Infineon Technologies AG

We make life easier, safer and greener

The world’s swelling population, more and more megacities and the rising demand for energy is prompting us to rethink many aspects of our modern lifestyle.

Semiconductor and system solutions from Infineon contribute to a better future – making our world easier, safer and greener. These tiny, barely visible electronic components have become an indispensable part of our daily lives. They help to feed regenerative energy into power grids with almost zero losses, tame power-hungry computers, safeguard the data flying through cyberspace and make our cars more energy-efficient.

Infineon Technologies AG Articles

Displaying 1 - 20 of 585
14th May 2021
High density QDR-II+ SRAM for satellite image processing

Infineon Technologies has announced its next-generation 144-Mb Quad Data Rate II+ (QDR-II+) SRAM that is certified to the DLA Qualified Manufacturers List Class V (QML-V). QML-V is the highest quality and reliability standard certification for aerospace-grade ICs. This radiation-hardened (rad hard) 144-Mb QDR-II+ SRAM is a unique high-speed external cache memory ideal for radar, on-board data processing and networking applications in space.

10th May 2021
Infineon increases supply security for silicon carbide

Infineon Technologies has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy. The German semiconductor manufacturer has thus secured more base material for the growing demand for SiC-based products.

Events News
4th May 2021
Half bridge CoolGaN IPS modules target low-medium power

  Infineon introduces the 600 V CoolGaN half bridge integrated power stage (IPS), the IGI60F1414A1L for low to medium power applications

4th May 2021
Isolated EiceDRIVER 2L-SRC optimising system efficiency

Highest efficiency is a key requirement for today’s power electronics. Therefore, Infineon Technologies has introduced its latest isolated EiceDRIVER 2L-SRC Compact (1ED32xx) gate driver family in a compact form factor.

4th May 2021
Hybrid flyback controller delivers high power density

To meet the increasing demand for higher power density and energy efficiency, Infineon Technologies has expanded its XDP family by adding the first application-specific standard product based on an asymmetric half-bridge flyback topology.

4th May 2021
HybridPACK Drive CoolSiC released for automotive

Infineon Technologies has introduced a new automotive power module with CoolSiC MOSFET technology. At this year’s virtual PCIM trade show, Infineon will present the new HybridPACK Drive CoolSiC, a full-bridge module with 1,200V blocking voltage optimised for traction inverters in electric vehicles (EV).

News & Analysis
4th May 2021
Infineon revenues advance 3 % in Q2

Infineon revenues grew 3 % sequentially and 36 % year on year to $2.7bn in Q2. The company is forecasting revenues of between $2.6bn and $2.9bn in Q3.

30th April 2021
EasyDUAL CoolSiC MOSFET for increased power density

Infineon Technologies has upgraded the EasyDUAL CoolSiC MOSFET modules with a new aluminum nitride (AIN) ceramic. The devices come in half-bridge configuration with an on-state resistance (R DS(on)) of 11mΩ in an EasyDUAL 1B package and 6mΩ in an EasyDUAL 2B package.

23rd April 2021
Reference boards for rotary fridge compressor drives

Infineon Technologies has introduced two new reference boards designed for rotary refrigerator compressors supporting Infineon’s motto ‘From product thinking to system understanding’. Both boards are turnkey solutions for low power compressors that can be easily copied by customers to build final mass-production application boards.

23rd April 2021
EiceDRIVER X3 gate drivers with reinforced isolation

Infineon Technologies has expanded its easy-to-design EiceDRIVER X3 Compact (1ED31xx) and the highly flexible EiceDRIVER X3 Enhanced Analog (1ED34xx) and Digital (1ED38xx) gate driver families. Both families now offer variants with superior reinforced isolation for higher application safety and long operating life.

Events News
20th April 2021
Infineon at the Virtual Power Conference

Power semiconductors are the key to an energy-efficient world. New technologies such as silicon carbide (SiC) and gallium nitride (GaN) enable higher power efficiency, smaller form factors and lower weight. Silicon also plays a major role in many designs. Energy efficiency is the focus of the ‘Virtual Power Conference’, which will be available ‘live’ from May 4th to 6th, 2021.

19th April 2021
AEC-Q103 qualified XENSIV MEMS microphone for automotive

Infineon Technologies has announced the launch of the XENSIV IM67D130A. This new device combines the company’s expertise in the automotive industry with its technical knowledge in high-end MEMS microphones to address the need for high performance, low-noise MEMS microphones for automotive applications.

13th April 2021
600V CoolMOS S7 MOSFETs for static switching applications

Infineon Technologies has announced that it is enhancing the 600V CoolMOS S7 family with two new optimised devices for static switching applications: the industrial-grade CoolMOS S7 10mΩ and the automotive-grade CoolMOS S7A.

12th April 2021
Infineon repays outstanding Cypress acquisition financing

Infineon Technologies has successfully signed a $1.3bn US private placement of notes. The proceeds of the transaction will be used to repay existing US Dollar bank term loans related to the acquisition of Cypress Semiconductor Corporation.

8th April 2021
600V CoolMOS S7 family expanded with MOSFETs

In applications where MOSFETs are switched at low frequency, high-power product designs must meet several key characteristics: They have to minimise conduction losses, provide optimal thermal behavior, and enable more compact and lighter systems – all while maintaining the highest quality at a low cost.

29th March 2021
Higher current power diodes with lower on-state losses

Infineon Technologies has launched a new generation of power diodes. The new housingless diode family is designed for medium frequency resistance welding and high current rectifier applications. The devices meet the market requirements for higher forward current, low conduction losses and higher power cycling capability.

25th March 2021
High-reliability non-volatile SRAM launched

Infineon Technologies has announced the availability of its second-generation non-volatile SRAMs (nvSRAM). The new generation of devices are qualified for QML-Q and high-reliability industrial specifications to support demanding non-volatile code storage and data-logging applications in harsh environments, including aerospace and industrial applications.

22nd March 2021
Collaboration for efficient on-board electrical systems

Siemens Mobility and Infineon Technologies have jointly developed new auxiliary converters to improve the efficiency of on-board power systems using power semiconductors based on silicon carbide (SiC).

22nd March 2021
EiceDRIVER with bootstrap diodes for frequency switching

Infineon Technologies has broadened its EiceDRIVER portfolio with new 650V half-bridge and high and low side gate drivers. The new devices are based on the company’s unique silicon-on-insulator (SOI) technology. They provide leading negative VS transient voltage immunity and monolithic integration of real bootstrap diodes.

Cyber Security
22nd March 2021
TPM 2.0 software stack with security integration

To facilitate integration in Linux-based systems, Infineon Technologies has announced that it now provides its OPTIGA TPM 2.0 solution with a TSS host software implementing the latest FAPI standard. Infineon has developed the open-source software jointly with Intel Corporation and Fraunhofer Institute for Secure Information Technology SIT.

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