Murata type 2FR combines Wi-Fi 6, bluetooth LE 5.4 & IEEE 802.15.4

Murata type 2FR combines Wi-Fi 6, bluetooth LE 5.4 & IEEE 802.15.4 Murata type 2FR combines Wi-Fi 6, bluetooth LE 5.4 & IEEE 802.15.4

Rutronik expands its wireless portfolio with the Murata Type 2FR, a highly integrated tri-radio module based on the NXP RW612. The compact module combines dual-band Wi-Fi 6, Bluetooth LE 5.4 and IEEE 802.15.4 in a hostless architecture with integrated ArmCortex-M33 MCU and flash memory – ideal for industrial IoT edge devices, smart factory connectivity and Matter-enabled systems

The Murata Type 2FR integrates complete wireless connectivity for modern IoT and industrial applications into an ultra-compact LGA module measuring just 12.0 × 11.0 × 1.55mm. It is based on the NXP RW612 wireless MCU featuring an integrated 260MHz Arm Cortex-M33 processor, 1.2 MB SRAM and 16 MB flash memory. This enables the module to run applications in a hostless architecture, significantly reducing development effort and system complexity.

The tri-radio concept combines dual-band Wi-Fi 6 in the 2.4 and 5GHz bands, Bluetooth LE 5.4 and IEEE 802.15.4, enabling simultaneous support for modern IoT protocols such as Matter over Wi-Fi, Thread and Ethernet. Thanks to its high interoperability, the module is particularly suitable for connected industrial and building automation systems.

In addition to wireless connectivity, the module provides a comprehensive peripheral and security concept. Up to 64 GPIOs are available alongside numerous interfaces including USB 2.0 OTG, Ethernet, SPI, I²C, UART, SDIO 3.0 and ADC/DAC functionality. Integrated security features such as NXP EdgeLock, TrustZone-M, hardware root of trust and secure boot mechanisms support deployment in security-critical industrial and IoT applications.

With support for energy-efficient Wi-Fi 6, Bluetooth LE Long Range and IEEE 802.15.4, the module is ideally suited for scalable and power-optimised edge designs. The extended operating temperature ranges from -40 to +85 °C also enables deployment in demanding industrial environments.

Benefits at a glance:

  • Tri-radio connectivity with Wi-Fi 6, Bluetooth LE 5.4 and IEEE 802.15.4
  • Hostless architecture with integrated 260MHz Arm Cortex-M33
  • Integrated 1.2MB SRAM and 16 MB flash memory
  • Support for Matter over Wi-Fi, Thread and Ethernet
  • Dual-band Wi-Fi 6 for high data rates and stable connectivity
  • Advanced security features including NXP EdgeLock and TrustZone-M
  • Up to 64 GPIOs and multiple industrial interfaces
  • Ultra-compact footprint of only 12.0 × 11.0 × 1.55
  • Extended operating temperature range from -40 to +85 °C
  • Optimised for industrial IoT and Edge applications

Application examples:

  • Industrial automation
  • Smart factory and industrial IoT
  • Edge computing devices
  • Matter-enabled smart building systems
  • Machine-to-machine communication
  • Intelligent gateways and HMI systems
  • Connected sensors and actuators
  • Energy and building management systems

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