Indium Corporation has added to its portfolio of pastes for fine feature printing with a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing, as seen with 01005 and 008004 components.

Indium Corporation has earned a BISinfotech BETA Award as Global Leader in Solder and Materials category.

Indium Corporation has expanded its portfolio of proven pastes with a new no-clean, halogen-free solder paste designed for advanced LED applications, including COB, COG, SMT, and other LED varieties.

Indium Corporation is pleased to announce the promotion of Sze Pei Lim to the role of Senior Global Product Manager, Semiconductor and Advanced Materials.

As part of its electric vehicle (EV) focused series of webinars, Driving e-Mobility: Rel-ion Technical Webinars, Indium Corporation’s David Sbiroli, principal engineer, will share how to optimize two of the most important areas of the SMT assembly process—printing and reflow.

For many years, metals have been used as TIMs in the industry. Due to their reliability and high thermal conductivity, the metal TIMs have been great solutions, especially for the most challenging applications.

Specialist in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications.

Indium Corporation expert Dr. Ron Lasky, senior technologist, will share his technical expertise on the basics of statistical process control during a multi-chapter webinar offered by the Surface Mount Technology Association (SMTA).

Indium Corporation is proud to feature its innovative products for industries such as EV manufacturing, mobile, 5G, and semiconductors at productronica India, 21st to 23rd September 2022, in Greater Noida, India.

Indium Corporation’s Brian O’Leary, global head of e-Mobility and infrastructure, will participate in two panel discussions on the charging-related reliability challenges in the e-Mobility market at the Electric & Hybrid Vehicle Technology Expo (co-located with The Battery Show North America) from the 13th to 15th September 2022 in Novi, Michigan, US. 

Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for Indium12.8HF. A versatile solder paste engineered to deliver exceptional jetting and microdispensing performance on a variety of systems.

Indium Corporation’s Leo Hu, senior area technical manager – East China, will share his technical expertise and insight on electric vehicles (EV) during a webinar hosted by IPC China on Friday, May 20. His presentation, Advanced Assemblies Requirements for Electrical Reliability in Automotive Applications, will focus on the rapidly changing operating conditions of electronic assemblies.

Indium Corporation expert Andreas Karch, Regional Technical Manager and Technologist – advanced applications, and Ralf Sedlatschek, Head of Technology, KATEK Group, will co-present their joint process development on a materials solution to prevent hotspots in thermally-critical components at SMTconnect, May 10, 11:40 a.m.-Noon, Nuremberg, Germany.

Indium Corporation’s Brian O’Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving EV landscape at the SMTA Michigan Expo & Tech Forum at 9am local time, May 17, US.

Indium Corporation announces the release of InTACK, a drop-in, robust tacking agent for power module assembly at PCIM Europe, May 10-12, Nuremberg, Germany.

Indium Corporation’s Brian O’Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at the SMTA Rocky Mountain Expo & Tech Forum.

Indium Corporation’s innovative materials for advanced semiconductor packaging will be the focus of a presentation byDr. Dongkai Shangguan, strategic advisor, at the Surface Mount Technology Association’s Wafer-Level Packaging Symposium, Feb. 15-17, San Jose, Calif., U.S.

Indium Corporation’s Andy Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will host an automotive electronics webinar as part of Indium Corporation’s InSIDER Series on Webex at 8am and 2:30pm EST on Tuesday, July 28th.

Indium Corporation will feature its Indium3.2HF Solder Paste for LED manufacturing at Touch Taiwan Display International, August 28th to 30th in Taipei, Taiwan. The use of high-power LEDs, MicroLEDs, and MiniLEDs is growing exponentially due to light quality, energy efficiency, and reliability. These attributes are directly related to design and assembly methods and materials.

In this post, Indium discuss the technology behind the paper: 'Extreme Toughening of Soft Materials with Liquid Metal' with Dr. Navid Kazem. Dr. Kazem began his work with liquid metal-embedded materials at Carnegie Mellon University, where he earned his PhD. He has since co-founded a new company devoted to rubber composites.