Power

Kyocera has developed a new thin-film process technology for making unique silicon (Si) substrates for gallium nitride (GaN)-based micro-light sources, including short-cavity lasers and micro-LEDs.

Infineon Technologies has added EasyPACK 4B to its Easy power module family.

ROHM has signed a joint development agreement with Mazda Motor Corporation and Imasen Electric Industrial for inverters and SiC power modules to be used in the electric drive units of electric vehicles, including e-Axle.

Nexperia extended its ‘ASFETs for Hotswap and Soft Start’ portfolio with the introduction of 10 new 25V and 30V fully optimised devices, combining enhanced safe operating area (SOA) performance with extremely low RDS(on), making them ideal for use in 12V hotswap applications including data centre servers and communications equipment.

Infineon Technologies has added EasyPACK 4B to its industry-leading Easy power module family.

Diodes Incorporated is introducing its latest PCIe 3.0 packet switch, the DIODES PI7C9X3G1224GP.

TDK Corporation (TSE 6762) announces the introduction of the TDK-Lambda brand 1U high MU4 series of AC-DC modular power supplies.

Nexperia announced the expansion of its portfolio of Clip-bonded FlatPower (CFP) packaged diodes for industrial and automotive applications.

Luminus Devices has announced the release of the SBT-10X-UV LED series, a surface mount device (SMD) that utilises Luminus’ latest Gen5 die architecture.

Power Integrations announced the InnoSwitch4-Pro family of digitally controllable, off-line CV/CC zero voltage switching (ZVS) flyback ICs, which substantially reduce the size of power adapters.