WaSP by Amphenol Aerospace Operations is a microminiature range designed for high-volume harsh environment applications that prioritise size, weight, power, and cost (SWaP-C).
Based on the TERRAPIN SCE2 series, the WaSP microminiature range takes the TERRAPIN’s compact, rugged, lightweight design and optimises it even further for high-volume SWaP-C applications.
WaSP is an ideal interconnect for high-volume, low-cost SWaP-C applications such as UAVs and drone swarm technologies, UGVs, communications systems, and other applications that must strictly adhere to rigorous size, weight, power, and cost profiles.
The WaSP microminiature circular connector features a simplified interface designed for ease of use, quick mating, and affordability. The WaSP utilises a lightweight aluminium shell and locking ring that only adds minimal weight, perfect for applications that prioritise lightweight designs.
The WaSP series is designed to operate in a range of harsh environments.
It features IP67 environmental sealing, a passivation anti-corrosion layer, can operate in a temperature range of -55°C (-67°F) to +85°C (+185°F), and can withstand 48 hours of salt spray.
Its environmental durability makes it optimal for a wide range of smaller platforms operating on land, in the air, or at sea.
The WaSP connector range is in stock at authorised distributor DigiKey.
