Indium Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on 22–24 January 2025, in Tokyo, Japan.

As one of the leading materials providers in the electronics assembly industry, Indium Corporation is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan, taking place 22–24 January 2025, in Tokyo, Japan.

Indium will feature its high-reliability AuLTRA MediPro gold solder solutions at MD&M West, running 4-6 February in Anaheim, California.

Indium Corporation has announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.

Indium Corporation is proud to announce its recent achievement of the Excellence in Electronics Assembly Materials Award from Electronics Era, as part of the EE Excellence and Achievers Awards 2024.

 Indium Corporation is pleased to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), to be held from 16-18 October in Penang, Malaysia. 

Indium Corporation has earned a Mexico Technology Award for its high-reliability mixed-alloy for solder paste, Durafuse HR.

Indium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on 12th September 2024 in Delhi, India.

Indium Corporation Junior Application Engineer, Siegfried Lorenz, will present as part of Delsys Tech Day on September 11, in Lucerne, Switzerland.

Indium Corporation will feature its innovative Durafuse solder technology at productronica India, September 11-13, in Delhi, India.

Indium Corporation Senior Area Technical Manager Jason Chou will present on the timely topics of AI and EV technology at SEMICON Taiwan on 5th September 2024 in Taipei, Taiwan.

As a innovator in materials for cutting-edge technologies, Indium Corporation is set to highlight its advanced heterogeneous integration and assembly (HIA) products, along with thermal interface materials (TIMs) driving AI progress, at SEMICON Taiwan from September 4-6 in Taipei.

Indium Corporation is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms.

Indium Corporation has introduced a new jetting solder paste to join its PicoShot series of products.

Indium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation at the International Conference and Exhibition on High-Temperature Electronics Network (HiTEN 2024), taking place 15–17 July 2024 in Edinburgh, Scotland, UK.

Indium is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.

Indium Corporation will showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany.

Indium Corporation Technical Support Engineer, CSMPTE, Thuy Nguyen will present at the SMTA Rocky Mountain Expo on 16th May 2024 in Aurora, Colorado.

Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East at Indium Corporation, will deliver a technical presentation, while Dr. Ronald Lasky, Senior Technologist, will lead both a workshop and a technical presentation at the Electronics in Harsh Environments SMTA Conference from May 14 to 16 in Copenhagen, Denmark.

Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, June 11-13, in Nuremberg, Germany.