Infineon Technologies AG

Address:
Am Campeon 1-12
85579 Neubiberg
Bavaria


85579 Neubiberg
Germany

Phone: +49-89-234 28480

Web: www.infineon.com

We make life easier, safer and greener

The world’s swelling population, more and more megacities and the rising demand for energy is prompting us to rethink many aspects of our modern lifestyle.

Semiconductor and system solutions from Infineon contribute to a better future – making our world easier, safer and greener. These tiny, barely visible electronic components have become an indispensable part of our daily lives. They help to feed regenerative energy into power grids with almost zero losses, tame power-hungry computers, safeguard the data flying through cyberspace and make our cars more energy-efficient.


Infineon Technologies AG articles

Displaying 1 - 20 of 289

Embedded Vision Alliance awards image sensor as 'Product of the Year'

Embedded Vision Alliance awards image sensor as 'Product of the Year'
Smartphone cameras increasingly require 3D vision capabilities as differentiating factor. Hence, Infineon Technologies developed the REAL3 IRS2381C, a premier 3D imager sensor solution especially designed for the mobile device market. The Embedded Vision Alliance now awarded the 3D Time-of-Flight (ToF) single chip solution as 'Product of the Year' in the category 'Sensors'.
24th May 2019

Broad portfolio of CoolSic MOSFETs in discrete housing launched

Broad portfolio of CoolSic MOSFETs in discrete housing launched
Infineon Technologies enters high volume production of a comprehensive portfolio of 1,200V CoolSiC MOSFET devices. They are rated from 30-350mΩ and implemented into TO247-3 and TO247-4 housings. The expansion includes a surface mount device (SMD) portfolio and a 650V CoolSiC MOSFET product family, both to be launched soon.
17th May 2019

Stable coreless current sensors for industrial applications

Stable coreless current sensors for industrial applications
At this year’s PCIM trade fair, Infineon Technologies will launch a new family of current sensors and is presenting its first member. The family will consist of precise and stable coreless Hall sensors. They offer a high level of flexibility as customers can individually program product parameters such as the current range, the overcurrent threshold and the output mode.
7th May 2019


Three-phase inverter module IPM offers high power density

Three-phase inverter module IPM offers high power density
A new member has been added to the growing family of intelligent power modules (IPMs): CIPOS Tiny from Infineon Technologies. The three-phase inverter module is the newest generation of IPM to offer the highest power density for variable speed motor drives. By using the latest TRENCHSTOP IGBT6, it is possible to realise maximum efficiency with minimum footprint.
30th April 2019

High-efficiency, two-stage architecture power distribution

High-efficiency, two-stage architecture power distribution
A zero-voltage-switching (ZSC) switched capacitor converter has been introduced by Infineon Technologies. It features a two-stage architecture for 48V applications to power up CPUs, GPUs, SoCs, ASICs, and memory. Infineon’s full system concept for 48V architecture paves a way towards 99% of efficiency.
29th April 2019

Success in Japan with automotive semiconductors

Success in Japan with automotive semiconductors
According to the latest research from Strategy Analytics, Infineon Technologies increased its automotive business in Japan by almost 25% in 2018. It thus grew faster than any other of the top ten automotive semiconductor suppliers in the country. Japan accounts for approximately ten percent of global car production. 
23rd April 2019

Broad 12mm power module portfolio without base plate

Broad 12mm power module portfolio without base plate
It has been announced that Infineon Technologies has extended its Easy family to include a new package: Easy 3B. Together with the other Easy 1B and 2B packages, this comprises the broadest power module portfolio at 12mm height without base plate. Easy 3B is a well suited platform to extend current inverter designs to achieve higher power without changing much on the mechanical side.
15th April 2019

More space for innovation with expanded development site

More space for innovation with expanded development site
It has been announced that Infineon is hoping to strengthen its research and development efforts in the field of high-frequency components. To this end the Infineon Austria holding company DICE (Danube Integrated Circuit Engineering) in Linz will be provided with a new home.
8th April 2019

Power module designed for compact and scalable inverter designs

Power module designed for compact and scalable inverter designs
Infineon Technologies extents its large portfolio of high voltage devices with a new package: XHP 3. This is a new flexible IGBT module platform for high power applications in the voltage range from 3,3kV up to 6,5kV. The module allows for scalable designs with reliability and highest power density. Due to its symmetrical design with low stray inductance it offers significantly improved switching behaviour.
4th April 2019

Micro IPM adds IGBT based IM231 series for highest power density

Micro IPM adds IGBT based IM231 series for highest power density
Infineon Technologies is introducing its CIPOS Micro IM231 series, a family of 600V rated Intelligent Power Modules (IPM). It is qualified for harsh humid environments, passing 1,000 hours of high voltage, high temperature and high humidity reverse bias (HV H3TRB) stress testing. For this reason, the energy-efficient IPM suits power appliance motor drives particularly in circulator hydronic pumps, drain pumps for washing machines, dishwashers, and kitchen hoods.
1st April 2019

Voltage regulator solution for AI and 5G networking

Voltage regulator solution for AI and 5G networking
Extending its portfolio of high current system chipset solutions, Infineon Technologies has introduced a 16-phase digital PWM multiphase controller, the XDPE132G5C. The portfolio enables currents of 500 to 1,000A and higher for next generation CPUs, GPUs, FPGA and ASICs used in high-end artificial intelligence (AI) servers and 5G datacom applications.
25th March 2019

Integrated voltage regulator with Intel SVID and PMBus support

Integrated voltage regulator with Intel SVID and PMBus support
Power density is key in latest space constrained storage, netcom, servers and telecom designs. Infineon Technologies has introduced the newest member of its integrated point-of-load product family, the IR38164 DC-DC POL converter. Infineon's IR38x6x family offers either full SVID compatibility or 3-bit PVID flexibility. This makes it easy to design and support Intel CPU and chipset POL rails in Intel systems.
20th March 2019

The device for advanced, smart and connected LED drivers

The device for advanced, smart and connected LED drivers
The emerging trend of smart lighting and the Internet of Things, requires a new generation of LED drivers. Infineon Technologies has introduced the new member of its XDP LED series, the XDPL8221 for cost-effective dual-stage drivers with advanced features. This device combines a quasi-resonant PFC and a quasi-resonant flyback controller with primary side regulation together with a communication interface. 
12th March 2019

Smart IPM motor controllers for BLDC motor drives

Smart IPM motor controllers for BLDC motor drives
Smart IPM motor controllers featuring full hardware and software integration needed for BLDC motor drives of up to 80W without heatsink have been introduced by Infineon Technologies. The new iMOTION IMM100 series combines the motor controller IC and a three-phase inverter stage in a single, highly compact 12x12mm2 PQFN package.
22nd February 2019

New microcontroller solutions in safety-critical applications

New microcontroller solutions in safety-critical applications
In order to provide more flexibility in how to use safety microcontrollers in automotive and industrial applications, Infineon has cooperated with Xilinx and Xylon. At Embedded World, they will present a new Xylon IP core called logiHSSL. It enables communication between Infineon’s AURIX TC2xx and TC3xx microcontrollers and Xilinx’ SoC, MPSoC and FPGA devices via the Infineon High Speed Serial Link. This supports baudrates of up to 320 Mbaud at a net payload data-rate of up to 84%.
22nd February 2019

Enhanced selfie depth for front-facing camera

Enhanced selfie depth for front-facing camera
It has been announced that LG Electronics and Infineon Technologies have teamed up to introduce their Time-of-Flight (ToF) technology to smartphone selfie photo lovers world over. Infineon’s REAL3 image sensor chip hopes to play a key role in the front-facing camera of the upcoming LG G8 ThinQ, to be unveiled in Barcelona during Mobile World Congress 2019.
8th February 2019

MOSFET power modules for energy storage applications

MOSFET power modules for energy storage applications
Addressing the fast growing demand for Silicon Carbide (SiC) solutions, Infineon Technologies launches new devices in the 1200V CoolSiC MOSFET family. The CoolSiC Easy 2B power modules enable engineers to reduce system costs by increasing power density. In addition, they can also reportedly lower operational costs significantly. 
31st January 2019

Thyristor modules combine right fit functionality and reliability

Thyristor modules combine right fit functionality and reliability
The product portfolio of 60 mm thyristor/diode modules with pressure contact technology from Infineon Technologies Bipolar has been redesigned. The new Eco Block family addresses the demand for cost-efficient larger modules for battery chargers, static and bypass switches and windmills.
17th January 2019

From idea to real prototype in a fast, flexible and lean way

From idea to real prototype in a fast, flexible and lean way
The automotive industry request sensor prototypes to test new algorithms and application possibilities in the early stage of their design. For this reason, Infineon developed a new methodology, allowing a smooth transition from idea to implementation. By Simone Fontanesi, Gaetono Formato, Andrea Monterastelli, Infineon Technologies
20th December 2018

Two channel isolated gate-driver IC family

Two channel isolated gate-driver IC family
A new family of two-channel isolated EiceDRIVER ICs for use in high-performance power conversion applications has been introduced by Infineon Technologies. The new gate-driver IC family is ideally suited for high-voltage PFC and DC/DC stages as well as for synchronous rectification stages in server, telco and industrial switching mode power supplies (SMPS). 
28th November 2018


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Sensor+Test 2019
25th June 2019
Germany Nürnberg Messe
DSEI 2019
10th September 2019
United Kingdom EXCEL, London
European Microwave Week 2019
29th September 2019
France Porte De Versailles Paris
Engineering Design Show 2019
16th October 2019
United Kingdom Ricoh Arena, Coventry
ELIV 2019
16th October 2019
Germany Bonn World Conference Center