Indium Corporation Strategic Advisor Dr. Dongkai Shangguan was honoured by the IEEE Electronics Packaging Society (EPS) with its 2023 Electronics Manufacturing Technology Award at the 73rd Electronics Components and Technology Conference (ECTC) in Orlando, FL.  

Indium Corporation is proud to sponsor the four-part e-mobility Electronics Hardware Reliability Webinar Series, hosted by IPC and moderated by Brian O’Leary, the company’s Global Head of e-mobility and Infrastructure and Chair of the IPC e-mobility Quality and Reliability Advisory Council.

Indium Corporation is proud to introduce Indium8.9HFRV, a flux vehicle developed from the Indium8.9HF chemistry.

Indium Corporation will proudly showcase a selection of innovative products at PCIM Europe, 9th-11th May in Nuremberg, Germany.

The next episode of Indium Corporation's free webcast series EV InSIDER Live, titled e-Mobility Batteries: The Next Frontier of Sustainability and the Circular Economy, is set to premier on Thursday, May 11th, at 11:30 EST.

Indium has earned Electronics Manufacturing (EM) World's Innovation Award for SiPaste C201HF, a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing processes, as seen with 01005 and 008004 components.

Advanced materials innovator Indium Corporation is pleased to announce that the company has joined the European Centre for Power Electronics (ECPE), the industrial and research network for power electronics in Europe.

Indium Corporation technical support engineer Ryan Mayberry will host a webinar about optimising reflowed solder thermal interface material (sTIM) processes for emerging heterogeneous integrated assembly (HIA) packages. The webinar, a part of the company’s InSIDER Series, will be held live at 2:00 p.m. (EST), 30th March, and made available for on-demand viewing afterwards.

Advanced materials innovator Indium Corporation has announced they have joined the American Semiconductor Innovation Coalition (ASIC).

Indium Corporation’s Brian O’Leary, Global Head of E-Mobility and Infrastructure, will present at EV Charging Infrastructure USA 2023.

Two Indium Corporation experts are set to present at APEC 2023, 19th to 23rd March in Orlando, Florida.

Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, 5th-8th March in Mesa, Arizona.

Indium Corporation's Joe Hertline, Product Manager for Engineered Solder Materials (ESM)/Power Electronics, will host a webinar to discuss an emerging material technology which has the ability to provide robust tacking strength while reducing dependency on customised fixturing. The webinar, a part of the company's InSIDER Series, will be held live at 8:30am EST, February 28th and made available for on-demand viewing afterward.

Indium Corporation is pleased to introduce Taylor Wang Yong Xing as the company’s China Country Sales Manager.

Indium Corporation will feature selections from its portfolio of proven products for power electronics applications at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), February 1-3rd in Miami, Florida.

Indium Corporation will feature selections from its portfolio of products for automotive and power electronics applications, including EVs, at NEPCON Japan.

Indium Corporation’s technical experts will share a variety of presentations on topics ranging from e-Mobility and achieving low voiding through solder preforms.

Indium will feature its compressible metal thermal interface materials (TIMs) and award-winning flux-cored wire at  IPC APEX Expo, Jan. 24-26, San Diego, Calif., US.

Indium Corporation is pleased to announce that Robert Atwood has joined the company as Senior Manager Corporate Quality.

Indium Corporation has added to its portfolio of pastes for fine feature printing with a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing, as seen with 01005 and 008004 components.