Indium Corporation is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms.

Indium Corporation has introduced a new jetting solder paste to join its PicoShot series of products.

Indium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation at the International Conference and Exhibition on High-Temperature Electronics Network (HiTEN 2024), taking place 15–17 July 2024 in Edinburgh, Scotland, UK.

Indium is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.

Indium Corporation will showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany.

Indium Corporation Technical Support Engineer, CSMPTE, Thuy Nguyen will present at the SMTA Rocky Mountain Expo on 16th May 2024 in Aurora, Colorado.

Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East at Indium Corporation, will deliver a technical presentation, while Dr. Ronald Lasky, Senior Technologist, will lead both a workshop and a technical presentation at the Electronics in Harsh Environments SMTA Conference from May 14 to 16 in Copenhagen, Denmark.

Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, June 11-13, in Nuremberg, Germany.

Indium Corporation Product Manager – Semiconductor, Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held 8–9 May 2024 in Woburn, Massachusetts, USA.

Indium Corporation’s Senior Research Metallurgist, Jie Geng, PhD., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications.

Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics Packaging (ICEP Japan 2024).

Indium Corporation, a global pioneer in materials science and electronics assembly solutions, commemorates its 90th anniversary on 13 March 2024.

Indium Corporation features its innovative Durafuse solder technology alongside its Rel-ion portfolio of proven electrical, mechanical, and thermal solutions for EV manufacturing, at IPC APEX EXPO 2024, 9–11 April 2024, in Anaheim, California, US.

Indium Corporation will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 20th International Conference and Exhibition on Device Packaging hosted by IMAPS, 18–21 March 2024, in Fountain Hills, AZ.

Indium Corporation is set to present three insightful contributions at APEC 2024, taking place from 25-29 February in Long Beach, CA. These presentations, delivered by distinguished members of the Indium Corporation team, will delve into various aspects of the power electronics assembly industry.

At the upcoming APEC 2024, taking place from 25-29 February in Long Beach, California, Indium Corporation is set to exhibit a range of its high-reliability materials designed for automotive and power electronics applications, including those used in electric vehicle manufacturing.

Indium Corporation will showcase its advanced assembly materials for power electronics, including the rapidly evolving EV manufacturing and e-Mobility market, at NEPCON Japan, January 24-26, in Tokyo, Japan.

Indium Corporation will showcase its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, taking place from January 27th February 1st in San Francisco. 

Indium Corporation Senior Area Technical Manager Jason Chou is set to deliver a presentation at the Power Device & Module Expo, held in conjunction with NEPCON Japan, on January 24th in Tokyo.

Indium Corporation’s Principal Engineer – Advanced Materials, Andy C. Mackie, PhD., will conduct a webinar on the rapid advancements taking place within e-mobility electronics technology.