Renesas Technology Corp. and ZMD AG have announced a joint development agreement enabling Renesas to incorporate ZMD’s RF technology into Renesas microcontrollers (MCU) to develop a 900MHz band ZigBee chipset. Based on this agreement, the two companies will set up a collaborative development team with the aim of bringing a ZigBee chipset to market. The resulting advanced chipset is expected to accelerate the development of various types of IEEE...

Renesas Technology has announced that it has become the world’s first company to ship more than 1 billion microcontrollers with on-chip flash memory (flash MCUs). Renesas Technology is the No. 1 supplier* of flash MCUs worldwide, and MCUs are positioned as the company’s core product. Flash MCUs are known for their superiority because of their easy re-programmability of on-chip flash memory. Microcontrollers with on-chip flash help shorten d...

Renesas Technology Europe has been selected by LG Electronics to provide its DRACO2D digRF EDGE RF chipsets for LGE’s latest multimedia phones. DRACO2D offers a very integrated solution, simplifying the use of EDGE RF in the phone and featuring auto calibration mechanism to ensure fast time to market.

Renesas Technology Europe announces both that NTT DoCoMo, Inc., Renesas Technology Corp., Fujitsu Limited, Mitsubishi Electric Corporation and Sharp Corporation are developing SH-Mobile G2 single chip 3G platform, and also that the SH-Mobile G2 single chip 3G platform supports Symbian OS v9.3. Aimed at high end 3G smartphones the upgraded processors address the need for a standard OS platform for advanced applications, and also the increased d...

NTT DoCoMo, Inc., Renesas Technology Corp., Fujitsu Limited, Mitsubishi Electric Corporation, Sharp Corporation, and Sony Ericsson Mobile Communications, today announced that they plan to jointly develop a next-generation mobile phone platform1 for dual-mode handsets supporting HSDPA2/W-CDMA (3G) and GSM/GPRS/EDGE (2G). Development of the platform is targeted to complete during Q2, FY2008.

NTT DoCoMo, Inc., Renesas Technology Corp., Fujitsu Limited, Mitsubishi Electric Corporation, Sharp Corporation, and Sony Ericsson Mobile Communications, today announced that they plan to jointly develop a next-generation mobile phone platform1 for dual-mode handsets supporting HSDPA2/W-CDMA (3G) and GSM/GPRS/EDGE (2G). Development of the platform is targeted to complete during Q2, FY2008.

In response to the increasing demand for improved development efficiency and lower system prices, Renesas Technology Europe has introduced a comprehensive lineup of nine TV system LSIs for future TV system development solutions. The LSIs enable efficient and low-cost system implementation for various TV systems in worldwide markets.

Previewed at Electronica, Renesas Technology’s SH7203 integrated microcontroller offers a performance level that in many applications enables it to replace an industrial PC.

Renesas Technology’s AE-5 32-bit smart card microcontroller family has received a further two ‘Common Criteria’ security certifications. These certifications are at assurance level EAL4+ according to the ISO/IEC 15408 international standard relating to security of IT (Information Technology) products. These latest results confirm Renesas' commitment to developing ICs for a wide range of security-conscious applications. In today's global ...

Renesas has announced an expansion of its SH-Mobile range application processor from mobile phones into portable navigation devices and portable media players. The first part in a new family of devices designated SH-MobileR is the SH7222. It supports terrestrial digital broadcasting for portable and mobile terminals, offering high-performance moving image processing, on-chip multimedia peripherals including a camera interface, and a processor cor...

Endesa, Spain´s largest utility and one of Europe’s five leading electricity companies, Renesas Technology the worldwide leading supplier of semiconductor solutions to the metering industry, and Yitran a leading PLC fabless semiconductor company and the inventor of the IT800 DCSK based powerline modulation technique, have signed an agreement on 27th July 2006 to jointly develop an open specification for Automatic Meter Management (AMM).

Renesas has introduced the SH7211F, what it says is the fastest general purpose flash microcontroller to date. Featuring two banks of Renesas’ leading-edge MONOS flash that is at least twice as fast as its closest competitor, the device is ideal for use in ‘next generation’ motor drives and many other high performance industrial systems requiring excellent real-time-behaviour, as well as general purpose applications. MONOS, by the way stan...

Greatly improving the processing of multimedia content available to mobile phones by expanding the choice of supported standards, Renesas has announced the development of hardware IP supporting a decode function for the VC-1 video compression standard.

Renesas Technology Europe has introduced the SuperH family SH7774 SoC for high-performance in-vehicle information terminals such as next-generation car navigation devices. It combines the world’s first image recognition processing function in a car navigation SoC, high-speed 600 MHz operation, and a comprehensive range of on-chip peripheral modules including a 2D graphics engine for map drawing, an audio encoder, and an Ethernet interface.

Renesas’ SH-MobileL3V application processor is designed specifically for use in terrestrial digital broadcast capable mobile phones. The device enables smooth video display and recording - equivalent to that of a standard TV - and it facilitates the extraction of TV broadcast data and conversion to a JPEG image without loss of image quality. It also enables lower power consumption, and importantly, it provides the ability to customise mobil...

Renesas has introduced ‘SBC Middleware’ software, an important enabling tool in the development of audio applications for Bluetooth devices using SuperH family microprocessors incorporating an SH3-DSP CPU core.

Renesas has introduced ‘SBC Middleware’ software, an important enabling tool in the development of audio applications for Bluetooth devices using SuperH family microprocessors incorporating an SH3-DSP CPU core.