Toshiba Corporation today announced that the International Electrotechnical Commission has endorsed a committee draft for vote of an International Standard, proposed by Toshiba, that will secure a much higher level of interoperability among subsystems in electricity transmission and distribution systems.

Toshiba America Electronic Components has announced the addition of three new high current P-ch MOSFETs: the SSM6J505NU, SSM6J501NU and SSM6J503NU. Supporting high currents for high power dissipation packages, the new MOSFETs make ideal charging switches for smartphones and other mobile devices with high current charging circuits.

Toshiba has announced full European availability of its latest Enterprise-class PX02SMx SSDs and MG03xxxx HDDs. These storage devices are ideal for a wide range of business-critical server and storage platforms as well as private cloud storage infrastructures.

Toshiba Corporation has announced that the company has developed second generation 19 nanometre process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month. Toshiba has used the new generation technology to develop the world’s smallest 2-bit–per-cell 64 gigabit NAND memory chips, with an area of only 94 square millimetres.

Toshiba Electronics Europe has announced two new photocouplers that are optimised for RS-232 and RS232-C communications. The TLP2301 and TLP2303 address emerging requirements for devices that fill the ‘price/performance gap’ between general-purpose transistor couplers and IC couplers operating from 1Mbps. Target applications will include factory automation and other industrial systems, appliances, smart metering and building automation.

Toshiba Electronics Europe (TEE) has announced a hybrid N-channel IEGT (Injection-Enhanced Gate Transistor) module that features an embedded silicon carbide (SiC) fast recovery diode (FRD). The high-efficiency PMI (Plastic case Module IEGT) will help designers to save energy, space and weight in high-power switching, inverter and motor control applications.

Toshiba Electronics Europe has announced the European launch of a family of 600V MOSFETs with integrated high-speed intrinsic diodes. Based on the company’s fourth generation 600V super junction DTMOS IV process, the new MOSFETs will improve power efficiency in switching power supplies, micro inverters, adaptors, and photovoltaic inverters.

TEE has expanded its family of low-voltage, ultra-efficient MOSFETs with two new series that deliver the lowest ON resistance (RDS(ON)) in their class. The new miniature, 30V devices also offer very low input capacitance (Ciss) to ensure an excellent RDS(ON)*Ciss figure of merit (FOM). The MOSFETs are based on the company’s eighth generation U-MOSVIII-H process and supplied in miniature TSON Advance and SOP Advance SMD packages respectively

Toshiba Electronics Europe has announced two ultra-miniature, low-power CMOS load switch ICs that offer advanced switching functionality with reduced component count. These load switches with integrated MOSFET and control circuit offer a number of benefits against discrete switch designs.

In the drive for greater switching performance, new technologies including Deep Trench Superjunction Technology help support dramatic improvements in MOSFET efficiency. By Michael Piela, Senior Product Marketing Engineer in the Power Semiconductors European Marketing & Engineering Department at Toshiba Electronics Europe.

Toshiba Corporation today announced that it has launched a sub-power management IC embedded with a DCDC step-down convertor and LDO for use in mobile products such as cellular phones and smartphones that realizes high efficiency at a light load.

Toshiba America Electronic Components today announced the availability of a new lineup of load switch ICs for mobile devices. Featuring Toshiba's newly developed micro CMOS process, the new lineup features low voltage operation and low ON-resistance characteristics - in ultra-small packages.

Toshiba Electronics Europe has announced five new next-generation stepping motor control drivers. The new drivers are designed using the Toshiba BiCD 130nm mixed-signal process technology, providing excellent Ron per unit area.

Toshiba Electronics Europe has announced that Toshiba Corporation has started volume production of silicon carbide (SiC) power devices, in anticipation of growing demand for industrial and automotive applications. Production is at Toshiba’s Himeji Operations–Semiconductor, Hyogo Prefecture, Japan.

Toshiba has further expanded its family of CMOS area image sensors by offering a 1.12μm, 8 Megapixel device in an unpackaged, die format. The T4K05 integrates a number of features that support the miniaturization of camera modules, allowing designers to reduce the size and height of mobile devices.

Toshiba Corporation have revealed today that it will launch a vector engine embedded microcontroller with a low-pin count and wide pin pitch, which makes lower mounting costs possible, as the latest addition to the ARM Cortex-M3 core-based TX03 series line-up. Mass production of the new product TMPM372 will start in May 2013.

This paper looks at the trend in control electronics for high power stepper motors, used particularly in CNC machines, and describes a modern solution that delivers power, processing and cost efficiency, which should test if the high proportion of German Subcriptors is true. Germany is a strong industrial basis so we should have a high hit rate.

Toshiba have today announced that it will start to develop a new product line of embedded microcontrollers including an advanced motor control co-processor, the Vector Engine. In recent years, demand has grown for energy and energy efficient products. Toshiba is working on solutions to promote smart community in various areas, and semiconductors form an important part of this effort.

Toshiba Electronics Europe is pleased to announce today that it will offer a Full-HD, 1.12μm, back-side illumination CMOS image sensor featuring an integrated colour noise reduction circuit for applications including mobile phones and smart phones, PCs and tablet PCs.

Toshiba unveil the industry’s thinnest CMOS image sensor camera module with high-resolution, 13 mega pixel imaging ideal for next-generation, ultra-thin smartphones and tablet devices. The new TCM9930MD leverages an advanced image pre-processing LSI (companion) chip and a refined module structure to create a compact image sensor camera module with the industry’s lowest profile at just 4.7 mm.