Infineon Technologies AG
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We make life easier, safer and greener
The world’s swelling population, more and more megacities and the rising demand for energy is prompting us to rethink many aspects of our modern lifestyle.
Semiconductor and system solutions from Infineon contribute to a better future – making our world easier, safer and greener. These tiny, barely visible electronic components have become an indispensable part of our daily lives. They help to feed regenerative energy into power grids with almost zero losses, tame power-hungry computers, safeguard the data flying through cyberspace and make our cars more energy-efficient.
Infineon Technologies AG Articles
Infineon QDPAK and DDPAK registered as JEDEC standard
The trends toward higher power density and cost optimisation dominate the development goals of efficient high-power applications that create substantial value for segments such as electromobility. To push these boundaries, Infineon Technologies today announced it has successfully registered its QDPAK and DDPAK top-side cooling (TSC) packages, which are ideal for high-voltage MOSFETs as a JEDEC standard.
Pan-European research initiative PowerizeD launched
Over 100 representatives from 39 companies and 23 research institutions are meeting in Munich at the Campeon, headquarters of Infineon Technologies AG, for the kick-off of the European research initiative PowerizeD. They are focusing on intelligence in power electronics and thus want to contribute to the decarbonisation of European society and the protection of our climate.
Research for the "digital ear" of the future
Led by Infineon Austria, the European research project "Listen2Future" started with 27 partners from seven countries to develop new and smallest microphone and ultrasound sensors for examinations in industry and medicine. Precise mini hearing aids, fast infection controls for infants or wearable ultrasound patches have now become possible.
Infineon maintains leadership in MEMS microphone market and launches PDM microphone
For the third consecutive year, Infineon Technologies has successfully defended its market leading position as MEMS microphone supplier.
Infineon heads European MEMs research project
Infineon Austria is leading 27 partners from seven countries in Listen2Future, a new 30m Euro European research project to develop new and smallest microphone and ultrasound sensors for examinations in industry and medicine.
Infineon adopts its multilevel class D audio amplifier technology
Long-lasting music playback performance that comes in compact, cost-effective, and power-efficient designs, is indispensable, especially for battery-powered applications. Infineon Technologies AG recently introduced its latest generation of MERUS multilevel Class D audio amplifiers. Several ecosystem partners of Infineon are now ready to support customers with their design-in efforts. The company aims to boost the adoption of the new technology b...
Infineon offloads hi-rel DC-DC converter business
Infineon Technologies is selling its hybrid and custom board-based power products to Micross.
Infineon, Altia accelerate embedded display applications
Infineon Technologies and Altia have announced that Infineon’s TRAVEO T2G Cluster microcontroller (MCU) family will be enabled by the Altia CloudWare software platform for display applications in early 2023.
Infineon, Green Hills collaborate on automotive safety
Infineon Technologies and Green Hills Software will provide a complete ecosystem for the development and deployment of advanced safety applications for the automotive industry.
European collaborative project Power2Power successfully completed
The European collaboration project Power2Power has been successfully completed. Over the past three years, 43 partners from industry and research jointly developed novel power semiconductors with higher power density and energy efficiency.
Infineon at CES 2023: smart home, electromobility and IoT security
Infineon Technologies has announced that it will highlight the company’s contributions to mitigate climate change and enable digital transformation at CES 2023.
The new XMC7000 microcontrollers from Infineon
Infineon is adding the XMC7000 series to its microcontroller portfolio. The new MCU family includes a single- or a dual-core Arm Cortex-M7 core, both with Arm Cortex-M0+ support.
Infineon named CES 2023 ‘Innovation Awards Honouree’
Infineon Technologies has been named a CES 2023 ‘Innovation Awards Honouree’ for three products including its EXCELON F-RAM, XENSIV Connected Sensor Kit (CSK) and Smart Alarm System (SAS) for smart homes.
i-ToF imager boosts 3D camera system performance
Infineon in cooperation with pmdtechnologies is introducing the IRS2975C imager sensor, a performance-push evolution of the IRS2875C.
Infineon launches SLC26P security controller
Commercial production of integrated circuits using 28nm technology node began several years ago. As the process technology has matured, market demand for 28nm products has also increased. Although offering numerous advantages, security applications have not been among the main applications of this technology, thus far. Infineon Technologies is introducing SLC26P, the first security IC targeting high volume payment applications based on the future...
Infineon and TSMC to introduce RRAM technology
Infineon Technologies and TSMC announced the companies are preparing to introduce TSMC’s Resistive RAM (RRAM) non-volatile memory (NVM) technology into Infineon’s next generation AURIX microcontrollers (MCU).
Electronic passport security for the quantum computer era
Quantum computers could become a serious threat to the security of documents such as electronic passports before the present decade is over. New, quantum-secure encryption methods help protect stored biometric data.
Infineon's new collaboration on biometric payment cards
Infineon Technologies and Fingerprint Cards announced the signing of a joint development and commercialisation agreement of a plug-and-play turnkey solution for biometric payment smart cards. The goal of the cooperation is to make biometric smart card production as simple and easy as producing a standard dual interface payment card.
EasyPACK4B enables single module solution for 352 kW photovoltaic string inverter
Infineon Technologies has added EasyPACK 4B to its Easy power module family.
Power module achieves 352kW for string inverters
Infineon Technologies has added EasyPACK 4B to its industry-leading Easy power module family.