Molex extends Impact Backplane Connector System with two new configurations

9th February 2010
Posted By : ES Admin
Molex extends Impact Backplane Connector System with two new configurations

Molex Incorporated has released two additions to the Impact Backplane Connector System, its high-speed, high-density connector system for the telecommunication and data networking market. The Impact CoPlanar Connector System and Impact Mezzanine Connector System provide the ultimate flexibility to optimise designs for superior mechanical and electrical performance.

“The CoPlanar and Mezzanine connectors are examples of Molex’s commitment to meeting existing high-speed connectivity needs and supporting future upgrades,” said Jairo Guerrero, group product manager, Molex. “They share the same fundamental design features and superior performance capabilities found in our entire line of backplane connector products and provide additional configuration options giving design engineers more choices.”

The Impact Backplane Connector System is available in 2- to 6-pair configurations with a complete range of guidance and power solution options. It provides data rates up to 25 Gbps and superior signal density up to 80 differential pairs per inch. The Impact system’s broad-edge-coupled transmission technology enables low cross talk and high signal bandwidth while minimising channel-performance variation across every differential pair within the system.

In addition to sharing these features, the Impact CoPlanar Connector System is available in multiple compliant-pin design options on both right angle male and right angle female connectors. The system’s mating interface provides in-line staggered, bifurcated contacts that provide 2 points of contact for long-term reliability performance and built-in, ground-signal sequencing. This reduces the average mating force per connector to improve the mechanical mating performance of the system.

The Impact Mezzanine Connector System is an end-to-end stackable solution that employs Impact leadframe and backplane header technologies for superior electrical performance. Impact 5 pair mezzanine allows 67 differential pairs per linear inch and provides data rates up to 25 Gbps. The current stacking height is 40mm, but can be customised to heights between 18 and 40mm. Impact 5 pair power solutions are part of the product line, featuring 100 amps per module and four discrete power lines per module, aligning to our 40mm stack height.

Downloads


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

EVS32
19th May 2019
France EUREXPO LYON
Sensor+Test 2019
25th June 2019
Germany Nürnberg Messe
DSEI 2019
10th September 2019
United Kingdom EXCEL, London
European Microwave Week 2019
29th September 2019
France Porte De Versailles Paris
Engineering Design Show 2019
16th October 2019
United Kingdom Ricoh Arena, Coventry