Renesas Electronics has introduced the ZSSC4132 - an automotive pressure sensor solution featuring an integrated certified LIN v2.2a interface. The single-package Sensor Signal Conditioner (SSC) delivers performance, increased design flexibility, and cost efficiency in a compact form factor for HVAC applications used in Plug-in Hybrid Electric Vehicle (PHEV), Battery Electric Vehicle (BEV), and Fuel-cell Electric Vehicle (FCEV) climate contr...

Renesas Electronics has announced that Continental has adopted Renesas’ high performance Renesas R-Car M3 System-on-Chip (SoC) for its first-generation Body High Performance Computer (HPC). The HPC is an automotive computing platform that provides centralised control of vehicle systems and is equipped with secure gateway functionality to enable cloud service connectivity.

Renesas has expanded its RE Family lineup of embedded controllers with a new ultra-low power consumption member based on Renesas’ Silicon-On-Thin-Buried-Oxide (SOTB) process technology and built around the Arm Cortex-M0+ core. The newest member of the RE01 Group lineup is a 256KB flash memory variant in addition to the 1.5MB flash memory embedded controller, already in mass production.

Renesas has introduced the HIP2211 and HIP2210, a new pair of 100V half-bridge MOSFET drivers. The HIP2211 is a next-generation pin-compatible upgrade to Renesas’ popular ISL2111 bridge driver, while the new HIP2210 offers a tri-level PWM input to simplify power supply and motor drive design. The HIP2211 and HIP2210 are suitable for 48V telecom power supplies, Class-D audio amplifiers, solar inverters, and UPS inverters.

Renesas has introduced the magnet-free IPS2200 inductive position sensor. Featuring high accuracy and speed, total stray field immunity, and efficient motor integration in a thin and lightweight form factor, the IPS2200 is suitable for use as an absolute position sensor in a wide range of industrial, medical, and robot applications.

Renesas Electronics has expanded its ZMOD4410 Indoor Air Quality platform sensor with the power of embedded Artificial Intelligence (e-AI), enabling smart odor sensing for ventilation systems, bathroom monitoring and controls, and air quality monitors.

Renesas Electronics has introduced the RZ/V series of microprocessors (MPUs), which features DRP-AI (Dynamically Reconfigurable Processor), Renesas’ exclusive vision-optimised AI accelerator. The first product in the series, the RZ/V2M, is designed to deliver a combination of real time AI inference and power efficiency in embedded devices.

Renesas has unveiled four new I3C Basic bus extension products for control plane designs across a variety of applications, including data centre and server applications, as well as enterprise, factory automation, and communications equipment.

Renesas Electronics has introduced the ZSSC3240 Sensor Signal Conditioner (SSC) - the newest member of its SSC portfolio. The ZSSC3240 delivers high accuracy, sensitivity, and flexibility for sensor applications such as resistive pressure sensors and medical infrared thermometers. This new SSC features performance and speed with up to 24 bits Analog-to-Digital Conversion (ADC) resolution.

Renesas has introduced the first RA microcontroller (MCU) with an integrated Bluetooth 5.0 connectivity Low Energy radio. The single chip RA4W1 MCU includes a 48MHz, 32-bit Arm Cortex-M4 core and Bluetooth 5.0 core delivered in a 56-pin QFN package.

Renesas has announced a new precision temperature sensor, the TS5111, targeting DDR5 memory modules as well as a host of other applications such as solid-state disks (SSDs), computing motherboards, and communications equipment that require accurate, real time temperature monitoring.

Renesas Electronics has announced the release of a new update of its Flexible Software Package (FSP) for the Renesas RA Family of 32-Bit Arm Cortex-M microcontrollers (MCUs). The FSP version 1.0 adds new security and connectivity features, advanced neural network, machine learning and motor control capabilities, as well as enhanced compiler, debugger, and development environments.

Renesas has introduced a new open-source ventilator system reference design that customers can use to swiftly design ready-to-assemble boards for medical ventilators. Many regions are experiencing a critical shortage of ventilators as COVID-19 infections continue to rise and hospital demand exceeds supply.

Renesas Electronics has announced the RX72N Group and RX66N Group of 32-bit microcontrollers (MCUs), new additions to the RX Family that combines equipment control and networking function on a single chip.

Renesas Electronics has introduced a new Renesas Solution MCU Starter Kit (RSSK) for developers working with the 32-bit RX23E-A microcontroller (MCU), which features a highly accurate analogue front ends (AFE).

Renesas Electronics has deepened its collaboration with Microsoft to offer seamless device-to-cloud experience for IoT developers. In October 2019, the two companies began a collaboration to deliver a complete chip-to-cloud IoT solution based on Renesas’ microcontroller (MCU) and microprocessor (MPU) devices and Microsoft Azure IoT building blocks, including Azure RTOS, Azure IoT device SDK for C, IoT Plug and Play, IoT Central and IoT Hub.

Renesas Electronics has announced the effects on Renesas Group’s production sites from the coronavirus disease (COVID-19) pandemic as of March 26, 2020.

Renesas Electronics has launched the RX13T Group of 32-bit microcontrollers (MCUs) to enable highly efficient inverter control of compact motors such as fans or pumps in consumer and industrial applications that previously controlled motor operation through on-off switching.

Renesas Electronics has announced that Panasonic has adopted Renesas’ R9A06G037 Power Line Communication (PLC) IC for its new railway platform lighting control system.

Renesas Electronics has announced three easy to use Power Management IC (PMIC) reference designs for powering the multiple supply rails of Xilinx Artix-7 FPGAs, Spartan-7 FPGAs, and Zynq-7000 SoCs, with and without DDR memory.