Indium Corporation

Indium Corporation Articles

Displaying 81 - 86 of 86
Component Management
16th February 2016
Indium Corporation experts to present at APEX 2016

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas.

Component Management
15th February 2016
Halogen-free, no-clean solder paste

Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void, while delivering high transfer efficiency with low variability.

Component Management
9th February 2016
Indium to showcase new material for LED Manufacturing at Strategies in Light

Indium Corp will feature Heat-Spring, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara.  Heat-Spring is an interface that provides 86 W/mK of thermal conductivity using a pressure range of only 35-100+ psi.

Component Management
4th February 2016
Indium Corp to showcase low-voiding solder paste at IPC APEX

Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void at IPC APEX Expo, which will be held on March 15-17 in Las Vegas.

Component Management
5th January 2016
Indium Corp to show AuSn Solder Preforms at AeroDef

Indium Corp is to feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016 which takes place Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications such as aerospace, defence, and medical.

Component Management
9th December 2015
Indium Corp to show at Nepcon Japan

Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS at NEPCON Japan. InFORMS are high-reliability solder preforms that provide a consistent bondline thickness to maximize thermal and mechanical reliability.

First Previous Page 5 of 5 Next Last

Featured products

Product Spotlight

Upcoming Events

View all events
Latest global electronics news
© Copyright 2023 Electronic Specifier