Indium Corporation
- 34 Robinson Road
Clinton
NY 13323 USA
United States of America - +1 315 381 7524
- http://www.indium.com
Indium Corporation Articles
Indium Corporation earns Mexico Technology Award
Indium Corporation has earned a Mexico Technology Award for its high-reliability mixed-alloy for solder paste, Durafuse HR.
Indium experts discuss e-mobility and PCB supply at Productronica India
Indium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on 12th September 2024 in Delhi, India.
Indium Corporation engineer to showcase at Delsys Tech Day
Indium Corporation Junior Application Engineer, Siegfried Lorenz, will present as part of Delsys Tech Day on September 11, in Lucerne, Switzerland.
Indium Corporation to showcase Durafuse at productronica India
Indium Corporation will feature its innovative Durafuse solder technology at productronica India, September 11-13, in Delhi, India.
Indium Technical Manager to Present at SEMICON Taiwan
Indium Corporation Senior Area Technical Manager Jason Chou will present on the timely topics of AI and EV technology at SEMICON Taiwan on 5th September 2024 in Taipei, Taiwan.
Indium Corporation Showcases AI-Driven Material Solutions at SEMICON Taiwan
As a innovator in materials for cutting-edge technologies, Indium Corporation is set to highlight its advanced heterogeneous integration and assembly (HIA) products, along with thermal interface materials (TIMs) driving AI progress, at SEMICON Taiwan from September 4-6 in Taipei.
Indium introduces Au-based precision die-attach preforms
Indium Corporation is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms.
Indium Corporation’s new type 6 jetting solder paste
Indium Corporation has introduced a new jetting solder paste to join its PicoShot series of products.
Indium expert to present at HiTEN conference
Indium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation at the International Conference and Exhibition on High-Temperature Electronics Network (HiTEN 2024), taking place 15–17 July 2024 in Edinburgh, Scotland, UK.
Indium introduces alloy for solder paste
Indium is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.
Indium Corporation sustainability focus at PCIM
Indium Corporation will showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany.
Indium to present on alternative solder alloys at SMTA
Indium Corporation Technical Support Engineer, CSMPTE, Thuy Nguyen will present at the SMTA Rocky Mountain Expo on 16th May 2024 in Aurora, Colorado.
Indium experts will present at Electronics in Harsh Environments Conference
Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East at Indium Corporation, will deliver a technical presentation, while Dr. Ronald Lasky, Senior Technologist, will lead both a workshop and a technical presentation at the Electronics in Harsh Environments SMTA Conference from May 14 to 16 in Copenhagen, Denmark.
Indium Corporation to present at PCIM Europe
Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, June 11-13, in Nuremberg, Germany.
Indium expert to discuss Pb-free solder for power applications
Indium Corporation Product Manager – Semiconductor, Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held 8–9 May 2024 in Woburn, Massachusetts, USA.
Indium hosts webinar on lead-free solder paste for automotive applications
Indium Corporation’s Senior Research Metallurgist, Jie Geng, PhD., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications.
Indium Corporation’s Sze Pei Lim at ICEP Japan
Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics Packaging (ICEP Japan 2024).
Indium Corporation celebrates 90 years of materials science innovation
Indium Corporation, a global pioneer in materials science and electronics assembly solutions, commemorates its 90th anniversary on 13 March 2024.
Indium to feature Durafuse solder technology
Indium Corporation features its innovative Durafuse solder technology alongside its Rel-ion portfolio of proven electrical, mechanical, and thermal solutions for EV manufacturing, at IPC APEX EXPO 2024, 9–11 April 2024, in Anaheim, California, US.
Indium to showcase semiconductor innovations at IMAPS
Indium Corporation will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 20th International Conference and Exhibition on Device Packaging hosted by IMAPS, 18–21 March 2024, in Fountain Hills, AZ.