In this post, Indium discuss the technology behind the paper: 'Extreme Toughening of Soft Materials with Liquid Metal' with Dr. Navid Kazem. Dr. Kazem began his work with liquid metal-embedded materials at Carnegie Mellon University, where he earned his PhD. He has since co-founded a new company devoted to rubber composites.

  This week we learned about an exciting new liquid metal-infused polymer, made with a gallium-indium alloy, which can be used to form circuits that heal themselves after being damaged. In this post, Eric Markvicka and Jim wrap up their conversation.

  In the last few posts, we have learnt about how to create stretchable electronics from gallium and indium embedded into an elastomer. In this post, Indium continue the conversation with Eric Markvicka and look at applications for this type of stretchable electronics.

  In this post from Indium, Eric Markvicka talks about how easy it is to form a stretchable electrical circuit with liquid metal-embedded material and some simple tools.

Eric Markvicka demonstrated self-healing electronics with his video of a liquid metal embedded elastomer. In this post, Indium discuss a composite material that is electrically insulating until it is patterned, at which point it becomes conductive. What initially drew attention to this technology is that it contains indium and gallium, specifically EGaIn – the eutectic gallium-indium alloy (Indalloy #60) which is 75.5%Ga and 24.5%In.

  This week Indium will be discussing the future of self-healing electronics with Eric Markvicka of Carnegie Mellon University. At the time of writing this, Eric is a PhD Student working on his thesis: Robust Soft-Matter Robotic Materials. Eric is part of Dr. Carmel Majidi’s Soft Materials Lab, focusing on stretchable electronics.

  Materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, Indium, has been awarded ISO/TS 16949 management system certificates for two of its manufacturing facilities and company headquarters.

Indium Corp has just released Indium11.8HF-SPR (T5-MC) Solder Paste. According to the company it is a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers.

Indium Corporation is to partner with 3S Silicon Tech, Inc. to host a technology seminar on solder joint reliability for automotive electronics on Aug. 11 in Taiwan Hsinchu.

  Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS, at NEPCON South China 2017 29th-31th August in Shenzhen, China.

Indium Corporation will feature its semiconductor-grade gold-germanium solder preforms at IMAPS High Temperature Electronics Network 2017 in Cambridge. Semiconductor-grade preforms are designed to meet the challenges faced as RF and power semiconductor devices continue to get smaller.

Indium Corporation has said it will feature InFORMS, its reinforced solder alloy fabrications, at PCIM Europe (May 16-18) in Nuremberg. InFORMS are a composite preform consisting of solder and a reinforcing matrix that, together, increase lateral strength and bondline co-planarity while improving thermal cycling reliability.

Seven Indium partners will exclusively run its low-voiding solder products “Live@APEX” throughout the IPC APEX Expo technical conference on Feb. 14-16 in San Diego, Calif. Live@APEX, a joint effort between Indium and its industry partners, accurately and honestly depicts the performance of the company’s materials in real time. The program places Indium Corporation products into live equipment demonstrations on the APEX show...

Indium Corporation’s VP of Technology, Dr. Ning-Cheng Lee, will lead three sessions at the IPC APEX Expo technical conference (Feb 11-16). In addition to sharing their expertise at technical sessions, the company will have several technical experts at their exhibit to meet with customers.

Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Tim Jensen, Senior Product Manager for Engineered Solders Materials, will present at Pan Pacific Microelectronics Symposium 2017 (Pan Pac) scheduled for Feb 6-9 in Kauai, Hawaii.

Indium will feature its halogen-free Indium8.9HF no-clean solder paste at NEPCON Japan 2017 on Jan. 18-20 in Tokyo, Japan. Indium8.9HF is specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability. In addition to outstanding print transfer and response-to-pause, this no-clean solder paste remains stable at room temperature for up to 30 days. It can also be stored for up to 12 months ...

Jason Chou, Area Technical Manager for Taiwan and Kenny Chiong, Senior Technical Support Engineer, from Indium Corporation will present at 2016 Electronics Packaging Technology Conference (EPTC) on 30th November - 3rd December in Suntec City, Singapore.

Indium Corporation will chair a special session focusing on void reduction in bottom-terminated components (BTCs) at the SMTA International Conference on Sept. 29 in Rosemont, Ill. Voiding is of critical concern in today's electronics assembly arena, especially in BTCs, due to impacts on electrical, thermal, and mechanical performance.

Indium Corporation’s Sze Pei Lim, Semiconductor Product Manager – Asia, will present at the 13th International Wafer-Level Packaging Conference. Her presentation, System-in-Package (SiP) Assembly vs. Solder Paste Attributes, will address the increased demand for SiP due to the rapid development of Internet of Things (IoT) “smart” devices.

Indium Corporation experts will deliver several technical presentations at the 37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference (IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia.