The TK5P60W5 (with ID = 4.5A and RDS(ON) = 0.99Ω) is housed in the smallest package in the series, a DPAK (TO-252) package, and achieves a diode reverse recovery time of typically 65ns. The input capacitance (Ciss) of 370pF and a QG of just 11.5nC, support efficient switching operation.
The TK62N60W5 (RDS(ON) = 0.045Ω) is the largest MOSFET in the series, is housed in a 3-pin TO-247 package and supports the highest power output of ID = 61.8A. It achieves a typical diode trr of 170ns, Ciss of 6,500pF and QG of 205nC.
The DTMOS IV-H chips are made using Toshiba’s Deep Trench technology that delivers lower RDS(ON) at higher temperatures, compared to conventional super junction MOSFETs. It also offers reduced turn-off switching losses than previous technology generations. The combination of smaller increases in RDS(ON) at high temperatures and reduced diode trrprovides higher efficiency and assists designers in minimising system size.
Samples of both devices are currently available, with TK62N60W5 already entering mass production and TK5P60W5 is scheduled to enter mass production in October 2015.