Infineon Technologies AG

Address:
Am Campeon 1-12
85579 Neubiberg
Bavaria


85579 Neubiberg
Germany

Phone: +49-89-234 28480

Web: www.infineon.com

We make life easier, safer and greener

The world’s swelling population, more and more megacities and the rising demand for energy is prompting us to rethink many aspects of our modern lifestyle.

Semiconductor and system solutions from Infineon contribute to a better future – making our world easier, safer and greener. These tiny, barely visible electronic components have become an indispensable part of our daily lives. They help to feed regenerative energy into power grids with almost zero losses, tame power-hungry computers, safeguard the data flying through cyberspace and make our cars more energy-efficient.


Infineon Technologies AG articles

Displaying 1 - 20 of 297

Utilising ANPC topology to boost system efficiency

Utilising ANPC topology to boost system efficiency
Compared with traditional three-level neutral-point-clamped topologies, the advanced neutral-point-clamped (ANPC) inverter design supports an even loss distribution between semiconductor devices. Infineon Technologies utilises the ANPC topology for its hybrid SiC and IGBT power module EasyPACK 2B in the 1,200V family. 
29th July 2019

Sensor brings high angle accuracy at low magnetic fields

Sensor brings high angle accuracy at low magnetic fields
For the Sensor+Test trade fair, Infineon Technologies is expanding its sensor portfolio by a new family of AMR-based angle sensors. XENSIV TLE5109A16 products address the need for very precise, fast and yet cost-efficient angle measurement at the highest functional safety levels in automotive and industrial applications.
28th June 2019

Photoacoustic spectroscopy miniaturises CO2 sensor

Photoacoustic spectroscopy miniaturises CO2 sensor
City dwellers often spend a large amount of their time indoors, either in an office, at school, or simply at home. Urbanised spaces, however, tend to trap and develop bad air quality as they get more insulated for energy efficiency purposes. The concentration of CO2 is an indicator for bad air quality. 
21st June 2019


Highly accurate digital Turbo MAP sensor launched

Highly accurate digital Turbo MAP sensor launched
At the Sensor+Test trade fair, Infineon Technologies is presenting the new XENSIV absolute pressure sensor series KP276. It addresses applications such as the measurement of manifold air pressure (MAP) in aspirated or turbo (Turbo MAP) diesel and gasoline engines as well as exhaust gas recirculation.
18th June 2019

Precise, safe and robust: Magnetic and pressure sensors at Sensor+Test

Precise, safe and robust: Magnetic and pressure sensors at Sensor+Test
  Infineon Technologies is presenting its latest sensors and solutions for intelligent mobility, the smart home, connected industry, robotics, and health and fitness at this year’s Sensor+Test. The exhibits and solutions are on view during the trade fair (25th to 27th June) at stand 429 in hall 1.
17th June 2019

European research project for more efficient semiconductors

European research project for more efficient semiconductors
The European cooperation project Power2Power has started. Over the coming three years, 43 partners from eight countries will research and develop innovative power semiconductors with more power density and energy efficiency. Power semiconductors are needed in all stages of energy conversion: generation, transmission, and use. 
5th June 2019

Infineon to acquire Cypress in drive for growth

Infineon to acquire Cypress in drive for growth
It has been announced that Infineon Technologies and Cypress Semiconductor have signed a definitive agreement under which Infineon will acquire Cypress for $23.85 per share in cash, corresponding to an enterprise value of €9bn. With the addition of Cypress, Infineon will consequently strengthen its focus on structural growth drivers and serve a broader range of applications.
3rd June 2019

Barometric pressure sensor provides low current consumption

Barometric pressure sensor provides low current consumption
Infineon Technologies has launched the XENSIV DPS368. The miniaturised digital barometric pressure sensor is capable of measuring both pressure and temperature. It offers an ultra high precision of ±2cm and a low current consumption for precise measurement of altitude, air flow and body movements. This makes the DPS368 suitable for mobile applications and wearable devices offering e.g. activity tracking and navigation.
30th May 2019

Embedded Vision Alliance awards image sensor as 'Product of the Year'

Embedded Vision Alliance awards image sensor as 'Product of the Year'
Smartphone cameras increasingly require 3D vision capabilities as differentiating factor. Hence, Infineon Technologies developed the REAL3 IRS2381C, a premier 3D imager sensor solution especially designed for the mobile device market. The Embedded Vision Alliance now awarded the 3D Time-of-Flight (ToF) single chip solution as 'Product of the Year' in the category 'Sensors'.
24th May 2019

Broad portfolio of CoolSic MOSFETs in discrete housing launched

Broad portfolio of CoolSic MOSFETs in discrete housing launched
Infineon Technologies enters high volume production of a comprehensive portfolio of 1,200V CoolSiC MOSFET devices. They are rated from 30-350mΩ and implemented into TO247-3 and TO247-4 housings. The expansion includes a surface mount device (SMD) portfolio and a 650V CoolSiC MOSFET product family, both to be launched soon.
17th May 2019

Stable coreless current sensors for industrial applications

Stable coreless current sensors for industrial applications
At this year’s PCIM trade fair, Infineon Technologies will launch a new family of current sensors and is presenting its first member. The family will consist of precise and stable coreless Hall sensors. They offer a high level of flexibility as customers can individually program product parameters such as the current range, the overcurrent threshold and the output mode.
7th May 2019

Three-phase inverter module IPM offers high power density

Three-phase inverter module IPM offers high power density
A new member has been added to the growing family of intelligent power modules (IPMs): CIPOS Tiny from Infineon Technologies. The three-phase inverter module is the newest generation of IPM to offer the highest power density for variable speed motor drives. By using the latest TRENCHSTOP IGBT6, it is possible to realise maximum efficiency with minimum footprint.
30th April 2019

High-efficiency, two-stage architecture power distribution

High-efficiency, two-stage architecture power distribution
A zero-voltage-switching (ZSC) switched capacitor converter has been introduced by Infineon Technologies. It features a two-stage architecture for 48V applications to power up CPUs, GPUs, SoCs, ASICs, and memory. Infineon’s full system concept for 48V architecture paves a way towards 99% of efficiency.
29th April 2019

Success in Japan with automotive semiconductors

Success in Japan with automotive semiconductors
According to the latest research from Strategy Analytics, Infineon Technologies increased its automotive business in Japan by almost 25% in 2018. It thus grew faster than any other of the top ten automotive semiconductor suppliers in the country. Japan accounts for approximately ten percent of global car production. 
23rd April 2019

Broad 12mm power module portfolio without base plate

Broad 12mm power module portfolio without base plate
It has been announced that Infineon Technologies has extended its Easy family to include a new package: Easy 3B. Together with the other Easy 1B and 2B packages, this comprises the broadest power module portfolio at 12mm height without base plate. Easy 3B is a well suited platform to extend current inverter designs to achieve higher power without changing much on the mechanical side.
15th April 2019

More space for innovation with expanded development site

More space for innovation with expanded development site
It has been announced that Infineon is hoping to strengthen its research and development efforts in the field of high-frequency components. To this end the Infineon Austria holding company DICE (Danube Integrated Circuit Engineering) in Linz will be provided with a new home.
8th April 2019

Power module designed for compact and scalable inverter designs

Power module designed for compact and scalable inverter designs
Infineon Technologies extents its large portfolio of high voltage devices with a new package: XHP 3. This is a new flexible IGBT module platform for high power applications in the voltage range from 3,3kV up to 6,5kV. The module allows for scalable designs with reliability and highest power density. Due to its symmetrical design with low stray inductance it offers significantly improved switching behaviour.
4th April 2019

Micro IPM adds IGBT based IM231 series for highest power density

Micro IPM adds IGBT based IM231 series for highest power density
Infineon Technologies is introducing its CIPOS Micro IM231 series, a family of 600V rated Intelligent Power Modules (IPM). It is qualified for harsh humid environments, passing 1,000 hours of high voltage, high temperature and high humidity reverse bias (HV H3TRB) stress testing. For this reason, the energy-efficient IPM suits power appliance motor drives particularly in circulator hydronic pumps, drain pumps for washing machines, dishwashers, and kitchen hoods.
1st April 2019

Voltage regulator solution for AI and 5G networking

Voltage regulator solution for AI and 5G networking
Extending its portfolio of high current system chipset solutions, Infineon Technologies has introduced a 16-phase digital PWM multiphase controller, the XDPE132G5C. The portfolio enables currents of 500 to 1,000A and higher for next generation CPUs, GPUs, FPGA and ASICs used in high-end artificial intelligence (AI) servers and 5G datacom applications.
25th March 2019

Integrated voltage regulator with Intel SVID and PMBus support

Integrated voltage regulator with Intel SVID and PMBus support
Power density is key in latest space constrained storage, netcom, servers and telecom designs. Infineon Technologies has introduced the newest member of its integrated point-of-load product family, the IR38164 DC-DC POL converter. Infineon's IR38x6x family offers either full SVID compatibility or 3-bit PVID flexibility. This makes it easy to design and support Intel CPU and chipset POL rails in Intel systems.
20th March 2019


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EMO Hannover 2019
16th September 2019
Germany Hannover
Women in Tech Festival 2019
17th September 2019
United Kingdom The Brewery, London
European Microwave Week 2019
29th September 2019
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