Indium Corporation Articles
Indium Corporation expert honoured by IEEE EPS
Indium Corporation Strategic Advisor Dr. Dongkai Shangguan was honoured by the IEEE Electronics Packaging Society (EPS) with its 2023 Electronics Manufacturing Technology Award at the 73rd Electronics Components and Technology Conference (ECTC) in Orlando, FL.
Indium to sponsor and moderate IPC e-mobility webinar series
Indium Corporation is proud to sponsor the four-part e-mobility Electronics Hardware Reliability Webinar Series, hosted by IPC and moderated by Brian O’Leary, the company’s Global Head of e-mobility and Infrastructure and Chair of the IPC e-mobility Quality and Reliability Advisory Council.
Indium introduces new low-voiding Pb-free solder paste
Indium Corporation is proud to introduce Indium8.9HFRV, a flux vehicle developed from the Indium8.9HF chemistry.
Indium Corporation materials for power electronics at PCIM
Indium Corporation will proudly showcase a selection of innovative products at PCIM Europe, 9th-11th May in Nuremberg, Germany.
Indium Corporation to host battery-focused EV InSIDER live webcast
The next episode of Indium Corporation's free webcast series EV InSIDER Live, titled e-Mobility Batteries: The Next Frontier of Sustainability and the Circular Economy, is set to premier on Thursday, May 11th, at 11:30 EST.
Indium receives innovation award for halogen-free, cleanable solder paste
Indium has earned Electronics Manufacturing (EM) World's Innovation Award for SiPaste C201HF, a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing processes, as seen with 01005 and 008004 components.
Indium Corporation joins European Centre for Power Electronics
Advanced materials innovator Indium Corporation is pleased to announce that the company has joined the European Centre for Power Electronics (ECPE), the industrial and research network for power electronics in Europe.
Indium Corporation to host webinar on optimising sTIM processes for HIA
Indium Corporation technical support engineer Ryan Mayberry will host a webinar about optimising reflowed solder thermal interface material (sTIM) processes for emerging heterogeneous integrated assembly (HIA) packages. The webinar, a part of the company’s InSIDER Series, will be held live at 2:00 p.m. (EST), 30th March, and made available for on-demand viewing afterwards.
Indium Corporation joins American Semiconductor Innovation Coalition
Advanced materials innovator Indium Corporation has announced they have joined the American Semiconductor Innovation Coalition (ASIC).
Brian O’Leary to present at EV Charging Infrastructure USA 2023
Indium Corporation’s Brian O’Leary, Global Head of E-Mobility and Infrastructure, will present at EV Charging Infrastructure USA 2023.
Two Indium Corporation experts to present at APEC
Two Indium Corporation experts are set to present at APEC 2023, 19th to 23rd March in Orlando, Florida.
Indium features metal thermal interface materials for burn-in and test at TestConX
Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, 5th-8th March in Mesa, Arizona.
Indium Corporation to host webinar on material technology
Indium Corporation's Joe Hertline, Product Manager for Engineered Solder Materials (ESM)/Power Electronics, will host a webinar to discuss an emerging material technology which has the ability to provide robust tacking strength while reducing dependency on customised fixturing. The webinar, a part of the company's InSIDER Series, will be held live at 8:30am EST, February 28th and made available for on-demand viewing afterward.
Indium Corporation introduces China Country Sales Manager
Indium Corporation is pleased to introduce Taylor Wang Yong Xing as the company’s China Country Sales Manager.
Indium Corporation to participate at 3D-PEIM
Indium Corporation will feature selections from its portfolio of proven products for power electronics applications at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), February 1-3rd in Miami, Florida.
Indium Corporation to feature products for automotive and power electronics applications at NEPCON
Indium Corporation will feature selections from its portfolio of products for automotive and power electronics applications, including EVs, at NEPCON Japan.
Five Indium Corporation experts to present at IPC APEX Expo
Indium Corporation’s technical experts will share a variety of presentations on topics ranging from e-Mobility and achieving low voiding through solder preforms.
Indium features metal thermal interface materials and flux-cored wire
Indium will feature its compressible metal thermal interface materials (TIMs) and award-winning flux-cored wire at IPC APEX Expo, Jan. 24-26, San Diego, Calif., US.
Indium Corporation hires new Senior Manager for Corporate Quality
Indium Corporation is pleased to announce that Robert Atwood has joined the company as Senior Manager Corporate Quality.
Indium Introduces Cleanable SiPaste for fine feature printing
Indium Corporation has added to its portfolio of pastes for fine feature printing with a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing, as seen with 01005 and 008004 components.