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Indium Corporation

Indium Corporation Articles

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Awards
16th September 2024
Indium Corporation earns Mexico Technology Award

Indium Corporation has earned a Mexico Technology Award for its high-reliability mixed-alloy for solder paste, Durafuse HR.

Events News
9th September 2024
Indium experts discuss e-mobility and PCB supply at Productronica India

Indium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on 12th September 2024 in Delhi, India.

Events News
4th September 2024
Indium Corporation engineer to showcase at Delsys Tech Day

Indium Corporation Junior Application Engineer, Siegfried Lorenz, will present as part of Delsys Tech Day on September 11, in Lucerne, Switzerland.

Events News
2nd September 2024
Indium Corporation to showcase Durafuse at productronica India

Indium Corporation will feature its innovative Durafuse solder technology at productronica India, September 11-13, in Delhi, India.

Events News
27th August 2024
Indium Technical Manager to Present at SEMICON Taiwan

Indium Corporation Senior Area Technical Manager Jason Chou will present on the timely topics of AI and EV technology at SEMICON Taiwan on 5th September 2024 in Taipei, Taiwan.

Events News
27th August 2024
Indium Corporation Showcases AI-Driven Material Solutions at SEMICON Taiwan

As a innovator in materials for cutting-edge technologies, Indium Corporation is set to highlight its advanced heterogeneous integration and assembly (HIA) products, along with thermal interface materials (TIMs) driving AI progress, at SEMICON Taiwan from September 4-6 in Taipei.

Design
18th July 2024
Indium introduces Au-based precision die-attach preforms

Indium Corporation is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms.

Design
27th June 2024
Indium Corporation’s new type 6 jetting solder paste

Indium Corporation has introduced a new jetting solder paste to join its PicoShot series of products.

Events News
19th June 2024
Indium expert to present at HiTEN conference

Indium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation at the International Conference and Exhibition on High-Temperature Electronics Network (HiTEN 2024), taking place 15–17 July 2024 in Edinburgh, Scotland, UK.

Design
17th June 2024
Indium introduces alloy for solder paste

Indium is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.

Events News
17th May 2024
Indium Corporation sustainability focus at PCIM

Indium Corporation will showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany.

Events News
14th May 2024
Indium to present on alternative solder alloys at SMTA

Indium Corporation Technical Support Engineer, CSMPTE, Thuy Nguyen will present at the SMTA Rocky Mountain Expo on 16th May 2024 in Aurora, Colorado.

Events News
14th May 2024
Indium experts will present at Electronics in Harsh Environments Conference

Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East at Indium Corporation, will deliver a technical presentation, while Dr. Ronald Lasky, Senior Technologist, will lead both a workshop and a technical presentation at the Electronics in Harsh Environments SMTA Conference from May 14 to 16 in Copenhagen, Denmark.

Events News
13th May 2024
Indium Corporation to present at PCIM Europe

Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, June 11-13, in Nuremberg, Germany.

Events News
30th April 2024
Indium expert to discuss Pb-free solder for power applications

Indium Corporation Product Manager – Semiconductor, Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held 8–9 May 2024 in Woburn, Massachusetts, USA.

Webinars
10th April 2024
Indium hosts webinar on lead-free solder paste for automotive applications

Indium Corporation’s Senior Research Metallurgist, Jie Geng, PhD., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications.

Events News
3rd April 2024
Indium Corporation’s Sze Pei Lim at ICEP Japan

Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics Packaging (ICEP Japan 2024).

Industries
13th March 2024
Indium Corporation celebrates 90 years of materials science innovation

Indium Corporation, a global pioneer in materials science and electronics assembly solutions, commemorates its 90th anniversary on 13 March 2024.

Design
5th March 2024
Indium to feature Durafuse solder technology

Indium Corporation features its innovative Durafuse solder technology alongside its Rel-ion portfolio of proven electrical, mechanical, and thermal solutions for EV manufacturing, at IPC APEX EXPO 2024, 9–11 April 2024, in Anaheim, California, US.

Events News
1st March 2024
Indium to showcase semiconductor innovations at IMAPS

Indium Corporation will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 20th International Conference and Exhibition on Device Packaging hosted by IMAPS, 18–21 March 2024, in Fountain Hills, AZ.

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