As with RO4360 laminates, RO4460 prepregs are ceramic-filled, thermoset materials reinforced by woven glass for excellent mechanical stability. The laminate and prepreg supports smaller size circuits with excellent thermal conductivity of 0.8 W/m-K for effective thermal management.
RoHS-compliant RO4360 laminate and RO4460 bondply materials offer low coefficient of thermal expansion (CTE) of 30 ppm/°C in the z-axis for reliable plated through holes (PTHs) in multilayer circuits.
With its high +280°C glass transition temperature (Tg), the RO4360/RO4460 laminate system processes like low-cost FR-4 circuit-board materials. In fact, RO4360 laminate and RO4460 prepreg can be used with epoxy-based materials for hybrid multilayer circuits that take advantage of the smaller circuit features possible with 6.15 Dk materials. RO4360 laminate and RO4460 prepreg materials support automated manufacturing techniques and standard processing approaches for miniature, high-performance multilayer circuits without the high costs and processing complexity associated with PTFE circuit-board materials.