Constanze Hufenbecher, member of the Management Board of Infineon Technologies and Chief Digital Transformation Officer (CDTO), has informed the Supervisory Board that she will not extend her contract, which runs until April 2024, and will leave the company at the end of this period. 

Constanze Hufenbecher, Member of the Management Board of Infineon Chief Digital Transformation Officer (CDTO), has informed the Supervisory Board that she will not extend her contract, which runs until April 2024, and will leave the company at the end of this period. The Supervisory Board has accepted her wish with great regret.

Infineon in Villach is launching two European research projects into power electronics and AI: ‘ALL2GaN’ & ‘AIMS5.0.’

Infineon technologies has announced that Infineon has acquired the Stockholm-based startup Imagimob AB, a platform provider for Machine Learning solutions for edge devices.

The decentralisation of the Internet and blockchain technology, such as Infineon’s SECORA Blockchain, brings many benefits to everyday life and the economy.

Infineon Technologies is taking over coordination of the wide-scope European research project AIMS5.0 ("Artificial Intelligence in Manufacturing Leading to Sustainability and Industry 5.0"). 

As cities grow, public transport operators must cope with ever-increasing numbers of passengers, especially during major events such as football matches and the Olympic Games.   

Today’s 3.3kW switched-mode power supplies (SMPS) can achieve power densities of 100W/inch³ by utilising the latest technologies, including superjunction (SJ silicon) and silicon carbide (SiC) power MOSFETs in the totem-pole PFC stage as well as gallium nitride (GaN) power switches for high-voltage DC-DC stage operation.

Infineon Technologies and Hon Hai Technology Group are aiming to establish a long-term partnership in the field of EV to jointly develop advanced electromobility with efficient and intelligent features.

To meet global climate targets, transportation must shift to more environmentally friendly vehicles such as energy-efficient electrified trains.

Infineon Technologies has signed a long-term agreement with Chinese SiC wafers supplier TanKeBlue to secure additional competitive SiC sources.

Construction work has started on Infineon’s 5 billion Euro wafer fab in Dresden. It is the largest single investment in Infineon’s history.

Infineon has successfully integrated the CoolGaN 600V hybrid-drain-embedded gate injection transistor (HD-GIT) technology into its in-house manufacturing.

Infineon has announced the OptiMOS 7 40V MOSFET family, its latest generation of power MOSFETs for automotive applications in a variety of lead-free and robust power packages.

Wireless charging has become an integral part of the modern battery-powered world, providing a streamlined and user-friendly experience for portable products across a wide range of industries.

Infineon and Schweizer are collaborating on ways to further increase the efficiency of chips based on silicon carbide (SiC).

Infineon Technologies and Hi-Lo Systems, a Taiwan based IC programming and testing company, have announced their partnership in the area of Trusted Platform Module (TPM) security chips. 

Infineon and Hi-Lo Systems have announced their partnership in the area of Trusted Platform Module (TPM) security chips.

Infineon is updating its expectations for revenues and Segment Result Margin for the running, second quarter as well as for the full 2023 fiscal year. This is primarily based on resilient business dynamics in its core automotive and industrial segments.

Infineon have announced its AIROC CYW20829 Bluetooth LE system on chip (SoC) is ready with the newly released Bluetooth 5.4 specification.