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Renesas

  • Renesas Electronics Europe GmbH Arcadiastr. 10 40472 Duesseldorf Germany
    United Kingdom
  • +49 (0)211 6503-0
  • http://www.renesas.eu

The merger in April 2010 between NEC Electronics and Renesas Technology has given birth to Renesas Electronics.
As a semiconductor manufacturer, we strive to be the first to meet the needs of our customers worldwide with the aim of becoming one of their most trusted partners.

Renesas Articles

Displaying 1 - 20 of 826
Sensors
17th June 2021
Ultra-low power platform for personalised outdoor air quality monitoring

Renesas Electronics has expanded its popular ZMOD4510 Outdoor Air Quality (OAQ) gas sensor platform with an IP67-qualifed waterproof package and a new AI-based algorithm that enables ultra-low power selective ozone measurements. The enhanced ZMOD4510 is the industry’s first fully calibrated, miniature digital OAQ sensor solution with selective ozone measurement capabilities, offering visibility into the air quality in users’ imme...

Micros
15th June 2021
Support extended for Microsoft Azure RTOS across 32-bit MCU Families

Renesas Electronics has announced that customers designing with all mainstream Renesas 32-bit MCU families now have access to Microsoft Azure Real Time Operating System (RTOS) embedded development suite, including its powerful Azure IoT middleware. Azure RTOS is integrated and available out-of-box in the recently released Flexible Software Package (FSP) version 3.0 for the Renesas’ RA Family MCUs, and the Synergy Software Pac...

Industrial
27th May 2021
Small IGBT and IPM drivers for industrial applications

Renesas Electronics has expanded its family of 8.2mm creepage photocouplers with three new devices designed for operation in harsh industrial automation equipment, solar inverter, and EV charger operating environments. Measuring a mere 2.5x2.1mm in an LSSO5 package, the world’s smallest optical isolated IGBT drivers and Intelligent Power Module (IPM) driver reduce PCB mounting areas by up to 35% compared with other devices on the marke...

IoT
26th May 2021
Cellular IoT module simplifies development and deployment

Renesas Electronics has introduced the RYZ014A, Renesas’ first cellular IoT module supporting the LTE Cat-M1 specification. This technology allows devices to directly connect to the internet without the need for a gateway by relying on the existing communication infrastructure owned by mobile network operators.

Micros
19th May 2021
MPUs feature power efficiency and high precision AI accelerator

Renesas Electronics has announced the expansion of its RZ/V Series of microprocessors (MPUs) with the new RZ/V2L MPUs designed for entry-level AI-enabled applications. As part of the RZ/V Series, the new MPUs incorporate Renesas’ exclusive AI accelerator - the DRP-AI (Dynamically Reconfigurable Processor) - to make embedded AI easier and more power efficient. 

Design
29th April 2021
I3C portfolio qualified on AMI Firmware platform

Renesas Electronics has announced that AMI, a firmware and software solutions partner, has qualified the Renesas I3C bus extension products for its MegaRAC SP-X Remote Management Firmware. Having the I3C devices on AMI’s approved vendor list enables an easy migration path for customers shifting their DDR5 platforms and boards from I2C or other legacy expansion specifications to the new high-speed I3C specification.

Design
27th April 2021
FemtoClock timing portfolio for communications released

Renesas Electronics has expanded its timing solutions portfolio with a new sub-100fs point-of-use clock solution for data centre, server, and network infrastructure markets. The new FemtoClock2 family includes ultra-low jitter clock generators and jitter attenuators in a small 4x4mm2 package, enabling cost-effective and simple clock tree implementation for next-generation, high-speed interconnect designs.

Micros
22nd April 2021
MCU obtains CMVP Level 3 Certification under NIST FIPS 140-2 Security Standard

Renesas Electronics has announced that its 32-bit RX65N microcontroller (MCU) has achieved Cryptographic Module Validation Program (CMVP) Level 3 certification under the FIPS 140-2 security standard by the National Institute of Standards and Technology (NIST). According to Renesas the RX65N is the world’s first general-purpose MCU to obtain level 3 certification.

Automotive
21st April 2021
Partnership for developing automotive RISC-V solutions

Renesas Electronics and SiFive have announced a strategic partnership to jointly develop next-generation, high-end RISC-V solutions for automotive applications. The partnership will also include SiFive licensing the use of their RISC-V core IP portfolio to Renesas.

5G
14th April 2021
Qualcomm reference design extends 30W wireless charging to smartphones

Renesas Electronics has expanded its ongoing work with Qualcomm Technologies, to include 30W wireless charging capabilities for mid-range smartphones powered by the latest Qualcomm Snapdragon 780G 5G Mobile Platform. This is the second high power wireless charging smartphone reference design collaboration for the two companies. 

Micros
13th April 2021
Low power 16-Bit general-purpose RL78/G23 MCUs launched

Renesas Electronics has announced the launch and the beginning of mass production of its 16-bit general-purpose RL78/G23 microcontroller (MCU), further strengthening its RL78 Family of 8-bit and 16-bit MCUs for a broad range of applications. 

IoT
6th April 2021
Renesas launches RX23W module with Bluetooth for system control

Renesas Electronics has introduced the RX23W Module with full Bluetooth 5.0 Low Energy support for system control and wireless communication on IoT endpoint devices. Featuring the RX23W 32-bit RX MCU supporting fully integrated Bluetooth Low Energy communication, the new RX23W module is equipped with an antenna, oscillator and custom-matched circuit. 

Micros
1st April 2021
Line of RA6 Series Arm Cortex M33-based MCUs launched

Renesas Electronics has announced the expansion of its RA6 Series microcontrollers (MCUs) with 20 new RA6M5 Group MCUs, completing the mainstream line of RA6 Series devices. The new parts offer a very wide array of communications options, generous on-chip memory, and Renesas’ security features, enabling customers to create new and innovative IoT designs.

Power
30th March 2021
Complete power and functional safety solution for R-Car V3H SoC

Renesas Electronics has announced a new power and functional safety solution for systems based on the R-Car V3H System-on-Chip (SoC) for Advanced Driver Assistance Systems (ADAS) automotive front cameras and driver monitor cameras.

Micros
25th March 2021
MCU with Bluetooth 5 support expands low power RE Family

Renesas Electronics has introduced the RE01B microcontroller (MCU) with Bluetooth 5.0 support, expanding its RE Family of 32-bit ultra-low power consumption MCUs. Developed using Renesas’ breakthrough SOTB (Silicon on Thin Buried Oxide) process technology, the new Bluetooth-capable RE01B MCU is suitable for energy harvesting systems and intelligent IoT devices that need to operate constantly at extremely low power levels without t...

Communications
23rd March 2021
Renesas expands communication timing portfolio for 4G/5G Radio

Renesas Electronics has expanded its communication timing portfolio with three new low phase noise, high frequency RF timing solutions for 4G and 5G radio, and two new combinations to address the need for full signal chain solutions. The new 8V19N850 radio synchroniser and 8V19N880, 8V19N882 JESD204B/C clock jitter attenuators deliver ITU-T compliant network clock synchronisation, phase noise, and high clock frequency.

Micros
10th March 2021
Renesas extends IoT security leadership for RA family MCUs

Renesas Electronics has announced both PSA Certified Level 2 and Security Evaluation Standard for IoT Platforms (SESIP) certifications for its RA Family of 32-bit Arm Cortex-M microcontrollers (MCUs).

Aerospace & Defence
25th February 2021
JAXA’s Hayabusa2 Spacecraft enabled by Rad-Hard ICs

Renesas Electronics has announced that its radiation-hardened (rad-hard) integrated circuits (ICs) were onboard the Hayabusa2 spacecraft that returned asteroid samples to Earth in an armored re-entry capsule on 6th December, 2020. Operated by the Japan Aerospace Exploration Agency (JAXA), Hayabusa2 launched onboard the H-IIA rocket from the Tanegashima Space Center on December 3, 2014.

Automotive
24th February 2021
Duo develop open platform turnkey solution with R-Car SoCs

Renesas Electronics and LUPA-Electronics, an automotive safety solution provider, have announced the EagleCAM module, an open front camera solution, featuring Renesas’ R-Car V3H and R-Car V3M System-on-Chip (SoC) devices. The all-in-one scalable camera platform targets the latest Euro NCAP and C-NCAP requirements, such as automatic emergency braking, forward collision warning, lane keeping assist, and traffic s...

Automotive
17th February 2021
Automotive SoC functional safety tech for CNN accelerator cores

Renesas Electronics has announced the development of processor technologies for automotive Systems-on-Chip (SoCs) used in applications such as Advanced Driver Assistance Systems (ADAS) and Autonomous Driving (AD) systems that aim to optimise both performance and power efficiency while supporting a high level of functional safety.

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