Indium8.9HF provides a number of other benefits, including excellent pin-in-paste solderability and hole-fill, robust reflow capability, and a wide process window. Indium8.9HF is perfectly suited for a variety of applications, especially automotive, due to its unique oxidation barrier technology.
Indium8.9HF Solder Paste is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers to Avoid the Void.
