Products
Baya Systems' Series B funding to propel AI and chiplet innovation
Baya Systems has raised $36+ million in a Series B round led by Maverick Silicon, backed by a strategic investment from Synopsys, with current investors including Matrix Partners and Intel Capital reinvesting into the company.
Simplify LiDAR design with PLD arrays
The 905 array series of multi-junction Pulsed Laser Diodes (PLDs) is designed to simplify LiDAR applications by delivering high-power solutions in a compact form factor.
CC2755R10 by Texas Instruments
The SimpleLink CC2755R and CC2755P family of devices are 2.4GHz wireless microcontrollers (MCUs), targeting Bluetooth Low Energy (6.x and the upcoming versions), Zigbee (3.0 and the upcoming versions), Thread (1.3 and the upcoming versions), Matter (1.2 and the upcoming versions) and Proprietary 2.4GHz applications.
Wolfspeed unveils Gen 4 MOSFETs for high-power applications
Wolfspeed has introduced its new Gen 4 technology platform, which enables design rooted in durability and efficiency, all while reducing system cost and development time.
STMicroelectronics’ new NFC reader IC and comprehensive modular kit
STMicroelectronics is making it easier to explore creative applications for contactless near-field communication (NFC) technology with a novel development kit featuring the new ST25R200 reader/writer IC. ST’s latest-generation ST25R200 NFC transceiver combines an advanced design for strong and clear wireless connections with low power consumption and controls for signal quality and power management.
Vishay introduces SMD trimmers for harsh environments
Vishay Intertechnology has announced the launch of its new TSM3 series of multi-turn, surface-mount cermet trimmers. Designed to address the requirements of industrial, consumer, and telecom applications in space-constrained and harsh environments, these devices offer a robust combination of compact design, durability, and performance.
PCBWay achieves success with 24-layer, 6-order HDI PCB development
With the continuous development of the integrated circuit industry, the connections between chips have become increasingly complex.
Fime helps ELAN solution achieve FIDO certification
Fime has supported ELAN Microelectronics in achieving FIDO Biometric Component Certification for its fingerprint authentication solution.
Singular Photonics emerges from stealth with SPAD-based image sensors
Singular Photonics emerged from stealth, launching a new generation of image sensors based on single photon avalanche diodes (SPADs).
Series 17 – Episode 2 – Enabling deep space exploration with colossal telescopes
Paige West speaks with Andrea Banfi, Business Development Manager EMEA at Vicor and Gerald Angerer, Lead Hardware Engineer, Microgate.