Industrial, medical, communications, telecomms and PC applications are among those in which the devices are suitable for. Featuring programmable read or write burst lengths, all of the devices are lead (Pb)- and halogen-free. Initiated at the end of the burst sequence, an auto pre-charge function provides a self-timed row. The devices also feature auto or self-refresh functions and a programmable mode register, allowing the system to choose modes which will maximise performance.
Designed to increase efficiency and extend battery life in compact portable devices, Alliance Memory’s mobile low-power DDRs feature a power consumption from 1.7-1.95V. Available in 256Mb, 512Mb, 1Gb and 2Gb, the devices are offered in 8x9mm 60 ball and 8x13mm 90 ball FPBGA packages.
The high-speed CMOS DDR3 SDRAMs, which are available 78-ball and 96-ball FBGA packages, are offered in 1, 2, and 4Gb. Available in commercial (0 to +85°C), industrial (-40 to +95°C), and automotive (-40 to +105°C) temperature ranges, the devices are widely applicable. The devices also feature a synchronous interface and are offered in 128M x 8, 256M x 8, 512M x 8, 64M x 16, 128M x 16 and 256M x 16 configurations. Featuring a clock rate of 1600MHz, the devices operate from a single +1.5V power supply.
Offered in 64, 128, 256 and 512Mb, the DDR SDRAMs operate within an industrial temperature range of -40 to +85°C. With a synchronous interface, the devices are internally configured as four banks of 1M, 2M, 4M, or 8M words x 16-bits. The devices, which operate from a single +2.5V (±0.2V) power supply, feature a clock rate of 200MHz. The devices are available in the 66-pin TSOP II package with a 0.65mm pin pitch.
The DDR2 SDRAMs, which are offered in 512Mb and 1Gb, can be internally configured as four banks of 8M words x 16-bits and eight banks of 8M x 16-bits and 16M x 8-bits. Available in 60-ball 8x10x1.2mm and 84-ball 8×12.5×1.2mm FBGA packages, the devices feature a synchronous interface and a clock rate of 400MHz and data rate of 800Mbps/pin. The devices operate from a single +1.8V (±0.1V) power supply and are offered in commercial (0 to +85°C), industrial (-40 to +95°C), and automotive (-40 to +105°C) temperature ranges.
Available in 64, 128 and 256M, the CMOS synchronous SDRAMs are offered with x32 devices in the 90-ball 8x13x1.2mm TFBGA and 86-pin 0.4″ plastic TSOP II packages. The 2M x 32, 4M x 32 and 8M x 32 devices, which operate from a single +3.3V (±0.3V) power supply, feature fast access time from clock down to 5.4ns. A commercial temperature range of 0 to +70°C and clock rate of 133MHz are offered by the 256M SDRAMs, while an industrial temperature range from -40 to +85°C and a higher clock rate of 166MHz are offered by the the 64 and 128M devices.