Indium Corporation Articles
Indium’s new package-attach solder preform technology
Indium Corporation will showcase a new solder preform technology at Productronica 2023 from the 14th to the 17th November in Munich, Germany.
Indium to exhibit EV products at Productronica
Indium Corporation will showcase its advanced assembly materials for PCBA and power electronics, including those for the rapidly evolving electric vehicle manufacturing and e-Mobility market, at Productronica, November 14-17, in Munich, Germany.
Solder Chemistry solder paste at Productronica
Solder Chemistry will feature two of its proven solder paste solutions at Productronica, 14th – 17th November in Munich, Germany.
Indium Corporation acquires SAFI-Tech
Indium Corporation has announced the acquisition of SAFI-Tech to advance low-temperature soldering technology.
Indium Corporation to showcase at productronica India
Indium Corporation is proud to showcase its products and expertise for the rapidly evolving EV manufacturing and e-Mobility market at productronica India, 13th – 15th September, in Bengalaru.
Indium to showcase thermal management and power electronics at SEMICON
Indium will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, 6—8 September 2023, in Taipei.
Indium Corporation at PCIM Asia
Indium Corporation is set to deliver a technical presentation and exhibit its products for power electronics assembly at PCIM Asia, 29th – 31st August in Shanghai, China.
Indium earns IEEE Outstanding Industry Award for Innovative Solder Preforms
Indium Corporation has earned the IEEE Malaysia Section Outstanding Industry Award (Innovation) for its InFORMS brand of reinforced solder preforms.
Indium Corporation experts to present at SMTA China East Technical Conference
The upcoming SMTA China East Technical Conference will feature presentations by four Indium Corporation experts.
Indium Corporation expert honoured by IEEE EPS
Indium Corporation Strategic Advisor Dr. Dongkai Shangguan was honoured by the IEEE Electronics Packaging Society (EPS) with its 2023 Electronics Manufacturing Technology Award at the 73rd Electronics Components and Technology Conference (ECTC) in Orlando, FL.
Indium to sponsor and moderate IPC e-mobility webinar series
Indium Corporation is proud to sponsor the four-part e-mobility Electronics Hardware Reliability Webinar Series, hosted by IPC and moderated by Brian O’Leary, the company’s Global Head of e-mobility and Infrastructure and Chair of the IPC e-mobility Quality and Reliability Advisory Council.
Indium introduces new low-voiding Pb-free solder paste
Indium Corporation is proud to introduce Indium8.9HFRV, a flux vehicle developed from the Indium8.9HF chemistry.
Indium Corporation materials for power electronics at PCIM
Indium Corporation will proudly showcase a selection of innovative products at PCIM Europe, 9th-11th May in Nuremberg, Germany.
Indium Corporation to host battery-focused EV InSIDER live webcast
The next episode of Indium Corporation's free webcast series EV InSIDER Live, titled e-Mobility Batteries: The Next Frontier of Sustainability and the Circular Economy, is set to premier on Thursday, May 11th, at 11:30 EST.
Indium receives innovation award for halogen-free, cleanable solder paste
Indium has earned Electronics Manufacturing (EM) World's Innovation Award for SiPaste C201HF, a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing processes, as seen with 01005 and 008004 components.
Indium Corporation joins European Centre for Power Electronics
Advanced materials innovator Indium Corporation is pleased to announce that the company has joined the European Centre for Power Electronics (ECPE), the industrial and research network for power electronics in Europe.
Indium Corporation to host webinar on optimising sTIM processes for HIA
Indium Corporation technical support engineer Ryan Mayberry will host a webinar about optimising reflowed solder thermal interface material (sTIM) processes for emerging heterogeneous integrated assembly (HIA) packages. The webinar, a part of the company’s InSIDER Series, will be held live at 2:00 p.m. (EST), 30th March, and made available for on-demand viewing afterwards.
Indium Corporation joins American Semiconductor Innovation Coalition
Advanced materials innovator Indium Corporation has announced they have joined the American Semiconductor Innovation Coalition (ASIC).
Brian O’Leary to present at EV Charging Infrastructure USA 2023
Indium Corporation’s Brian O’Leary, Global Head of E-Mobility and Infrastructure, will present at EV Charging Infrastructure USA 2023.
Two Indium Corporation experts to present at APEC
Two Indium Corporation experts are set to present at APEC 2023, 19th to 23rd March in Orlando, Florida.