Indium Corporation Articles
Indium Corporation experts to present at APEX 2016
Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas.
Halogen-free, no-clean solder paste
Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void, while delivering high transfer efficiency with low variability.
Indium to showcase new material for LED Manufacturing at Strategies in Light
Indium Corp will feature Heat-Spring, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara. Heat-Spring is an interface that provides 86 W/mK of thermal conductivity using a pressure range of only 35-100+ psi.
Indium Corp to showcase low-voiding solder paste at IPC APEX
Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void at IPC APEX Expo, which will be held on March 15-17 in Las Vegas.
Indium Corp to show AuSn Solder Preforms at AeroDef
Indium Corp is to feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016 which takes place Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications such as aerospace, defence, and medical.
Indium Corp to show at Nepcon Japan
Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS at NEPCON Japan. InFORMS are high-reliability solder preforms that provide a consistent bondline thickness to maximize thermal and mechanical reliability.