Memory
Highly reliable range of 3D NAND Flash-based storage solutions
Speciality memory, storage and hybrid solutions provider, SMART Modular Technologies, a subsidiary of SMART Global Holdings, has introduced its N200 line of SATA products. With burst speed and low power consumption, the N200 family is an ideal economic option for NAS/SAN storage systems, x86 server-storage appliances, distributed scale-out servers, telecom and networking routers and switches, industrial control, and printers.
Secure USB stick for industrial data protection
Manufacturer of industrial-grade flash memory solutions, Swissbit, has launched of PU-50n DP, a durable USB stick with internal AES-256-bit encryption, access protection and optional ROM/WORM function. The USB 3.1 mass storage device is available with eight, 16, 32 or 64GB (MLC) and four, eight, 16 or 32 GB (pSLC).
How memory improvements will expand embedded storage
With mobile product shipments, dominated by smartphones, continuing to account for a significant amount of the non-volatile memory (NVM) market, suppliers and standardisation organisations are working hard to ensure that next-generation NVMs keep up with the demands placed upon them. Author: Axel Stoermann, Toshiba Memory Europe
Storage SSDs at embedded world 2019
At embedded world 2019, Toshiba Memory Europe will be exhibiting, where they will highlight the Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. Toshiba will also demonstrate two new solid state drives (SSDs). All of these innovations are based on their 96-layer, BiCS FLASH 3D flash memory.
Memory card enabled security at embedded world
Manufacturer of industrial-grade flash memory solutions, Swissbit, will be highlighting its security solutions at embedded world, which will be taking place from 26th to 28th February 2019 in Nuremberg, Germany, in Hall 1 Booth # 1-534.
Embedded flash memory enables faster performance for smartphones
Toshiba has started sampling the 128GB version of the Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. The new line-up utilises the company’s 96-layer BiCS FLASH 3D flash memory and is available in three capacities: 128GB, 256GB and 512GB. With high speed read/write performance and low power consumption, the new devices are suitable for applications such as mobile devices, smartphones, tablets, and augmented/virtua...
FPGAs powered by high-performance GDDR6 memory
Memory and storage solutions provider, Micron Technology, has announced that its GDDR6 memory, Micron's fastest and most powerful graphics memory, will be the high-performance memory of choice supporting Achronix's next-generation stand-alone FPGA products built on TSMC seven nanometre process technology.
Single package PCIe with 96-layer 3D Flash memory
The introduction of the fourth generation of Toshiba Memory’s single package ball grid array (BGA) solid state drive (SSD) BG4 series was announced at CES 2019. Toshiba Memory’s new line-up of ultra-compact NVMe SSDs places both the flash and an all-new controller into one package, bringing design flexibility to ultra-thin PC notebooks, embedded systems and server boot in data centres.
SSDs are based on QLC 3D-NAND architecture
With the 660p series Intel is launching the first SSDs with QLC 3D-NAND-architecture on the market. They are characterised by a very high storage density and large capacities. The solid state drives in M.2 form factor with PCIe and NVMe are available with 512GB, 1TB and 2TB storage space from Rutronik UK.
16TB enterprise capacity hard disk drives
A new series of enterprise capacity hard disk drives has been announced by Toshiba Electronics Europe with the MG08 Series. The series is a large capacity 16TB Conventional Magnetic Recording (CMR) HDD. The product has 33% more capacity than today’s widely adopted 12TB drives, and 14% more capacity than prior 14TB models.