The S71KL512SC0 HyperFlash and HyperRAM Multi-Chip Package (MCP) from Cypress Semiconductor is available at Mouser Electronics. This memory subsystem solution combines high-speed NOR flash memory for fast-boot and instant-on with a self-refresh DRAM for expanded scratchpad memory in a reduced footprint, low-pin-count package that suits space-constrained and cost-optimised embedded designs.
The HyperFlash and HyperRAM MCP is based on Cypress’ HyperBus interface, which enables faster systems with quicker response times and a richer user experience.
The device features 512Mbits of HyperFlash and 64Mbits of HyperRAM, and is the optimum multi-package solution for designers looking to get a full high-performance memory subsystem with 70% fewer pins and a 77% smaller footprint compared to existing SDRAM and Quad SPI solutions.
The device is housed in a 24-ball, FBGA package that shares a common footprint with discrete HyperFlash and HyperRAM products.
A single-pad layout and common footprint enables engineers to support either a discrete device or the HyperFlash and HyperRAM MCP, offering the flexibility to change the design at any point in the product lifecycle without affecting the overall board layout, which saves valuable development time and minimizes cost.
Target applications of the S71KL512SC0 device include communications equipment, industrial applications, and other high-performance Internet of Things (IoT) products.