3.5” embedded SBC boosts performance at only 15W

23rd October 2014
Source: DFI
Posted By : Barney Scott
3.5” embedded SBC boosts performance at only 15W

The most advanced 3.5” SBC in its 4th generation Intel Core product line, DFI's U-series HU551 with BGA 1168 packaging technology features smart performance, immersive visuals and 15W TDP. Integrated in the processor, the enhanced Intel HD graphics GT series offers a 24% performance increase over its previous generation.

Multiple displays and rich media content mark a significant improvement in onboard graphics capability. HU551 features an LVDS port (48-bit, dual channel, resolution up to 1920x1200 at 60Hz), two DisplayPorts (resolution up to 3200x2000 at 60Hz), or two HDMI inputs (resolution up to 4096x2304 at 24Hz or 2560x1600 at 60Hz). The SBC takes advantage of Intel Core i3/i5/i7 mobile processor technologies that support a DDR3L SODIMM socket up to 8GB.

Connection capabilities are enhanced through flexible I/O, including two LAN ports, six USB ports, two SATA 3.0 ports with RAID 0/1, three COM ports, one LPC connector, one SMBus connector, 8-bit DI/O, and a 12VDC-in jack (default) or 4-pin power connector. A SIM card socket and two Mini PCIe slots which support 3G for efficient communication and expansion capabilities.

Measuring 146x102mm, the compact HU551 suits space-limited environments requiring flexible I/O and low power consumption, without compromising on performance. Potential applications of the SBC include industrial automation, in-vehicle computer, healthcare devices, kiosk, ATM and POS.

The U-series SoC-based platform utilises the upgraded Intel Active Management Technology 9.5 to reduce manageability cost and enable service providers to manage, repair and safeguard the networked computing assets.


You must be logged in to comment

Write a comment

No comments

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

CES 2018
9th January 2018
United States of America Las Vegas, Nevada
Developing wearable products: technology and opportunities
17th January 2018
United Kingdom Cocoon Networks, London
Smart Mobility Executive Forum
12th February 2018
Germany Berlin
embedded world 2018
27th February 2018
Germany Nuremberg
Industry 4.0 Summit 2018
28th February 2018
United Kingdom Manchester