciting innovations to pursue energy transition will be presented at PCIM 2025 in Nuremberg by Mersen.
InP-on-Silicon design flow for next-generation optical transceivers
X-FAB Silicon Foundries SE, SMART Photonics, and Epiphany Design are collaborating to develop a new heterogeneous photonics integration platform that combines the strengths of InP and Silicon-on-Insulator (SOI) technologies, enabling multi-tera bit data rates for datacom and telecom applications.
We are exhibiting at Hardware Pioneers Max 2025, in London on April 23-24!
Electronic Specifier is heading to the UK’s largest electronics exhibition & conference, Hardware Pioneers Max 2025, in London on April 23-24! Hardware Pioneers Max is Europe’s fastest-growing electronics expo dedicated to cutting-edge technologies, solutions, and tools for innovation-driven engineering teams. The 2025 event is set to feature over 150 leading technology providers, attract more than 5,000 attende...
Samtec showcases 200+ Gbps active channels at OFC 2025
Samtec, Inc. is demonstrating next-generation, high-performance copper and optical interconnect solutions at OFC 2025 Exhibition (San Francisco, CA; April 1-3rd, 2025).
Indium Corporation showcases AI-ready materials in China
Indium Corporation will present its range of thermal interface materials (TIMs) designed for AI applications at Productronica China, taking place from 26th-28th March in Shanghai.