Indium Corporation will showcase a new solder preform technology at Productronica 2023 from the 14th to the 17th November in Munich, Germany.

Indium Corporation will showcase its advanced assembly materials for PCBA and power electronics, including those for the rapidly evolving electric vehicle manufacturing and e-Mobility market, at Productronica, November 14-17, in Munich, Germany.

Solder Chemistry will feature two of its proven solder paste solutions at Productronica, 14th – 17th November in Munich, Germany.

Indium Corporation has announced the acquisition of SAFI-Tech to advance low-temperature soldering technology.

Indium Corporation is proud to showcase its products and expertise for the rapidly evolving EV manufacturing and e-Mobility market at productronica India, 13th – 15th September, in Bengalaru.

Indium will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, 6—8 September 2023, in Taipei.

Indium Corporation is set to deliver a technical presentation and exhibit its products for power electronics assembly at PCIM Asia, 29th – 31st August in Shanghai, China.

Indium Corporation has earned the IEEE Malaysia Section Outstanding Industry Award (Innovation) for its InFORMS brand of reinforced solder preforms.

The upcoming SMTA China East Technical Conference will feature presentations by four Indium Corporation experts.

Indium Corporation Strategic Advisor Dr. Dongkai Shangguan was honoured by the IEEE Electronics Packaging Society (EPS) with its 2023 Electronics Manufacturing Technology Award at the 73rd Electronics Components and Technology Conference (ECTC) in Orlando, FL.  

Indium Corporation is proud to sponsor the four-part e-mobility Electronics Hardware Reliability Webinar Series, hosted by IPC and moderated by Brian O’Leary, the company’s Global Head of e-mobility and Infrastructure and Chair of the IPC e-mobility Quality and Reliability Advisory Council.

Indium Corporation is proud to introduce Indium8.9HFRV, a flux vehicle developed from the Indium8.9HF chemistry.

Indium Corporation will proudly showcase a selection of innovative products at PCIM Europe, 9th-11th May in Nuremberg, Germany.

The next episode of Indium Corporation's free webcast series EV InSIDER Live, titled e-Mobility Batteries: The Next Frontier of Sustainability and the Circular Economy, is set to premier on Thursday, May 11th, at 11:30 EST.

Indium has earned Electronics Manufacturing (EM) World's Innovation Award for SiPaste C201HF, a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing processes, as seen with 01005 and 008004 components.

Advanced materials innovator Indium Corporation is pleased to announce that the company has joined the European Centre for Power Electronics (ECPE), the industrial and research network for power electronics in Europe.

Indium Corporation technical support engineer Ryan Mayberry will host a webinar about optimising reflowed solder thermal interface material (sTIM) processes for emerging heterogeneous integrated assembly (HIA) packages. The webinar, a part of the company’s InSIDER Series, will be held live at 2:00 p.m. (EST), 30th March, and made available for on-demand viewing afterwards.

Advanced materials innovator Indium Corporation has announced they have joined the American Semiconductor Innovation Coalition (ASIC).

Indium Corporation’s Brian O’Leary, Global Head of E-Mobility and Infrastructure, will present at EV Charging Infrastructure USA 2023.

Two Indium Corporation experts are set to present at APEC 2023, 19th to 23rd March in Orlando, Florida.