Indium Corporation expert Dr. Ron Lasky, senior technologist, will share his technical expertise on the basics of statistical process control during a multi-chapter webinar offered by the Surface Mount Technology Association (SMTA).

Indium Corporation is proud to feature its innovative products for industries such as EV manufacturing, mobile, 5G, and semiconductors at productronica India, 21st to 23rd September 2022, in Greater Noida, India.

Indium Corporation’s Brian O’Leary, global head of e-Mobility and infrastructure, will participate in two panel discussions on the charging-related reliability challenges in the e-Mobility market at the Electric & Hybrid Vehicle Technology Expo (co-located with The Battery Show North America) from the 13th to 15th September 2022 in Novi, Michigan, US. 

Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for Indium12.8HF. A versatile solder paste engineered to deliver exceptional jetting and microdispensing performance on a variety of systems.

Indium Corporation’s Leo Hu, senior area technical manager – East China, will share his technical expertise and insight on electric vehicles (EV) during a webinar hosted by IPC China on Friday, May 20. His presentation, Advanced Assemblies Requirements for Electrical Reliability in Automotive Applications, will focus on the rapidly changing operating conditions of electronic assemblies.

Indium Corporation expert Andreas Karch, Regional Technical Manager and Technologist – advanced applications, and Ralf Sedlatschek, Head of Technology, KATEK Group, will co-present their joint process development on a materials solution to prevent hotspots in thermally-critical components at SMTconnect, May 10, 11:40 a.m.-Noon, Nuremberg, Germany.

Indium Corporation’s Brian O’Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving EV landscape at the SMTA Michigan Expo & Tech Forum at 9am local time, May 17, US.

Indium Corporation announces the release of InTACK, a drop-in, robust tacking agent for power module assembly at PCIM Europe, May 10-12, Nuremberg, Germany.

Indium Corporation’s Brian O’Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at the SMTA Rocky Mountain Expo & Tech Forum.

Indium Corporation’s innovative materials for advanced semiconductor packaging will be the focus of a presentation byDr. Dongkai Shangguan, strategic advisor, at the Surface Mount Technology Association’s Wafer-Level Packaging Symposium, Feb. 15-17, San Jose, Calif., U.S.

Indium Corporation’s Andy Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will host an automotive electronics webinar as part of Indium Corporation’s InSIDER Series on Webex at 8am and 2:30pm EST on Tuesday, July 28th.

Indium Corporation will feature its Indium3.2HF Solder Paste for LED manufacturing at Touch Taiwan Display International, August 28th to 30th in Taipei, Taiwan. The use of high-power LEDs, MicroLEDs, and MiniLEDs is growing exponentially due to light quality, energy efficiency, and reliability. These attributes are directly related to design and assembly methods and materials.

In this post, Indium discuss the technology behind the paper: 'Extreme Toughening of Soft Materials with Liquid Metal' with Dr. Navid Kazem. Dr. Kazem began his work with liquid metal-embedded materials at Carnegie Mellon University, where he earned his PhD. He has since co-founded a new company devoted to rubber composites.

  This week we learned about an exciting new liquid metal-infused polymer, made with a gallium-indium alloy, which can be used to form circuits that heal themselves after being damaged. In this post, Eric Markvicka and Jim wrap up their conversation.

  In the last few posts, we have learnt about how to create stretchable electronics from gallium and indium embedded into an elastomer. In this post, Indium continue the conversation with Eric Markvicka and look at applications for this type of stretchable electronics.

  In this post from Indium, Eric Markvicka talks about how easy it is to form a stretchable electrical circuit with liquid metal-embedded material and some simple tools.

Eric Markvicka demonstrated self-healing electronics with his video of a liquid metal embedded elastomer. In this post, Indium discuss a composite material that is electrically insulating until it is patterned, at which point it becomes conductive. What initially drew attention to this technology is that it contains indium and gallium, specifically EGaIn – the eutectic gallium-indium alloy (Indalloy #60) which is 75.5%Ga and 24.5%In.

  This week Indium will be discussing the future of self-healing electronics with Eric Markvicka of Carnegie Mellon University. At the time of writing this, Eric is a PhD Student working on his thesis: Robust Soft-Matter Robotic Materials. Eric is part of Dr. Carmel Majidi’s Soft Materials Lab, focusing on stretchable electronics.

  Materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, Indium, has been awarded ISO/TS 16949 management system certificates for two of its manufacturing facilities and company headquarters.

Indium Corp has just released Indium11.8HF-SPR (T5-MC) Solder Paste. According to the company it is a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers.