Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas.

Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void, while delivering high transfer efficiency with low variability.

Indium Corp will feature Heat-Spring, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara.  Heat-Spring is an interface that provides 86 W/mK of thermal conductivity using a pressure range of only 35-100+ psi.

Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void at IPC APEX Expo, which will be held on March 15-17 in Las Vegas.

Indium Corp is to feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016 which takes place Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications such as aerospace, defence, and medical.

Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS at NEPCON Japan. InFORMS are high-reliability solder preforms that provide a consistent bondline thickness to maximize thermal and mechanical reliability.