STMicroelectronics has expanded its GANSPIN family of gallium nitride (GaN) motor drivers with three new 100V devices designed to deliver higher power density, improved efficiency and more compact motor-control systems.
Announced in Geneva on November 9, 2026, the GANSPIN1100 series comprises the GANSPIN1102, GANSPIN1102E and GANSPIN1105. All three devices are housed in a compact 5mm x 6.5mm package. The GANSPIN1102 offers a typical on-resistance (RDS(on)) of 2.4mΩ, while the GANSPIN1105 provides 5.5mΩ. The GANSPIN1102E features a dedicated top-side cooling option to help designers manage heat in high-power-density applications.
The new devices are aimed at applications requiring compact, lightweight and responsive motor control, including robotics, humanoid robots, industrial servo drives and actuators. They are also suited to e-bikes, drones and power tools, where improved power efficiency can help extend battery operating time.
According to STMicroelectronics, the GANSPIN1100 series can support continuous output currents of up to 60A, depending on the device. Each driver integrates two GaN transistors, gate drivers with optimized gate resistance, and VCC and bootstrap capacitors, reducing the number of external components required.
The devices also feature independent gate-driver outputs for high-side and low-side turn-on and turn-off operations, allowing engineers to adjust switching timing to optimize efficiency and electromagnetic interference (EMI) performance. A propagation delay of 20ns and delay matching accuracy of 1ns support switching frequencies of up to 5MHz.
To improve protection and switching performance, the drivers incorporate smart shoot-through protection that monitors gate-drive output voltage. This enables near-zero dead time to reduce GaN third-quadrant losses while preventing simultaneous conduction of the high-side and low-side transistors. Additional features include input interlocking and a dynamic bootstrap switch designed to prevent capacitor overcharging and maintain stable high-side gate-drive voltage.
Protection functions also include undervoltage and overvoltage lockout (UVLO and OVLO) for both VCC and bootstrap supplies, alongside thermal shutdown.
The compact package and pinout are designed to simplify PCB layout, with ST highlighting the possibility of implementing an optimized design using a two-layer board. This can help reduce board complexity, component count and overall bill of materials (BoM).
All three devices are supplied in a 1.12mm-high land grid array (LGA) package and support junction temperatures ranging from -40°C to 125°C.
STMicroelectronics plans to make the GANSPIN1102, GANSPIN1102E and GANSPIN1105 available by the end of 2026. Pricing will start at $x.xx for orders of 1,000 units.
The company will demonstrate the new technology at electronica 2026 in Munich, Germany, from November 10-13. Visitors to the STMicroelectronics booth (Hall C3, Booth 101) will be able to see the GANSPIN1102E powering the joints of a robotic arm in a live demonstration.
