Renesas

Address:
Renesas Electronics Europe GmbH
Arcadiastr. 10
40472 Duesseldorf
Germany

United Kingdom

Phone: +49 (0)211 6503-0

Web: www.renesas.eu

The merger in April 2010 between NEC Electronics and Renesas Technology has given birth to Renesas Electronics.
As a semiconductor manufacturer, we strive to be the first to meet the needs of our customers worldwide with the aim of becoming one of their most trusted partners.


Renesas articles

Displaying 1 - 20 of 569

Accurate cell measurement in battery management systems

Accurate cell measurement in battery management systems
  Automotive battery management system (BMS) design has evolved as battery chemistry, reliability and technology have stabilised, writes Niall Lyne, senior product line director in the Automotive Business Unit at Renesas Electronics
24th January 2020

Power supply design for automotive surround view camera systems

Power supply design for automotive surround view camera systems
Renesas has announced the ISL78083, a highly integrated power management IC (PMIC) that simplifies power supply design for use in multiple HD camera modules, reducing development cycles, BoM cost and supply chain risks. The automotive camera PMIC accepts direct-from-battery (36-42V) or power-over-coax (15-18V) supply sources and supports output currents up to 750mA per output. This power level offers ample headroom for existing image sensors up to seven megapixel and future sensors with even higher resolution.
8th January 2020

High efficiency power management IC adopted in AI products

High efficiency power management IC adopted in AI products
Renesas has announced its ISL91301B Power Management IC (PMIC) is designed into the latest Google Coral products. They include the Mini PCIe Accelerator, M.2 Accelerator A+E Key, M.2 Accelerator B+M Key, and System-on-Module (SoM). Google Coral integrates seamlessly into processes at any scale, helping designers create a variety of local Artificial Intelligence (AI) solutions for several industries.
7th January 2020


Power solutions support devices for cloud edge applications

Power solutions support devices for cloud edge applications
Renesas has announced that its power solutions, as well as timing solutions from IDT, a wholly-owned subsidiary of Renesas, support the Xilinx Versal Adaptive Compute Acceleration Platform (ACAP) devices featured on the Xilinx VCK190 evaluation kit and the Renesas VERSALDEMO1Z power reference board. Built on 7nm process technology, according to the company, Versal is the industry's first ACAP platform that addresses the needs of a wide range of applications in data centre, automotive, 5G wireless, and wired and defence markets.
17th December 2019

Using a phone as a wireless power transmitter

WattShare enables smart devices, such as smartphones, to charge wirelessly and then, to provide power wirelessly to accessory devices, such as smart watches and wearable devices, and earbud cases.
12th December 2019

Photocouplers designed for industrial automation applications

Photocouplers designed for industrial automation applications
Renesas has announced five new 8.2mm creepage photocouplers that are, according to the company, the world’s smallest isolation devices for industrial automation equipment and solar inverters. With a package width of 2.5mm, the RV1S92xxA and RV1S22xxA photocouplers reduce PCB mounting area by 35% compared to competitive couplers. They help designers shrink equipment size, increase robot axes, and improve factory floor productivity.
12th December 2019

Enhanced security for Bluetooth 5 Connections with microcontroller

Enhanced security for Bluetooth 5 Connections with microcontroller
Renesas has introduced the RX23W - a 32-bit microcontroller (MCU) featuring Bluetooth 5.0 for IoT endpoint devices such as home appliances and healthcare equipment. By combining Bluetooth 5.0 with Renesas’ Trusted Secure IP on its popular high performance RX MCU family, Renesas offers customers an optimised single-chip solution for system control and wireless communication, while also providing a more secure way to answer the Bluetooth security risks such as eavesdropping, tampering, and viruses.
4th December 2019

TSN enables seamlessly linked interoperation between IT and OT

TSN enables seamlessly linked interoperation between IT and OT
  Renesas has announced the development of the R-IN32M4-CL3 IC for industrial Ethernet (IE) communication. Renesas’ latest industrial network device heralds support for CC-Link IE Time Sensitive Networking (TSN), a communication standard for next-gen Ethernet TSN technology.
29th November 2019

Silicon solution delivers easy integration

Silicon solution delivers easy integration
Renesas has recently introduced the ASI4U-V5 ASSP - according to the company it is the industry’s first silicon solution to fully implement the ASi-5 (Actuator Sensor Interface version specification version 5) standard for industrial network equipment. ASi-5 offers performance and usability over ASi-3, delivering 1.27 ms cycle time, 200m cable length and 96 slaves per segment.
28th November 2019

Microcontroller ecosystem expands with ready to use partner solutions

Microcontroller ecosystem expands with ready to use partner solutions
Renesas has announced the first ten ready to use partner solutions that support the RA MCU Family of 32-bit Arm Cortex-M MCUs. RA MCUs deliver optimised performance and ease of use with the Flexible Software Package (FSP) and partner building block solutions that work out-of-box to address a range of IoT endpoint and edge applications.
27th November 2019

Energy harvesting embedded controller portfolio launched

Energy harvesting embedded controller portfolio launched
Renesas has introduced its RE Family, which encompasses the company’s current and future lineup of energy harvesting embedded controllers. The RE Family is based on Renesas’ proprietary SOTB process tech, which dramatically reduces power consumption in both the active and standby states, eliminating the need for battery replacement or recharging.
31st October 2019

Collaboration to enable rapid Out-of-the-Box cloud connectivity

Collaboration to enable rapid Out-of-the-Box cloud connectivity
  Renesas Electronics has announced the ability to simplify the device-to-cloud experience for IoT developers. Renesas’ extensive secure embedded design experience will be combined with easy and seamless out-of-the-box support for Microsoft Azure RTOS across Renesas’ microcontroller (MCU) and microprocessor (MPU) portfolio.
28th October 2019

Micros provide advanced security for intelligent IoT applications

Micros provide advanced security for intelligent IoT applications
Renesas Electronics has unveiled the Renesas Advanced (RA) Family of 32-bit Arm Cortex-M MCUs. RA MCUs deliver the ultimate combination of optimised performance, security, connectivity, peripheral IP, and easy-to-use Flexible Software Package (FSP) to address the next generation of embedded solutions. To support the new family, Renesas has built a comprehensive partner ecosystem to deliver an array of software and hardware building blocks that will work out of the box with RA MCUs.
8th October 2019

DRP-accelerated image processing with MPUs

The Dynamically Reconfigurable Processor (DRP) is runtime-reconfigurable hardware that combines the flexibility and expansion capability of a software programmable CPU with the performance and efficiency of dedicated IP. 
28th August 2019

Digital multi-phase controllers power the IoT cloud

Digital multi-phase controllers power the IoT cloud
  Power designers have to efficiently power and cool data centre and networking equipment, while ensuring minimal electricity usage, says Chance Dunlap, Renesas Electronics
5th August 2019

Micros for IoT connectivity modules and space-constrained edge devices

Micros for IoT connectivity modules and space-constrained edge devices
Renesas Electronics has announced four new RX651 32-bit microcontrollers (MCUs) supplied in ultra-small 64-pin BGA and LQFP packages. The new lineup expands Renesas’ popular RX651 MCU Group with a 64-pin (4.5x4.5mm) BGA package that reduces footprint size by 59% compared to the 100-pin LGA, and a 64-pin (10x10mm) LQFP that offers a 49% reduction versus the 100-pin LQFP.
30th July 2019

Family of photocouplers deliver low threshold input current

Family of photocouplers deliver low threshold input current
Renesas Electronics has announced three new 15Mbps photocouplers designed to withstand the harsh operating environments of industrial and factory automation equipment. The trend toward higher voltage, compact systems is driving stricter International safety standards and eco-friendly solutions that require smaller ICs with lower power consumption.
23rd July 2019

New processing-in-memory technology for next-gen AI chips

New processing-in-memory technology for next-gen AI chips
Renesas has announced it has developed an AI accelerator that performs CNN (Convolutional Neural Network) processing at high speeds and low power to move towards the next generation of Renesas embedded AI (e-AI), which will accelerate increased intelligence of endpoint devices. A Renesas test chip featuring this accelerator has achieved the power efficiency of 8.8 TOPS/W (Note 1), which according to the company, is the industry's highest class of power efficiency.
4th July 2019

Microcontrollers with EtherCAT support for industrial applications

Microcontrollers with EtherCAT support for industrial applications
Renesas Electronics has introduced the RX72M Group of RX microcontrollers (MCUs) featuring an EtherCAT slave controller for industrial Ethernet communication. The new flagship product group for the Renesas RX family offers a high performance, single-chip MCU solution with large memory capacities for industrial equipment requiring control and communication functions such as compact industrial robots, programmable logic controllers, remote I/O, and industrial gateways.
3rd July 2019

Flash memory achieves larger capacities and faster read operation

Flash memory achieves larger capacities and faster read operation
Supplier of advanced semiconductor solutions, Renesas Electronics, has announced the development of a new flash memory technology that achieves larger memory capacities, higher readout speeds, and over-the-air (OTA) support for automotive microcontrollers (MCUs) using the next-generation 28nm process.
13th June 2019


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