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Infineon reinforces its SiC vision at PCIM 2024

13th June 2024
Harry Fowle

At PCIM 2024 on the Infineon booth, Electronic Specifier’s Harry Fowle got to speak with Peter Friedrichs, VP of SiC at Infineon, to learn about Infineon’s focus within the SiC market.

One of the big Infineon talking points at the stand was the company’s new range of packages for its previously announced second generation of CoolSiC MOSFET. With these new packages, which you can find here, Infineon reaffirms its current focus on the SiC industry.

Comments Friedrichs on Infineon’s current focuses: “Improved cost position is a big one for us, this is something that can in-turn result in far more attractive pricing.

“Reliability is always an on-going focus topic at Infineon, ensuring that SiC solutions are reliable in the long term in key industries like automotive is essential.

“Finally, packages are also key for Infineon, packages in combination with chips can unlock a whole other level of performance and reliability.”

Infineon looking ahead

Friedrichs also offered commentary on what he believes is next for the SiC market, and target areas for Infineon in the future. 

A continuation of existing topics such as renewable energy and e-mobility are going to remain as a staple of the SiC market for some time to come according to Friedrichs. Additionally, other newer areas will emerge as key markets, such as new solid state circuit breakers. “Solid state is certainly a focus area for the future, and something that us here at Infineon will be keeping close tabs on.”

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