They also allow for exceptionally low voiding in solder joints, making them well-suited for IGBT assembly of the DBC to the baseplate. InFORMS maintain the highest thermal and electrical conductivity, as compared to typical soldered interconnections. By controlling the bondline thickness, the thermal performance is also more repeatable from device to device. InFORMS provide engineers with an enhanced material for the development of new applications, or the improvement of existing ones.
Indium Corp to show at Nepcon Japan
Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS at NEPCON Japan. InFORMS are high-reliability solder preforms that provide a consistent bondline thickness to maximize thermal and mechanical reliability.