ICES 300 COM Express Core 2 Duo for Quick Time-To-Market Solutions

The ICES 300 COM Express module utilizes the new COM Express standard for small form factors to reduce time-to-market, decrease development cost and minimise risk. This concept enables the engineer to focus entirely on system I/O development without altering the entire system board layout, thus greatly reducing the total engineering time, cost and risk.

Increased Bandwidth: Since the bandwidth of legacy peripheral such as PCI-X and AGP no longer satisfy the requirements of today's business application, the COM methodology became the widely accepted industrial standard. COM Express products such as the ICES 300 enable developers to implement the new peripherals with increased bandwidth and to take the advantage of performance gain from CPU and chipsets, such as PCIe and SATA.

Perfect for Large and Digital Display: Integrated with Intel Extreme Graphics 2 technology, the ICES 300 COM Express supports 1 x PCI Express x16 for superb graphic display through the carried board. It also supports other display types include LFP, LVDS, and wide screen up to 1920 x 1200.

ICEB 8050 Evaluation Carried Board: The high performance ICES 300 COM Express Module is compatible with ICEB 8050 evaluation carrier board, which supports 3 x SATA, 8 x USB 2.0 and 5 x PCIe x1 Lanes through the carried board.