Micros

Silicon Designs introduces Low-G series of MEMS DC accelerometer chips

1st December 2021
Kiera Sowery

Silicon Designs has announced the global market launch of its Model 1525 Low-G Series of MEMS DC accelerometer chips, with stock quantities now available for immediate customer shipment.

The Silicon Designs Model 1525 Low-G series is designed to offer reliable, accurate, and repeatable low-frequency (including seismic) vibration and acceleration measurements within a variety of inertial- and industrial-grade applications, and particularly so, where high-repeatability, premium performance, low noise, and maximum stability are required.

The key distinguishing features of the Model 1525 Low-G series, among comparable industry models, include its highly favourable price-for-performance ratio, excellent in-run bias stability, zero cross-coupling by design, and Allan Variances from 5µg.

With availability in five unique full-scale ranges, each MEMS DC accelerometer chip within the Model 1525 Low-G series incorporates one of Silicon Designs' own high-performance sense elements, together with a ±4.0V differential analog output stage, internal temperature sensor, and integral sense amplifier. The MEMS DC sense element and internal components of the Model 1525 Low-G Series are housed together within a hermetically sealed, Nitrogen damped, 20-pin JLCC surface mount package (US Export Classification ECCN 7A994) which measures just 0.35 square inches.

Each model 1525 Low-G Series MEMS DC accelerometer chip is designed to be relatively insensitive to wide temperature changes and gradients, including over its standard operating temperature range of -40° C to +85° C. Each device is further marked on its top and bottom surfaces with a serial number for traceability. A calibration test sheet is also supplied with each unit, showing the MEMS DC accelerometer chip's measured bias, scale factor, linearity, operating current, and frequency response performance values.

Featured products

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2022 Electronic Specifier