Infineon Technologies AG
We make life easier, safer and greener
The world’s swelling population, more and more megacities and the rising demand for energy is prompting us to rethink many aspects of our modern lifestyle.
Semiconductor and system solutions from Infineon contribute to a better future – making our world easier, safer and greener. These tiny, barely visible electronic components have become an indispensable part of our daily lives. They help to feed regenerative energy into power grids with almost zero losses, tame power-hungry computers, safeguard the data flying through cyberspace and make our cars more energy-efficient.
Infineon Technologies AG Articles
High density QDR-II+ SRAM for satellite image processing
Infineon Technologies has announced its next-generation 144-Mb Quad Data Rate II+ (QDR-II+) SRAM that is certified to the DLA Qualified Manufacturers List Class V (QML-V). QML-V is the highest quality and reliability standard certification for aerospace-grade ICs. This radiation-hardened (rad hard) 144-Mb QDR-II+ SRAM is a unique high-speed external cache memory ideal for radar, on-board data processing and networking applications in space.
Infineon increases supply security for silicon carbide
Infineon Technologies has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy. The German semiconductor manufacturer has thus secured more base material for the growing demand for SiC-based products.
Half bridge CoolGaN IPS modules target low-medium power
Infineon introduces the 600 V CoolGaN half bridge integrated power stage (IPS), the IGI60F1414A1L for low to medium power applications
Isolated EiceDRIVER 2L-SRC optimising system efficiency
Highest efficiency is a key requirement for today’s power electronics. Therefore, Infineon Technologies has introduced its latest isolated EiceDRIVER 2L-SRC Compact (1ED32xx) gate driver family in a compact form factor.
Hybrid flyback controller delivers high power density
To meet the increasing demand for higher power density and energy efficiency, Infineon Technologies has expanded its XDP family by adding the first application-specific standard product based on an asymmetric half-bridge flyback topology.
HybridPACK Drive CoolSiC released for automotive
Infineon Technologies has introduced a new automotive power module with CoolSiC MOSFET technology. At this year’s virtual PCIM trade show, Infineon will present the new HybridPACK Drive CoolSiC, a full-bridge module with 1,200V blocking voltage optimised for traction inverters in electric vehicles (EV).
Infineon revenues advance 3 % in Q2
Infineon revenues grew 3 % sequentially and 36 % year on year to $2.7bn in Q2. The company is forecasting revenues of between $2.6bn and $2.9bn in Q3.
EasyDUAL CoolSiC MOSFET for increased power density
Infineon Technologies has upgraded the EasyDUAL CoolSiC MOSFET modules with a new aluminum nitride (AIN) ceramic. The devices come in half-bridge configuration with an on-state resistance (R DS(on)) of 11mΩ in an EasyDUAL 1B package and 6mΩ in an EasyDUAL 2B package.
Reference boards for rotary fridge compressor drives
Infineon Technologies has introduced two new reference boards designed for rotary refrigerator compressors supporting Infineon’s motto ‘From product thinking to system understanding’. Both boards are turnkey solutions for low power compressors that can be easily copied by customers to build final mass-production application boards.
EiceDRIVER X3 gate drivers with reinforced isolation
Infineon Technologies has expanded its easy-to-design EiceDRIVER X3 Compact (1ED31xx) and the highly flexible EiceDRIVER X3 Enhanced Analog (1ED34xx) and Digital (1ED38xx) gate driver families. Both families now offer variants with superior reinforced isolation for higher application safety and long operating life.
Infineon at the Virtual Power Conference
Power semiconductors are the key to an energy-efficient world. New technologies such as silicon carbide (SiC) and gallium nitride (GaN) enable higher power efficiency, smaller form factors and lower weight. Silicon also plays a major role in many designs. Energy efficiency is the focus of the ‘Virtual Power Conference’, which will be available ‘live’ from May 4th to 6th, 2021.
AEC-Q103 qualified XENSIV MEMS microphone for automotive
Infineon Technologies has announced the launch of the XENSIV IM67D130A. This new device combines the company’s expertise in the automotive industry with its technical knowledge in high-end MEMS microphones to address the need for high performance, low-noise MEMS microphones for automotive applications.
600V CoolMOS S7 MOSFETs for static switching applications
Infineon Technologies has announced that it is enhancing the 600V CoolMOS S7 family with two new optimised devices for static switching applications: the industrial-grade CoolMOS S7 10mΩ and the automotive-grade CoolMOS S7A.
Infineon repays outstanding Cypress acquisition financing
Infineon Technologies has successfully signed a $1.3bn US private placement of notes. The proceeds of the transaction will be used to repay existing US Dollar bank term loans related to the acquisition of Cypress Semiconductor Corporation.
600V CoolMOS S7 family expanded with MOSFETs
In applications where MOSFETs are switched at low frequency, high-power product designs must meet several key characteristics: They have to minimise conduction losses, provide optimal thermal behavior, and enable more compact and lighter systems – all while maintaining the highest quality at a low cost.
Higher current power diodes with lower on-state losses
Infineon Technologies has launched a new generation of power diodes. The new housingless diode family is designed for medium frequency resistance welding and high current rectifier applications. The devices meet the market requirements for higher forward current, low conduction losses and higher power cycling capability.
High-reliability non-volatile SRAM launched
Infineon Technologies has announced the availability of its second-generation non-volatile SRAMs (nvSRAM). The new generation of devices are qualified for QML-Q and high-reliability industrial specifications to support demanding non-volatile code storage and data-logging applications in harsh environments, including aerospace and industrial applications.
Collaboration for efficient on-board electrical systems
Siemens Mobility and Infineon Technologies have jointly developed new auxiliary converters to improve the efficiency of on-board power systems using power semiconductors based on silicon carbide (SiC).
EiceDRIVER with bootstrap diodes for frequency switching
Infineon Technologies has broadened its EiceDRIVER portfolio with new 650V half-bridge and high and low side gate drivers. The new devices are based on the company’s unique silicon-on-insulator (SOI) technology. They provide leading negative VS transient voltage immunity and monolithic integration of real bootstrap diodes.
TPM 2.0 software stack with security integration
To facilitate integration in Linux-based systems, Infineon Technologies has announced that it now provides its OPTIGA TPM 2.0 solution with a TSS host software implementing the latest FAPI standard. Infineon has developed the open-source software jointly with Intel Corporation and Fraunhofer Institute for Secure Information Technology SIT.