According to Indium, when InFORMS were used to solder a DBC to the baseplate of an IGBT, one study showed:
- 4x improved thermal cycling reliability compared to a solder preform-only approach
- 2x improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
- Reduced voiding (<1%)
- Lower cost of ownership – as a drop-in replacement for a standard preform or solder paste, InFORMS require no additional process steps or equipment