Printed sensors project aims to reduce cost of EV batteries
CPI has announced that it is involved in a collaborative project which aims to develop novel printed sensors for electric vehicle (EV) battery current density imaging. This could increase battery life, reduce charging times and help to improve consumer safety, confidence and uptake of EVs.
Printed electronics: more safety and comfort in automobiles
Whether e-mobility or autonomous driving: In times of change, the automotive industry relies on printed electronics. From March 24th to 26th, 2020, LOPEC, the International Exhibition and Conference for the Printed Electronics Industry in Munich, will be providing information on innovative concepts for the automotive industry.
Drying UV coatings for short cycle times
UV coatings and UV adhesives facilitate fast hardening in just seconds, ensure short cycle times and increased production speeds and successfully connect environmental and economic benefits. There are also qualitative aspects in addition to this, such as a high level of gloss, as well as the increased durability and scratch resistance of the surface.
Chip bonding adhesive delivers die shear strength of 60N/mm2
A thermally conductive, electrically insulating adhesive from DELO is available at distributor Inseto. The MONOPOX TC2270 is ideal for bonding silicon die and other applications where rapid heat transfer is essential. Heat build-up is a common reason for integrated circuit failure and the efficient dissipation of heat in power semiconductors, as used in automotive applications is a consdierable challenge.
New dispensing valve for jetting liquids and pastes
Intertronics now supplies the Vermes Microdispensing System (MDS) 1560, an easy-to use, cost effective jetting valve for a wide range of viscosities, including solder pastes. The product is based on Dynamic Shockwave Technology (DST), a pneumatic actuator technology, which optimises the valve’s yield to achieve more precise dispensing. Able to dispense very small amounts in rapid succession, the consistent actuation power delivers high...
Top tips to achieve best performance when soldiering
In this edition of Hakko Tech Tips, the company has examined some of the commonly asked questions about Hakko soldering tips and equipment that are fielded by Hakko’s Technical Support team. It has also highlighted key points that will help you achieve the best results from your soldering process, including higher quality and reduced costs.
Confirmation of adhesive placement, quantity and cure
Intertronics has announced that it is supplying the expanded product range of Dymax Encompass adhesives, a patented technology that combines the benefits of See-Cure colour change and Ultra-Red fluorescence into one light-curable product. This combination means that manufacturers can benefit from the production efficiencies associated with rapid, on-demand curing, while also safeguarding against quality issues.
Compact UV LED lamp for adhesive curing
DELO has developed a particularly space-saving UV lamp for adhesive curing. The powerful DELOLUX 503 is designed for industrial applications requiring small surfaces to be bonded within seconds in serial production lines, for example for bonding cameras used in autonomous cars.
Biocompatible ALD materials for medical applications
Picosun has expanded its selection of biocompatible ALD materials to be used in medical applications. HfO2, SiO2, ZrO2, Nb2O5, Ta2O5, AlN and TiN ALD films manufactured by Picosun have been tested and validated by an independent third party to be non-cytotoxic and safe to human tissues in, for example, implant applications.
Solder paste inspection unit debuts at productronica
At productronica 2019, Omron has released the new 3D-SPI VP-9000 system used in Printed Circuit Board (PCB) manufacturing process for the production of electric devices. The solution complements its lineup of 3D-AOI and 3D-CT AXI systems, as well as flexible robotics solutions for personalised manufacturing.