Infineon launches CoolSiC MOSFET 750 V G2 with ultra-low RDS(on)
Infineon Technologies launched its new CoolSiC MOSFET 750 V G2 technology, designed to deliver improved system efficiency and increased power density in automotive and industrial power conversion applications. (Read more.)
Microchip unveils new high-density power module
Microchip has announced the MCPF1412, a highly efficient and fully integrated point-of-load 12A power module with a 16V VIN buck converter and support for I2C and PMBus interfaces. (Read more.)
Navitas’ latest SiCPAK power modules
Navitas has announced the release of its latest SiCPAK power modules with epoxy-resin potting technology, powered by proprietary trench-assisted planar SiC MOSFET technology, that have been rigorously designed and validated for the most demanding high-power environments, prioritising reliability and high-temperature performance. (Read more.)
Vishay introduces new MOFSET
Vishay Intertechnology recently introduced a new Gen 4.5 650V E Series power MOSFET that delivers high efficiency and power density for telecom, industrial, and computing applications. (Read more.)
SemiQ launches 1,200V Gen3 SiC MOSFET modules in SOT-227 package
SemiQ has announced a family of co-packaged 1,200V SOT-227 MOSFET modules based on its third-generation SiC technology. (Read more.)
