Molex Incorporated

Address:
Molex
2222 Wellington Court
Lisle, IL 60532-1682
United States of America

Phone: 1 800-78MOLEX

Fax: (1) 630-968-8356

Web: www.molex.com


Molex Incorporated articles

Displaying 1 - 20 of 385

Connecting devices to the Internet of Things

Connecting devices to the Internet of Things
Some projections for the global Internet of Things (IoT) market are that it will grow to $457bn by 2020, up from $157bn in 2016 (Forbes, 2017). More recently, Microsoft announced that it will invest $5 billion in the IoT over the next four years (Microsoft IoT, 2018). 
11th July 2019

SlimStack floating connectors increase reliability

SlimStack floating connectors increase reliability
Molex has launched two new sizes of the SlimStack Floating Board-to-Board Connectors, 0.40mm and 1.25mm. Designed to save space and prevent fretting corrosion and provide superior contact reliability to other options in the market, the easy assembly also allow for design flexibility.
9th July 2019

8- and 20-circuit mid-power added to MultiCat Connector System

8- and 20-circuit mid-power added to MultiCat Connector System
Molex has introduced 8- and 20-circuit mid-power versions to the MultiCat Power Connector System with Precision-Machined Contacts. This system provides durability and can be mated quickly and ensures proper connection via connector position assurance, making it effective in multiple industry categories. With this connector system, customers will be able to use a reliable connector in a smaller space while minimising costs.
4th July 2019


FPGA server offers twice the typical density

FPGA server offers twice the typical density
BittWare, a Molex company, has introduced the TeraBox 1400B server supporting four double-width FPGA boards in a 1U high rackmount chassis. Fitted with BittWare XUP-VV8 boards, this server offers twice the FPGA and network density of a standard eight-board, 4U server.
4th July 2019

Molex encouraged by eSync Alliance membership growth

Molex encouraged by eSync Alliance membership growth
Molex has announced the accelerating growth in membership. The alliance is in an industry-wide initiative developing and promoting the technology needed for automotive Over-the-Air (OTA) and in-vehicle networks, which reduce the cost of software and firmware updates and recalls, and improve data services for the connected car. Since forming in 2017, the group’s membership has grown to now include Alpine, Excelfore, HELLA, Molex and ZF, and its most recent member, Mobica.
5th June 2019

Cables to help connect the electronics of tomorrow at EOT 2019

Cables to help connect the electronics of tomorrow at EOT 2019
  Molex will be showing the features and benefits of using Active Optical Cables (AOC) to connect the latest electronic devices on its booth (M9850) throughout the three-day EOT exhibition and conference, which takes place between the 7th-9th May, 2019 at Herning, Denmark.
7th May 2019

Collaboration strengthens position in FPGA acceleration market

Collaboration strengthens position in FPGA acceleration market
It has been announced by BittWare, a Molex company, and Nallatech that they have combined efforts to provide a portfolio of FPGA acceleration solutions. Both known within the industry for their wide breadth of in-house FPGA board, subsystem and software expertise, Molex acquired BittWare and Nallatech as an important part of its vision to provide customers with innovative electronic solutions. 
1st April 2019

2.2-5RF connector system and cable assemblies

Molex 2.2-5 RF connector system and cable assemblies deliver high frequency and low passive intermodulation (PIM) in a form factor that is 53% smaller than 4.3-10 connectors. 
18th March 2019

Ethernet traffic over passive copper DAC at DesignCon 2019

Ethernet traffic over passive copper DAC at DesignCon 2019
Global manufacturer of electronic solutions, Molex, has announced a collaboration with Ixia, a Keysight Business, in a joint demonstration at DesignCon 2019 on January 30th to 31st at booth 631. The demonstration will show Ixia’s AresONE 8x400GE test system generating a combined 3.2Tbps live Ethernet traffic over Molex QSFP-DD passive copper direct attach cable (DAC) assemblies at up to three meters to the device under test.
30th January 2019

CES 2019: 10Gbps automotive Ethernet network platform

Molex announced at CES 2019 the next evolution of its 10Gbps Automotive Ethernet Network Platform designed to support OEMs in the development and design of autonomous vehicles.
29th January 2019

Acquisition of Laird Connected Vehicle Solutions completed

Acquisition of Laird Connected Vehicle Solutions completed
Molex announced it has completed the acquisition of the Connected Vehicle Solutions ('CVS') division of Laird Limited, owned by funds managed by Advent International. On 28th September 2018, Molex announced an agreement to acquire CVS, which specialises in the design, development and delivery of vehicle antenna systems, smart device integration and vehicle connectivity devices.
3rd January 2019

Connector system designed for automotive connectivity

Connector system designed for automotive connectivity
  Molex recently launched the stAK50h Unsealed Connection System, designed to deliver both signal and Ethernet connectivity in automotive body electronics, safety and driver assist, comfort and infotainment devices and modules.
20th December 2018

Discreet pico-clasp wire-to-board connectors

Discreet pico-clasp wire-to-board connectors
The release of a new set of 1.00mm pitch wire-to-board Pico-Clasp Connectors has been announced by Molex. The connectors offer a variety of mating styles and orientations, plated in either tin or gold to meet flexible design specifics. Molex Pico-Clasp Wire-to-Board Connectors are suited for customers in the consumer, industrial, automotive, and medical industries.
12th December 2018

Coeur CST high current interconnect system introduced

Coeur CST high current interconnect system introduced
  Molex offers the Coeur CST High-Current Interconnect System featuring a new float design that accommodates pin to socket misalignment allowing for ease of mating PCB to PCB, PCB to bus bar, or bus bar to bus bar without the risk of overstress damage to the socket contact system.
6th December 2018

Collaboration to provide Industry 4.0 solutions

Collaboration to provide Industry 4.0 solutions
With sensors providing the essential steps of analysing and communicating high-level data to cloud-based applications, a collaboration between Molex and Contrinex aims to further strengthen Molex’s Industrial Internet of Things (IIoT) solution offerings and positions the company as an end-to-end solution provider for industrial automation.
28th November 2018

Float design supports easy damage-free pin-to-socket axial mating

Float design supports easy damage-free pin-to-socket axial mating
The new Coeur CST High-Current Interconnect System featuring a new float design that accommodates pin to socket misalignment allowing for ease of mating PCB to PCB, PCB to bus bar, or bus bar to bus bar without the risk of overstress damage to the socket contact system is the latest innovation from Molex.
22nd November 2018

Molex Showcases QSFP-DD with Ixia

Molex in collaboration with Ixia announce a joint demonstration at the European Conference on Optical Communication.
22nd October 2018

Pitch connectors offer signal reliability in a compact form

Pitch connectors offer signal reliability in a compact form
  Two FFC/FPC connectors designed to serve the growing information market needs of automakers and television display manufacturers, as well as designers requiring small-pitch, high-reliability connectors, have been announced by Molex.
10th October 2018

Data centre solutions to address expanding data rate needs

Data centre solutions to address expanding data rate needs
Molex has announced its full line of next-generation data centre infrastructure solutions to address expanding hyperscale requirements, including higher bandwidth and increasing data rates. Molex data centre solutions are designed in close collaboration with customers and are based on decades of proven expertise in developing high-speed solutions for OEMs in the server, storage and networking industries.
6th September 2018

Collaboration on next-gen data centre solutions

Collaboration on next-gen data centre solutions
Two global leaders in the design and manufacture of interconnects for high-performance electronic products have announced a Licensed Source Agreement which brings together innovations that provide a new generation of solutions to meet the evolving needs of 56G and 112G data speeds.
31st August 2018


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