Google has announced an extension of access to its Brillo operating system and Weave communication platform to its broader developer community. As such, TechNexion offers the PICO-IMX6UL System-on-Module (SoM) - the fitting hardware for this new operating system. The PICO Module is equipped with a Freescale i.MX6 UltraLite Processor and is a compact, ubiquitous computing SoM that is optimised for mobile Internet of Things (IoT) applications.
Connectivity is given by Gigabit Ethernet, WiFi (802.11ac) and Bluetooth 4.0. Using a pin compatible scalable platform that not only utilises the ‘Edison’ connector, but provides connectivity for sensors and low speed I/O (and also adds additional expansion possibilities for multi-media and connectivity), makes it well suited for a variety of projects.
Additionally the ‘DWARF’ platform eases prototyping and accelerates time to market by offering a complete platform - introducing a large number of ready to use sensors like 3d-accelerator, Gyroscope or altitude-meter and available I/Os to take advantage of today’s technology and communication challenges, giving TechNexion customers technology that can easily be expanded and implemented into Industry 4.0 applications. The schematics are freely available for the DWARF Carrier board.
Brillo is a lightweight OS for connected devices with a small footprint, based on Android, offering core services, developer kits and a developer console for an easy and quick start. Brillo is open source, and therefore, can be easily extended by engineers. Brillo uses Weave to allow easy communication with other Brillo devices or the cloud. With Brillo you can easily bring your devices to the cloud. Gather all the data and get the insights you need to make your application more stable and successful.