Indium Corp to showcase low-voiding solder paste at IPC APEX
Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void at IPC APEX Expo, which will be held on March 15-17 in Las Vegas.
Indium Corp has specifically formulated Indium10.1 solder paste to reduce voiding significantly below the industry average – for improved finished goods reliability. Indium10.1 delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects.
For a halogen-free option, Indium8.9HF solder paste delivers very low voiding. Its unique oxidation barrier technology makes it perfectly suited for a variety of applications, especially automotive assembly.
In addition to outstanding print transfer and excellent response-to-pause, Indium10.1 and Indium8.9HF both provide excellent pin-in-paste solderability and hole-fill, while remaining stable at room temperature for up to 30 days.
According to Indium, Avoid the Void means manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs.
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