Test & Measurement

Aeroflex Supports NTT DOCOMO’s Successful Launch of Xi™ LTE Network

24th March 2011
ES Admin
0
Aeroflex Limited, a wholly owned subsidiary of Aeroflex Holding Corp. (NYSE:ARX), announced today that it has worked closely with NTT DOCOMO, INC. to support the successful testing, rollout, and launch of their Xi LTE network.
Aeroflex provided a suite of test tools to support the development for one of the first LTE networks in the world. The DOCOMO Xi LTE network went live in Japan during December 2010. As a result of testing prior to the launch, Aeroflex and DOCOMO have successfully proven many key LTE features including 2x2 MIMO operation, mobility, and Cat 4 (150Mbps) data rates.

“Aeroflex began providing LTE test solutions to DOCOMO in 2007,” said Bob Vogel, president, Aeroflex Test Solutions. “We are proud to work with a leading edge cellular network operator with a long tradition of market leadership to help deploy a major new LTE network.”

About Aeroflex LTE Expertise

Aeroflex started delivery of LTE test systems in 2007, and now offers a complete range of end-to-end test systems that cover R&D, performance, and manufacturing test applications for LTE TDD and FDD network equipment and terminals.

The TM500 Test Mobile family is in use with almost every base station manufacturer across the world, and can be regarded as the de facto standard for eNodeB development and testing. EAST500 is the only network capacity test solution that incorporates the proven Aeroflex TM500 LTE air interface.

The Aeroflex 7100 LTE Digital Radio Test Set is a complete one-box test system providing all the tools required for the measurement and characterization of user equipment (UE) chip sets and mobile terminals to 3GPP LTE standards, including optional signal fading simulation.

Aeroflex has engineers working in centers around the world on its LTE and LTE-Advanced test systems, to support the current and next generation of networks and devices.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier