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EDA Solutions Limited

EDA Solutions Limited Articles

Displaying 21 - 31 of 31
Design
7th March 2007
Tanner to demonstrate multi-threaded analogue simulation with an integrated circuit and MEMS design suite running under Microsoft Vista at DATE

Tanner EDA will unveil a multi-threaded version of its SPICE analogue simulator T-Spice at DATE 2007. Its suite of analogue and mixed-signal integrated circuit and MEMS design tools is designed to run under Microsoft’s new Vista operating system which spans schematic capture (S-Edit), simulation (T-Spice), layout (L-Edit) and foundry compatible design verification (HiPer Verify). The new analogue simulator will not only offer higher performan...

Analysis
6th March 2007
MOSIS to unveil affordable access to 65nm wafer fab technologies at DATE 2007

At the upcoming DATE 2007 show, MOSIS, the multi-project wafer (MPW) service provider, will introduce low cost access to the latest 65nm wafer fabrication technologies from IBM, including the foundry’s low power and RF technologies. The MOSIS service is based upon multiple integrated circuit designs sharing each mask set and wafer. Costs are shared between users of the service, based upon the silicon area that each design occupies. This makes ...

Analysis
8th November 2006
IHP and Europractice collaborate to give access to high-speed SiGe:C BiCMOS processes

Users of Tanner EDA tools are to get economical access to an analogue and mixed-signal, 0.25 micron Silicon Germanium Carbon (SiGe:C) BiCMOS process through a new collaboration with IHP’s pilot line in Frankfurt (Oder). Europractice has developed design kits for Tanner EDA’s L-Edit family of integrated circuit layout tools to ensure compatibility of designs with their process.

Pending
14th September 2006
MOSIS deal with SEMPAC cuts packaging costs for custom ASICs

MOSIS, a provider of low-cost prototyping and small volume production services for custom ASICs, announces a strategic agreement with SEMPAC that will enable the company to offer customers a low-cost alternative to ceramic packages for VLSI circuits. The deal will give customers who use the MOSIS multi-project wafer (MPW) service access to QFN/MLP, QFP and SOIC/SSP packages from SEMPAC's Open-Pak product line. These pre-molded, air cavity package...

Analysis
7th August 2006
Peter Kaiser heads new Munich office for EDA Solutions

EDA Solutions, the exclusive European representative for Tanner EDA's analogue and mixed-signal IC/MEMS design tools, and for MOSIS’ MPW and small volume wafer fabrication services, has appointed Munich-based Peter Kaiser to head up its first overseas office.

Analysis
24th July 2006
Tanner EDA to demonstrate seamless integration and new features for analog and mixed-signal tools at 43rd Design Automation Conference (DAC)

Tanner EDA, which provides cost-effective and easy-to-use tools for analog and mixed-signal circuit design, today announced its analog and mixed-signal design tool suite, Tanner Tools 12.1, has been upgraded and tightly integrated for rapid design flow.

Analysis
20th July 2006
Royalty-free access to high-performance XAP 16-bit processors through MOSIS deal with Cambridge Consultants

MOSIS has partnered with Cambridge Consultants to offer customers royalty-free access to the XAP4 and XAP5 16-bit RISC processor cores - and - customers only have to pay 20% of the nominal license fee during prototype production, the balance of the fee not being due until devices go into volume production or are sold.

Design
4th July 2006
Custom design kits for X-FAB’s new fabs expand process choice for analogue and mixed-signal chip designers in a hurry

EDA Solutions, exclusive European representative for analogue and mixed-signal tool vendor Tanner EDA, has introduced a 14-day service for custom design kits so that users of the company’s chip layout tools can take advantage of the new 0.25, 0.18 and 0.15 micron processes that have become available since X-FAB’s recent merger with 1st Silicon, Malaysia's premier 200mm wafer foundry.

Analysis
15th May 2006
Two join EDA's customer support team

EDA Solutions, exclusive European agents for Tanner EDA tools and MOSIS multi-project wafer services, has added to its sales and technical support teams with two new staff appointments. This follows a doubling of its Tanner EDA business in Europe over the last 3 years.

Analysis
9th May 2006
New service gives easy low-cost access to 90nm chip process technology

Multi-project wafer services company MOSIS has teamed up with IBM¹s silicon foundry to offer 90nm chip process technology on a shared-wafer basis. The MPW service will give many companies that have previously found sub-micron silicon fabrication costs prohibitive access to these technologies for as little as 10% of the price of a dedicated wafer run.

Analysis
18th April 2006
EDA Solutions sponsors Austin in bid for Mini Challenge 2006 crown

EDA Solutions, exclusive European agent for chip design tool vendor, Tanner EDA, and multi-project wafer specialist, MOSIS, is sponsoring a driver in the UK Mini Challenge series of motor races this year.

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