MOSIS to unveil affordable access to 65nm wafer fab technologies at DATE 2007

At the upcoming DATE 2007 show, MOSIS, the multi-project wafer (MPW) service provider, will introduce low cost access to the latest 65nm wafer fabrication technologies from IBM, including the foundry’s low power and RF technologies. The MOSIS service is based upon multiple integrated circuit designs sharing each mask set and wafer. Costs are shared between users of the service, based upon the silicon area that each design occupies. This makes even the most advanced technologies affordable for prototyping and low volume production, with costs just a small fraction of those that would be incurred through a dedicated wafer production run. The new IBM processes are ideal for high-speed, mixed-signal designs, particularly those aimed at wireless applications.