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Storage SSDs at embedded world 2019

30th January 2019
Alex Lynn

At embedded world 2019, Toshiba Memory Europe will be exhibiting, where they will highlight the Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. Toshiba will also demonstrate two new solid state drives (SSDs). All of these innovations are based on their 96-layer, BiCS FLASH 3D flash memory.

The new UFS flash memory is already sampling and will be available in three capacities: 128, 256 and 512GB. With rapid read/write performance and low power consumption, the new devices are intended for applications such as mobile devices, smartphones, tablets, and augmented/virtual reality systems. The new devices integrate 96-layer BiCS FLASH 3D flash memory and a controller in a JEDEC-standard 11.5x13mm package. The controller performs error correction, wear levelling, logical-to-physical address translation, and bad-block management for simplified system development.

Supporting the most challenging applications in the automotive sector including infotainment, wireless communication and ADAS, Toshiba will be showcasing extended temperature range embedded NAND memory products that are compliant with JEDEC UFS Ver. 2.1. With five different capacities including 16, 32, 64, 128 and 256GB, the rugged devices will support a wide variety of automotive applications.

The new products meet AEC-Q100 Grade 2 requirements, support the wide temperature range of -40 to +105°C, and offer the enhanced reliability capabilities that are required by increasingly complex automotive applications. 

The 96-layer, BiCS FLASH 3D flash memory is also at the core of Toshiba’s XG6 series of SSDs, reportedly the first drives to use this three-bit-per-cell (triple-level cell, TLC) technology. The versatile XG6 NVMe SSDs offer capacities up to 1TB with an optimised controller design that delivers performance and power efficiency.

Targeting client PC, high-performance mobile, embedded, gaming and datacentre applications, The XG6 SSDs the way for these users to upgrade to 96-layer technology. Available in an M.2 2280 single-sided form factor, they support PCI Express Generation 3x4 lane and NVM Express revision 1.3a. Due to their optimised SoCs, the sequential write performance of the XG6 series leads the industry. 

Also on show on the booth will be the fourth generation of Toshiba’s BG4 series single package ball grid array (BGA) SSDs. The ultra-compact NVMe SSDs include the flash and a brand new controller into a single compact package, bringing flexibility to designers of ultra-thin PC notebooks, embedded systems and server boot systems in data centres. As the densest client SSD by volumetric measurements, the BG4 series offers increased capacity up to 1,024GB (1TB), with the 512GB version having a profile of just 1.3mm.

The new devices are expected to replace SATA SSDs in notebooks and PCs due to their small size, reduced power consumption and four-fold performance increase. 

Visitors to Toshiba’s booth at embedded world will be able to engage with experts to discuss technical details of the new products.

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