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Infineon Technologies AG

  • Am Campeon 1-12 85579 Neubiberg Bavaria
    85579 Neubiberg
    Germany
  • +49-89-234 28480
  • www.infineon.com

We make life easier, safer and greener

The world’s swelling population, more and more megacities and the rising demand for energy is prompting us to rethink many aspects of our modern lifestyle.

Semiconductor and system solutions from Infineon contribute to a better future – making our world easier, safer and greener. These tiny, barely visible electronic components have become an indispensable part of our daily lives. They help to feed regenerative energy into power grids with almost zero losses, tame power-hungry computers, safeguard the data flying through cyberspace and make our cars more energy-efficient.

Infineon Technologies AG Articles

Displaying 1 - 20 of 493
Power
9th April 2020
Ultra-small gate-driver IC with TDI for high density

Each time a power MOSFET is being turned on or off in a SMPS, parasitic inductances produce ground-shifts that may cause false triggering of the gate-driver IC. Infineon Technologies has added a device to its cost-effective and compact-size EiceDRIVER 1EDN TDI (truly differential inputs) 1-channel gate-driver family to prevent such consequences.

Latest
8th April 2020
Final regulatory approval for acquisition of Cypress

Infineon Technologies has announced that all necessary regulatory approvals have been received for its acquisition of Cypress Semiconductor. Infineon expects to close the transaction within five business days.

Design
2nd April 2020
Powerful 1,500VDC string inverter bring high capacity

First introduced at Intersolar Europe 2019, Sungrow now offers the SG250HX PV string inverter that features a high capacity of 250kW. On board it has customised EasyPACK 3B power modules from Infineon Technologies, equipped with the latest TRENCHSTOP and CoolSiC chip technologies.

Industries
1st April 2020
D²PAK packages added to CoolSiC Schottky diode family

Infineon Technologies has expanded its CoolSiC Schottky diode 1,200V portfolio by adding six devices in a D²PAK real 2-pin package. Using SMD packages, designs can be more compact and more cost effective.

Latest
31st March 2020
Manufacturer achieves three Honor Quality Awards

Infineon Technologies has achieved an impeccable quality record in its deliveries to Toyota's Hirose plant for the sixth consecutive year. For this, the car manufacturer has now awarded Infineon the plant's highest quality award, the Honor Quality Award, for the third time in a row. Infineon is the first non-Japanese semiconductor company to achieve this.

Artificial Intelligence
25th March 2020
Light innovation with artificial intelligence

The research project OpenLicht was launched in September 2016 and stands for the design of smart, customized light solutions based on open source and new materials. OpenLicht was funded by the German Ministry of Education and Research (BMBF), with the goal of enabling new forms of collaboration between science, business, maker and startup community.

Automotive
18th March 2020
Preparing for strong growth in mild hybrid vehicles

Infineon Technologies is expecting significant growth in hybrid vehicles 48V systems in the coming years and is expanding its portfolio of suitable power devices. The chip manufacturer is launching new packages for its 80V and 100V MOSFETs with OptiMOS 5 technology to meet the different requirements of different 48V applications.

5G
16th March 2020
5G ready eSIM turnkey solution for mobile devices

Infineon Technologies has extended its embedded SIM (eSIM) portfolio with the new OPTIGA Connect eSIM solution for mobile consumer devices. This solution fully supports all GSMA standards from 3G to 5G and securely authenticates the device to the subscribed carrier network of choice. 

IoT
3rd March 2020
Collaboration to strengthen IoT device identity

GMO GlobalSign and Infineon Technologies have announced a solution that secures, simplifies, and streamlines device enrolment into Microsoft Azure IoT Hub and IoT Hub Device Provisioning Service. The collaboration eases complex device identity integration challenges and delivers a proven path for IoT device security literally from chip to cloud.

Design
2nd March 2020
Embedded safety controller ASIL-D certified

Electro-mobility, advanced driver assistance systems, connected driving – the demand for functionally safe electrical and electronic systems in cars is increasing. Infineon Technologies’ second generation AURIX (TC3xx) microcontrollers are the embedded safety controllers certified for the highest automotive safety integrity level (ASIL D) according to the latest version of the ISO 26262 standard. 

Micros
27th February 2020
MCU brings flexibility to motion control engine

Infineon Technologies is releasing the new IMC300 motor controller series. It combines the iMOTION Motion Control Engine (MCE) with an additional microcontroller based on the Arm Cortex-M0 core. IMC300 complements the IMC100 series and aims at variable speed drives that require very high application flexibility. 

Power
20th February 2020
CoolSiC MOSFET 650V family offers high reliability

Infineon Technologies has continued to expand its comprehensive silicon carbide (SiC) product portfolio with MOSFET 650V devices. With the newly launched CoolSiC MOSFETs Infineon is addressing the growing demand for energy efficiency, power density, and robustness in a wide range of applications. Amongst them are server, telecom and industrial SMPS, solar energy systems, energy storage and battery formation, UPS, motor drives as well as EV-chargi...

Power
12th February 2020
Enabling the next level of ultra-high power-density designs

Building on superjunction technology innovations and more than 20 years of experience, Infineon Technologies has broadened its CoolMOS portfolio with the PFD7 product family combining performance with ease of use. The devices are suitable for ultrahigh power-density designs such as chargers and adapters as well as for low-power drives and specific lighting applications.

Power
10th February 2020
Source-down 25V power MOSFET in PQFN package

Infineon Technologies has announced that it is focusing on system innovation with enhancements on component level by addressing the challenges of modern power management designs. The Source Down is the new industry standard packaging concept. The first wave of power MOSFETs launched in this new package is the OptiMOS 25V in a PQFN 3.3x3.3mm.

Power
30th January 2020
Flip-chip production specifically for automotive applications

Infineon Technologies is taking the next step towards smallest power supply devices for automotive electronics. As first chipmaker, the company set up a dedicated production process for flip-chip packages that is fully aligned with the high-quality requirements of the automotive market. Infineon has launched the first respective product: the linear voltage regulator OPTIREG TLS715B0NAV50.

Analysis
28th January 2020
Partnership reduces system costs for inverters

The installed photovoltaic capacity is growing rapidly worldwide. Photovoltaic systems with a total output of around 600GW now supply clean and cost-effective electricity – replacing around 600 medium-sized coal-fired power plants. SMA Solar Technology (SMA) and Infineon Technologies have supported this growth trend with the latest generation of innovative silicon carbide (SiC)-based solar inverters. 

Events News
27th January 2020
The fast lane to smart and secure IoT devices

At this year’s embedded world, Infineon Technologies has announced that it will present easy-to-integrate technology for smart mobility, smart industry and smart lifestyle. Focussing on holistic system solutions, the Infineon booth will feature applications for automated driving and in-vehicle health monitoring, wireless charging, multicopters and drones as well as automotive and industrial gateways.

Cyber Security
20th January 2020
Enhanced user experience for contactless payments

Infineon Technologies’ new 40nm generation of security chip solutions – the SLC3x – is based on a design concept that provides performance and scalability for a vast array of smart card applications. Smart card manufacturers and payment solution providers will benefit from a family architecture based on the de-facto industry standard ARM, as well as innovative logistic concepts.

Power
9th January 2020
Half-bridge SOI driver offers integrated bootstrap diodes

Infineon Technologies has broadened its EiceDRIVER portfolio with the 650V half-bridge gate drivers based on Infineon’s silicon on insulator (SOI) technology. The products provide leading negative transient voltage immunity, monolithic integration of a real bootstrap diode, and superior latch-up immunity for MOSFET and IGBT based inverter applications.

Sensors
6th January 2020
3D image sensor designed for face authentication on smartphones

Reliable face authentication, improved photo functions and authentic augmented reality experiences: 3D depth sensors assume a key role in smartphones and for applications that rely on accurate 3D image data. Infineon Technologies has collaborated with software and 3D Time of Flight system specialist, pmdtechnologies to develop the world’s smallest and at the same time most powerful 3D image sensor, and is presenting it at CES in Las Vegas.

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