Paul Double, Managing Director of EDA Solutions, said, “X-FAB will offer standard design kits for Tanner tools in the future but we wanted to give our customers early access to the extra processes now available through X-FAB so that they can choose the best one for each design. Our long experience with Tanner means that we can produce reliable kits in just two weeks.”
Tanner’s low cost, easy-to-use, schematic capture and IC layout tools for analogue and mixed signal design have been supported on X-FAB 1.0 to 0.35 micron processes for the last two years and dozens of designs have been processed by the fab. The addition of the new fab will give chip designers greater choice in selecting the optimum process for each device, including high density flash memory at 0.25um, an option for which there is growing demand. X-FAB’s manufacturing capacity is now around 700,000 200-mm equivalent wafers per year.