Infineon Technologies AG
We make life easier, safer and greener
The world’s swelling population, more and more megacities and the rising demand for energy is prompting us to rethink many aspects of our modern lifestyle.
Semiconductor and system solutions from Infineon contribute to a better future – making our world easier, safer and greener. These tiny, barely visible electronic components have become an indispensable part of our daily lives. They help to feed regenerative energy into power grids with almost zero losses, tame power-hungry computers, safeguard the data flying through cyberspace and make our cars more energy-efficient.
Infineon Technologies AG Articles
NOR Flash memory for space-grade FPGAs
Space-grade field-programmable gate arrays (FPGAs) require reliable, high-density non-volatile memories that contain their boot configurations. To address the growing need for high-reliability memories, Infineon has announced a high-density radiation-tolerant (RadTol) NOR Flash memory products qualified to MIL-PRF-38535’s QML-V flow (QML-V Equivalent). The QML-V flow is the highest quality and reliability standard certification for aerospac...
Single-stage flyback controllers for smart LED drivers
Cost-effective dimmable and intelligent LED systems are expected to increase the market share disproportionately in the coming years. Introducing the ICL8800, ICL8810 and ICL8820 single-stage flyback LED controllers for constant output voltages, Infineon Technologies has addressed the need of LED driver manufacturers in this regard.
Biometric smart cards with scalable manufacturability
Convenient Security: A research report by ABI Research has projected the market for biometric smart cards to be reaching 353 million pieces per year by 2025 globally as an optimistic scenario. Allowing card manufacturers to address this new growing market segment, Infineon Technologies and IDEX Biometrics ASA have announced a reference design for the next generation biometric smart card architecture.
Biometrics enables comms and contactless payment
Today, practically any everyday object can be enriched with smart functions to make life easier. Using system solutions from Infineon, Deed, a deep tech startup from Turin, Italy, has been able to create a screenless yet feature-rich wearable. The get bracelet interprets human gestures and uses biometric data to pick up a call or to make payments.
AIROC WiFi & Bluetooth combo chip brings reliable satnav
TomTom GO Discover, developed by TomTom is one of the quickest and most powerful satnavs on the market today. The satnav with its five, six and seven-inch display leverages the AIROC CYW43455 WiFi and Bluetooth combo chip from Infineon Technologies.
Under-display time-of-flight turnkey solution
The latest phone designs focus on solutions that allow a full-screen display and avoid the notch, punch-hole cameras, or bezels without compromising on quality or performance. Infineon Technologies together with its Time-of-Flight (ToF) partner pmdtechnologies and ArcSoft are developing a turnkey solution that allows a ToF camera to work under the display of commercial smartphones.
OptiMOS TOLG for improved TCoB robustness
With the innovative TO-Leadless (TOLL) package, Infineon now offers two new OptiMOS power MOSFET packages in the TOLx family: TOLG (TO-Leaded with Gullwing leads) and TOLT (TO-Leaded Top-side cooling). Together, the TOLx family offers very low R DS(on) and a high-current rating over 300A to increase system efficiency in high-power density designs.
NFC programming boosted for flexibility in LEDs
Reduced complexity together with increased functionality and efficiency are dominating the agenda of all lighting manufacturers. In this regard, Osram and Infineon Technologies have joined forces to enable Near Field Communication (NFC) programming for the industry.
EiceDRIVER 1EDB gate-driver IC family launched
Infineon Technologies has expanded its growing portfolio of single-channel gate-driver ICs. The new EiceDRIVER 1EDB family of single-channel gate-driver IC provides galvanic input-to-output isolation of 3kV rms (UL 1577) that ensures rugged ground-loop separation.
APEC 2021: Infineon showcases power solutions
Infineon Technologies has announced that it will highlight its range of power management solutions during the 2021 APEC Virtual Conference and Exposition from 14th to 17th June. With a device portfolio that spans silicon and wide bandgap (WBG) devices, engineers look to Infineon for solutions that balance performance, efficiency, reliability and cost. Infineon’s power solutions set the pace for innovations that make life easier, s...
600V CoolMOS PFD7 in Samsung’s new refrigerator
Infineon Technologies supplied Samsung Electronics with 600V CoolMOS PFD7 power devices to couple the highest energy efficiency with lowest audible noise. They have been integrated in Samsung’s brand new one-door fridge (RR23A2J3XWX, RR23A2G3WDX) and FDR (French Door Fridge: RF18A5101SR) inverterised refrigerator. Inverterisation is an emerging DC to AC conversion trend in contemporary inverter designs.
ModusToolbox machine learning enables TinyML for AIoT
The combination of AI and IoT, known as the Artificial Intelligence of Things (AIoT), provides machine learning capabilities in connected devices, enabling them to perform intelligent tasks. According to Markets and Markets, the AIoT market is expected to increase from $5.1bn in 2019 to $16.2bn by 2024, growing at a CAGR of 26%.
Infineon and Reality AI teach ADAS cars how to hear
Today's advanced driver assistance systems (ADAS) are based on cameras, radar or lidar. As a result, their target objects need to be within the line of sight to be recognised by the system. This, however, turns into a weakness when it comes to emergency vehicles – they can be heard much earlier than they can be seen and thus are invisible to ADAS for a longer time.
High density QDR-II+ SRAM for satellite image processing
Infineon Technologies has announced its next-generation 144-Mb Quad Data Rate II+ (QDR-II+) SRAM that is certified to the DLA Qualified Manufacturers List Class V (QML-V). QML-V is the highest quality and reliability standard certification for aerospace-grade ICs. This radiation-hardened (rad hard) 144-Mb QDR-II+ SRAM is a unique high-speed external cache memory ideal for radar, on-board data processing and networking applications in space.
Infineon increases supply security for silicon carbide
Infineon Technologies has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy. The German semiconductor manufacturer has thus secured more base material for the growing demand for SiC-based products.
Half bridge CoolGaN IPS modules target low-medium power
Infineon introduces the 600 V CoolGaN half bridge integrated power stage (IPS), the IGI60F1414A1L for low to medium power applications
Isolated EiceDRIVER 2L-SRC optimising system efficiency
Highest efficiency is a key requirement for today’s power electronics. Therefore, Infineon Technologies has introduced its latest isolated EiceDRIVER 2L-SRC Compact (1ED32xx) gate driver family in a compact form factor.
Hybrid flyback controller delivers high power density
To meet the increasing demand for higher power density and energy efficiency, Infineon Technologies has expanded its XDP family by adding the first application-specific standard product based on an asymmetric half-bridge flyback topology.
HybridPACK Drive CoolSiC released for automotive
Infineon Technologies has introduced a new automotive power module with CoolSiC MOSFET technology. At this year’s virtual PCIM trade show, Infineon will present the new HybridPACK Drive CoolSiC, a full-bridge module with 1,200V blocking voltage optimised for traction inverters in electric vehicles (EV).
Infineon revenues advance 3 % in Q2
Infineon revenues grew 3 % sequentially and 36 % year on year to $2.7bn in Q2. The company is forecasting revenues of between $2.6bn and $2.9bn in Q3.