Pending

M/A-COM Technology Solutions - Two Front End Integrated Circuits Integrated front end ICs for mid-band and high-band MoCA applications, are compatible with Entropic Communications Chipsets

26th July 2011
ES Admin
0

M/A-COM Technology Solutions introduced today two new Front End Integrated Circuits (FEICs). The XZ1003-QT and XZ1004-QT are fully integrated, monolithic, FEICs for Multi Media over Coax Alliance (MoCA) mid-band and high-band RF applications. Both devices are fully compatible with Entropic Communications c.Link MoCA RF transceivers.

Packaged in an industry-standard 3mm,16 lead QFN package, these integrated circuits operate from a single 3.3 Volt supply. The ICs include a high linearity transmit amplifier, SPDT switch, power detector, digital attenuators bias and digital control circuitry. The integrated bias circuit stabilizes transmit amplifier performance over temperature and process variation with an optional bias adjustment.

Existing Front-End solutions require a 5 Volt amplifier in the transmit path which drives the need for an expensive voltage regulator. The XZ1003-QT and XZ1004-QT eliminate the need for a regulator whilst still meeting all MoCA 1.0 & 1.1 specifications.
Key applications for these devices are MoCA enabled customer premises equipment such as Home Gateways, Routers, Ethernet-to-Coax bridges, Network Attached Storage, and Set-Top-Boxes. These devices are also qualified for MoCA infrastructure applications, such as drop amplifiers, and Optical Network Terminals.
M/A-COM Tech’s FEICs simplify MoCA RF implementation,” said Graham Board, Product Manager. “Integrating key RF functions along with bias and control logic into a single 3mm QFN, reduces real estate requirements, speeds up development cycles, and reduces system costs.”
Engineering samples and production devices are available today from stock. Final datasheets and additional product information can be obtained from the M/A-COM Tech website at www.macomtech.com.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier