Rutronik has announced that it is now stocking the Micro-Fit 3.0 connector system from Molex.

The next evolution in mobile networks is on the horizon with 6G. Set to surpass 5G with enhanced speed, reduced latency, and expanded capacity, countless applications will benefit.

Molex has announced the launch of its Virtual Automotive Showroom, an immersive online experience designed to showcase the company's latest innovations in automotive connectivity.

Molex has published a report detailing the significant role of ruggedised, miniaturised interconnect solutions in driving innovation in electronic devices across an expanding array of industries. 

Molex has introduced its MX-DaSH family of data-signal hybrid connectors that unify power, signal and high-speed data connectivity in a single connector system.

Molex, a global specialist in electronics and connectivity, has expanded its manufacturing footprint with the opening of a new campus in Katowice, Poland.

Molex recently published the findings of a global reliability study. This study highlighted the dilemmas faced by system architects and design engineers in hardware, including devices, as they strive to balance escalating demands for reliability against increasing product complexity, reduced testing time, and ongoing cost and manufacturing limitations.

Molex has expanded its array of solutions recommended by the Open Compute Project (OCP) with the introduction of the KickStart Connector System.

Molex, a global electronics and connectivity innovator, has diversified its product portfolio with the introduction of the MX60 series of contactless connectivity solutions.

Today's smart skin patches can incorporate a broad range of functions, employing hybrid printed electronics to enhance medical sensing capabilities and improve patient outcomes. Along with the enormous potential, though, there are also complex design challenges.

Molex announced that BMW Group has selected its Volfinity Cell Contacting System (CCS) for its next-generation electric vehicles (EV) class.

Molex has announced the results of a global survey of design engineers and managers to better understand top power-system design experiences, challenges, opportunities and attitudes that are enabling or inhibiting the development of critical power-system designs. 

Molex has introduced a chip-to-chip 224G product portfolio, encompassing next-gen cables, backplanes, board-to-board connectors, and near-ASIC connector-to-cable solutions operating at speeds up to 224 Gbps-PAM4.

Molex, a global electronics specialist and connectivity innovator, has extended its cable-assembly product line with the addition of innovative solutions from I-PEX, a specialist in the field of high-frequency and high-speed transmission connectors.

The Micro-Fit 3.0 connector system from Molex impresses with a wide range of pole numbers and cable lengths for power and signal transmission.

Molex has released a report on miniaturisation in product design that highlights the cross-disciplinary engineering design and manufacturing expertise required to integrate an onslaught of increasingly sophisticated features and functionality into constantly shrinking device footprints.

Paige West speaks with Tyson Masar, Global Director of Medical Sales at Molex about the company’s latest survey called Diagnostic Wearables: The Future of Medical Monitoring.

Molex, a connectivity innovator, has announced Single Pair Ethernet (SPE) technology as a new offering in its future product portfolio.

Molex has released a report examining the emerging world of the industrial metaverse and its impact on next-generation IoT infrastructures.

Molex has announced a major expansion of its global manufacturing footprint with the opening of its new factory in Guadalajara.