The conference theme for INTELEC 2006, “Telecom Power: New Developments to Support the Latest Technologies,” is designed to draw focus to the ever-changing power needs of developing systems. The conference goal is to provide solutions, generate ideas and be a forum for the exchange of information between colleagues among a multinational cadre of telecommunications professionals. In addition to the primary Technical Program of invited and submitted papers, INTELEC offers training with a Tutorial program of career development in telecom power and grounding.
Elbanhawy’s technical presentation, “The Wave of the Future in High-Density PC Converters,” addresses recent advances in packaging and silicon design that allow the design engineer to implement DC-DC converter designs and break existing records in power density and current density in PC applications. He will also provide a detailed discussion of a recent design approach boasting 400 Watt/inch2 on standard 6-8 layer boards. This approach offers high-frequency, high-efficiency performance, allowing the design engineer to fully optimize both electrical and PCB designs since parasitic inductances and resistances are almost fully eliminated.
Elbanhawy, director, computing and telecommunication segments, Advanced Power Systems Center at Fairchild Semiconductor, holds seven patents and has applications pending for an additional seven. He has delivered many technical presentations at conferences including PESC, PEDS, Intel Technology Symposium, PCIM, PPDC, IPEC, IPEMC, IIC and Power Systems World. He also has written numerous articles for U.S. and international technical publications.