Indium Corporation
- 34 Robinson Road
Clinton
NY 13323 USA
United States of America - +1 315 381 7524
- http://www.indium.com
Indium Corporation Articles
Indium’s VP to chair lead free soldering workshop at ECTC
Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will chair the professional development course, Materials Considerations for Achieving High Reliability Lead-Free Soldering, at the Electronic Components and Technology Conference (ECTC), on May 31-June 3 in Las Vegas.
Germanium reclaim and recycle program
According to Indium Corporation, its germanium reclaim and recycle program enables customers to increase their return on materials by providing credit for diverting spent germanium from the waste stream. Germanium, used in things like the production of fiber optic cables, optical lenses and wafers, and catalysts in polyethylene (plastic) production, is typically not completely consumed during the process.
Indium's VP of Technology to host soldering Webtorials
Dr. Lee’s webtorial, Low-Temperature Solders: New Developments and Applications, will cover varieties of low-temperature solders with emphasis on lead-free alloys, their physical, mechanical, and soldering properties, and their applications. It will take place from 1-2 p.m. on May 17 and 19.
Indium's Thum lined up to present at IPC Thailand
Kenneth Thum, Senior Technical Support Engineer at Indium Corporation will present Risk of No-Clean Flux Not Fully Dried Under ComponentTerminations at IPC Thailand on April 26 in Bangkok, Thailand. Thum’s presentation will discuss a new halogen-free, no-clean SAC solder paste that has been developed to Avoid the Void and to address the reliability issues caused by insufficiently dried or burnt-off flux residue.
Halogen-free solder paste at SMT Hybrid Packaging 2016
Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste series at SMT Hybrid Packaging 2016 on April 26-28 in Nuremberg, Germany. The Indium8.9HF Series is specifically formulated to Avoid the Void while delivering high transfer efficiency with low variability.
Solder paste said to deliver superior ICT performance
Indium Corp has released Indium10.2HF, a halogen and Pb-free, no-clean solder paste that has been specifically formulated to address in-circuit testing challenges. Indium10.2HF is said to provide low cost-of-ownership to PCB assemblers through all-around balanced performance.
Solder paste claims best-in-class non-wet open performance
Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors. In addition to its resistance to non-wet opens, Indium10.8HF also delivers a superior oxidation barrier.
Indium’s VP of Technology to present at SMT Hybrid Packaging
Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present a two-part workshop at SMT Hybrid Packaging 2016, on April 26-28 in Nuremberg.
Low-Voiding solder pastes featured at IPC APEX 2016
Indium Corp says manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs and will help customers Avoid the VoiD with its void-reducing no-clean solder pastes at IPC APEX Expo.
Indium Corp will be “Live@APEX”
Indium Corporation will be all over APEX with plans to run its low-voiding solder products “Live@APEX” program in partner booths throughout the show in Las Vegas. “Live@APEX,” is designed to accurately depict the performance of the company’s materials in real time. The program places Indium Corporation products into live equipment demonstrations around the APEX show floor.
Indium's Sze Pei Lim to Present at SEMICON China
Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China. Lim’s presentation, No-Clean Material for Advanced Packaging Assembly, will detail how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the system-in-package (SiP) assembly process.
Indium Corp in the Pink
Indium Corporation has announced the release of PoP Flux 89LV-P, a bright pink-colored, no-clean, thixotropic flux that helps engineers to Avoid the Void by greatly improving visual inspection to minimize voiding and other defects in package-on-package applications.
Indium Corporation experts to present at APEX 2016
Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas.
Halogen-free, no-clean solder paste
Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void, while delivering high transfer efficiency with low variability.
Indium to showcase new material for LED Manufacturing at Strategies in Light
Indium Corp will feature Heat-Spring, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara. Heat-Spring is an interface that provides 86 W/mK of thermal conductivity using a pressure range of only 35-100+ psi.
Indium Corp to showcase low-voiding solder paste at IPC APEX
Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void at IPC APEX Expo, which will be held on March 15-17 in Las Vegas.
Indium Corp to show AuSn Solder Preforms at AeroDef
Indium Corp is to feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016 which takes place Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications such as aerospace, defence, and medical.
Indium Corp to show at Nepcon Japan
Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS at NEPCON Japan. InFORMS are high-reliability solder preforms that provide a consistent bondline thickness to maximize thermal and mechanical reliability.